Electroless Copper IC Substrates Market Size, Competition and Demand Analysis Report #Insights

Publication ID:

MRRPB5#56

Publication Date:

March 2, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Computing & Electronics [2]

Semiconductors [3]

Copper [4]

Description:

Electroless copper refers to a process of depositing a layer of copper onto a substrate without using an external electrical current. This process is also called autocatalytic plating, because the reaction is self-sustaining once it has been initiated. The electroless copper process is widely used in the electronics industry to create printed circuit boards (PCBs), and IC substrates.

IC (Integrated Circuit) substrates are thin, flat plates of insulating material, typically made of ceramic or plastic, on which electronic circuits are etched or deposited. The substrate serves as a base for the ICs and provides electrical connections between them.

The electroless copper process involves several steps. First, the substrate is cleaned and activated with a solution that removes any oxide layer and creates a surface that is conducive to copper deposition. Then, the substrate is immersed in a solution containing copper ions and a reducing agent. The reducing agent initiates the deposition of copper onto the substrate, which continues until the desired thickness is achieved.

The advantage of electroless copper deposition over electroplating (which uses an external electrical current to deposit copper) is that it can coat irregular or non-conductive surfaces, such as ceramic or plastic substrates, without requiring a conductive seed layer. This makes it an ideal process for creating IC substrates, which are often made of ceramic.

Electroless copper deposition can also provide a very uniform and consistent copper layer, which is important for creating high-quality electronic circuits. The process is relatively simple and cost-effective, making it a popular choice in the electronics industry.

As IC packaging substrates move toward finer features, semi-additive processing (SAP) becomes more important, which requires uniform thickness and repeatable etch characteristics across the panel. The high-polish electroless copper plating system enables users to reliably cover microvias while minimizing surface copper deposition for enhanced etch capabilities.

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Market Overview

The global Electroless Copper for IC Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Electroless Copper for IC Substrates is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Electroless Copper for IC Substrates is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Electroless Copper for IC Substrates include DuPont, Atotech, Sharretts Plating, SIMMTECH Graphics, Uyemura, MacDermid Alpha Electronics Solutions, Shinko Electric, ICAPE GROUP and ECI Technology, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Electroless Copper for IC Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electroless Copper for IC Substrates.
The Electroless Copper for IC Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Electroless Copper for IC Substrates market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electroless Copper for IC Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.

By Company

听听 DuPont
听听 Atotech
听听 Sharretts Plating
听听 SIMMTECH Graphics
听听 Uyemura
听听 MacDermid Alpha Electronics Solutions
听听 Shinko Electric
听听 ICAPE GROUP
听听 ECI Technology
听听 JX Nippon Mining & Metals

Segment by Type

听听 Horizontal Electroless Copper
听听 Vertical Electroless Copper

Segment by Application

听听 PCB
听听 IC Substrate
听听 Semiconductor Wafer
听听 Others

Production by Region

听听 North America
听听 Europe
听听 China
听听 Japan
听听 South Korea

Consumption by Region
听听 North America
听听听听 U.S.
听听听听 Canada
听听 Europe
听听听听 Germany
听听听听 France
听听听听 U.K.
听听听听 Italy
听听听听 Russia
听听 Asia-Pacific
听听听听 China
听听听听 Japan
听听听听 South Korea
听听听听 China Taiwan
听听听听 Southeast Asia
听听听听 India
听听 Latin America
听听听听 Mexico
听听听听 Brazil

Core Chapters

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electroless Copper for IC Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electroless Copper for IC Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electroless Copper for IC Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Electroless Copper for IC Substrates Market Overview
1.1 Product Definition
1.2 Electroless Copper for IC Substrates Segment by Type
1.2.1 Global Electroless Copper for IC Substrates Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Horizontal Electroless Copper
1.2.3 Vertical Electroless Copper
1.3 Electroless Copper for IC Substrates Segment by Application
1.3.1 Global Electroless Copper for IC Substrates Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 PCB
1.3.3 IC Substrate
1.3.4 Semiconductor Wafer
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Electroless Copper for IC Substrates Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Electroless Copper for IC Substrates Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Electroless Copper for IC Substrates Production Estimates and Forecasts (2018-2029)
1.4.4 Global Electroless Copper for IC Substrates Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electroless Copper for IC Substrates Production Market Share by Manufacturers (2018-2023)
2.2 Global Electroless Copper for IC Substrates Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Electroless Copper for IC Substrates, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Electroless Copper for IC Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Electroless Copper for IC Substrates Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Electroless Copper for IC Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electroless Copper for IC Substrates, Product Offered and Application
2.8 Global Key Manufacturers of Electroless Copper for IC Substrates, Date of Enter into This Industry
2.9 Electroless Copper for IC Substrates Market Competitive Situation and Trends
2.9.1 Electroless Copper for IC Substrates Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electroless Copper for IC Substrates Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electroless Copper for IC Substrates Production by Region
3.1 Global Electroless Copper for IC Substrates Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Electroless Copper for IC Substrates Production Value by Region (2018-2029)
3.2.1 Global Electroless Copper for IC Substrates Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Electroless Copper for IC Substrates by Region (2024-2029)
3.3 Global Electroless Copper for IC Substrates Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Electroless Copper for IC Substrates Production by Region (2018-2029)
3.4.1 Global Electroless Copper for IC Substrates Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Electroless Copper for IC Substrates by Region (2024-2029)
3.5 Global Electroless Copper for IC Substrates Market Price Analysis by Region (2018-2023)
3.6 Global Electroless Copper for IC Substrates Production and Value, Year-over-Year Growth
3.6.1 North America Electroless Copper for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Electroless Copper for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Electroless Copper for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Electroless Copper for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Electroless Copper for IC Substrates Production Value Estimates and Forecasts (2018-2029)
4 Electroless Copper for IC Substrates Consumption by Region
4.1 Global Electroless Copper for IC Substrates Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Electroless Copper for IC Substrates Consumption by Region (2018-2029)
4.2.1 Global Electroless Copper for IC Substrates Consumption by Region (2018-2023)
4.2.2 Global Electroless Copper for IC Substrates Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Electroless Copper for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Electroless Copper for IC Substrates Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electroless Copper for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Electroless Copper for IC Substrates Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electroless Copper for IC Substrates Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Electroless Copper for IC Substrates Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electroless Copper for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Electroless Copper for IC Substrates Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Electroless Copper for IC Substrates Production by Type (2018-2029)
5.1.1 Global Electroless Copper for IC Substrates Production by Type (2018-2023)
5.1.2 Global Electroless Copper for IC Substrates Production by Type (2024-2029)
5.1.3 Global Electroless Copper for IC Substrates Production Market Share by Type (2018-2029)
5.2 Global Electroless Copper for IC Substrates Production Value by Type (2018-2029)
5.2.1 Global Electroless Copper for IC Substrates Production Value by Type (2018-2023)
5.2.2 Global Electroless Copper for IC Substrates Production Value by Type (2024-2029)
5.2.3 Global Electroless Copper for IC Substrates Production Value Market Share by Type (2018-2029)
5.3 Global Electroless Copper for IC Substrates Price by Type (2018-2029)
6 Segment by Application
6.1 Global Electroless Copper for IC Substrates Production by Application (2018-2029)
6.1.1 Global Electroless Copper for IC Substrates Production by Application (2018-2023)
6.1.2 Global Electroless Copper for IC Substrates Production by Application (2024-2029)
6.1.3 Global Electroless Copper for IC Substrates Production Market Share by Application (2018-2029)
6.2 Global Electroless Copper for IC Substrates Production Value by Application (2018-2029)
6.2.1 Global Electroless Copper for IC Substrates Production Value by Application (2018-2023)
6.2.2 Global Electroless Copper for IC Substrates Production Value by Application (2024-2029)
6.2.3 Global Electroless Copper for IC Substrates Production Value Market Share by Application (2018-2029)
6.3 Global Electroless Copper for IC Substrates Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DuPont
7.1.1 DuPont Electroless Copper for IC Substrates Corporation Information
7.1.2 DuPont Electroless Copper for IC Substrates Product Portfolio
7.1.3 DuPont Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DuPont Main Business and Markets Served
7.1.5 DuPont Recent Developments/Updates
7.2 Atotech
7.2.1 Atotech Electroless Copper for IC Substrates Corporation Information
7.2.2 Atotech Electroless Copper for IC Substrates Product Portfolio
7.2.3 Atotech Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Atotech Main Business and Markets Served
7.2.5 Atotech Recent Developments/Updates
7.3 Sharretts Plating
7.3.1 Sharretts Plating Electroless Copper for IC Substrates Corporation Information
7.3.2 Sharretts Plating Electroless Copper for IC Substrates Product Portfolio
7.3.3 Sharretts Plating Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Sharretts Plating Main Business and Markets Served
7.3.5 Sharretts Plating Recent Developments/Updates
7.4 SIMMTECH Graphics
7.4.1 SIMMTECH Graphics Electroless Copper for IC Substrates Corporation Information
7.4.2 SIMMTECH Graphics Electroless Copper for IC Substrates Product Portfolio
7.4.3 SIMMTECH Graphics Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.4.4 SIMMTECH Graphics Main Business and Markets Served
7.4.5 SIMMTECH Graphics Recent Developments/Updates
7.5 Uyemura
7.5.1 Uyemura Electroless Copper for IC Substrates Corporation Information
7.5.2 Uyemura Electroless Copper for IC Substrates Product Portfolio
7.5.3 Uyemura Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Uyemura Main Business and Markets Served
7.5.5 Uyemura Recent Developments/Updates
7.6 MacDermid Alpha Electronics Solutions
7.6.1 MacDermid Alpha Electronics Solutions Electroless Copper for IC Substrates Corporation Information
7.6.2 MacDermid Alpha Electronics Solutions Electroless Copper for IC Substrates Product Portfolio
7.6.3 MacDermid Alpha Electronics Solutions Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.6.4 MacDermid Alpha Electronics Solutions Main Business and Markets Served
7.6.5 MacDermid Alpha Electronics Solutions Recent Developments/Updates
7.7 Shinko Electric
7.7.1 Shinko Electric Electroless Copper for IC Substrates Corporation Information
7.7.2 Shinko Electric Electroless Copper for IC Substrates Product Portfolio
7.7.3 Shinko Electric Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Shinko Electric Main Business and Markets Served
7.7.5 Shinko Electric Recent Developments/Updates
7.8 ICAPE GROUP
7.8.1 ICAPE GROUP Electroless Copper for IC Substrates Corporation Information
7.8.2 ICAPE GROUP Electroless Copper for IC Substrates Product Portfolio
7.8.3 ICAPE GROUP Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.8.4 ICAPE GROUP Main Business and Markets Served
7.7.5 ICAPE GROUP Recent Developments/Updates
7.9 ECI Technology
7.9.1 ECI Technology Electroless Copper for IC Substrates Corporation Information
7.9.2 ECI Technology Electroless Copper for IC Substrates Product Portfolio
7.9.3 ECI Technology Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.9.4 ECI Technology Main Business and Markets Served
7.9.5 ECI Technology Recent Developments/Updates
7.10 JX Nippon Mining & Metals
7.10.1 JX Nippon Mining & Metals Electroless Copper for IC Substrates Corporation Information
7.10.2 JX Nippon Mining & Metals Electroless Copper for IC Substrates Product Portfolio
7.10.3 JX Nippon Mining & Metals Electroless Copper for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.10.4 JX Nippon Mining & Metals Main Business and Markets Served
7.10.5 JX Nippon Mining & Metals Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electroless Copper for IC Substrates Industry Chain Analysis
8.2 Electroless Copper for IC Substrates Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electroless Copper for IC Substrates Production Mode & Process
8.4 Electroless Copper for IC Substrates Sales and Marketing
8.4.1 Electroless Copper for IC Substrates Sales Channels
8.4.2 Electroless Copper for IC Substrates Distributors
8.5 Electroless Copper for IC Substrates Customers
9 Electroless Copper for IC Substrates Market Dynamics
9.1 Electroless Copper for IC Substrates Industry Trends
9.2 Electroless Copper for IC Substrates Market Drivers
9.3 Electroless Copper for IC Substrates Market Challenges
9.4 Electroless Copper for IC Substrates Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

DuPont
Atotech
Sharretts Plating
SIMMTECH Graphics
Uyemura
MacDermid Alpha Electronics Solutions
Shinko Electric
ICAPE GROUP
ECI Technology
JX Nippon Mining & Metals

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