Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
The global market for Electronic Board Level Underfill and Encapsulation Material was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Electronic Board Level Underfill and Encapsulation Material, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Electronic Board Level Underfill and Encapsulation Material by region & country, by Type, and by Application.
The Electronic Board Level Underfill and Encapsulation Material market size, estimations, and forecasts are provided in terms of sales volume (K MT) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Board Level Underfill and Encapsulation Material.
Market Segmentation
By Company
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
Segment by Type:
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Segment by Application
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Electronic Board Level Underfill and Encapsulation Material manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Electronic Board Level Underfill and Encapsulation Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Electronic Board Level Underfill and Encapsulation Material in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Electronic Board Level Underfill and Encapsulation Material Product Introduction
1.2 Global Electronic Board Level Underfill and Encapsulation Material Market Size Forecast
1.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Value (2019-2030)
1.2.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume (2019-2030)
1.2.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Price (2019-2030)
1.3 Electronic Board Level Underfill and Encapsulation Material Market Trends & Drivers
1.3.1 Electronic Board Level Underfill and Encapsulation Material Industry Trends
1.3.2 Electronic Board Level Underfill and Encapsulation Material Market Drivers & Opportunity
1.3.3 Electronic Board Level Underfill and Encapsulation Material Market Challenges
1.3.4 Electronic Board Level Underfill and Encapsulation Material Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Electronic Board Level Underfill and Encapsulation Material Players Revenue Ranking (2023)
2.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue by Company (2019-2024)
2.3 Global Electronic Board Level Underfill and Encapsulation Material Players Sales Volume Ranking (2023)
2.4 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Company Players (2019-2024)
2.5 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Company (2019-2024)
2.6 Key Manufacturers Electronic Board Level Underfill and Encapsulation Material Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Electronic Board Level Underfill and Encapsulation Material Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Electronic Board Level Underfill and Encapsulation Material
2.9 Electronic Board Level Underfill and Encapsulation Material Market Competitive Analysis
2.9.1 Electronic Board Level Underfill and Encapsulation Material Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Electronic Board Level Underfill and Encapsulation Material Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Electronic Board Level Underfill and Encapsulation Material as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 No Flow Underfill
3.1.2 Capillary Underfill
3.1.3 Molded Underfill
3.1.4 Wafer level Underfill
3.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Type
3.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Value, by Type (2019-2030)
3.2.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Value, by Type (%) (2019-2030)
3.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Type
3.3.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume, by Type (2019-2030)
3.3.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume, by Type (%) (2019-2030)
3.4 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Semiconductor Electronics Device
4.1.2 Aviation & Aerospace
4.1.3 Medical Devices
4.1.4 Others
4.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Application
4.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Value, by Application (2019-2030)
4.2.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Value, by Application (%) (2019-2030)
4.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Application
4.3.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume, by Application (2019-2030)
4.3.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume, by Application (%) (2019-2030)
4.4 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Region
5.1.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Region (2019-2024)
5.1.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Region (2025-2030)
5.1.4 Global Electronic Board Level Underfill and Encapsulation Material Sales Value by Region (%), (2019-2030)
5.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Region
5.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Region (2019-2024)
5.2.3 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Region (2025-2030)
5.2.4 Global Electronic Board Level Underfill and Encapsulation Material Sales Volume by Region (%), (2019-2030)
5.3 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
5.4.2 North America Electronic Board Level Underfill and Encapsulation Material Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
5.5.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
5.6.2 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
5.7.2 South America Electronic Board Level Underfill and Encapsulation Material Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
5.8.2 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Electronic Board Level Underfill and Encapsulation Material Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Electronic Board Level Underfill and Encapsulation Material Sales Value
6.2.1 Key Countries/Regions Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.2.2 Key Countries/Regions Electronic Board Level Underfill and Encapsulation Material Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.3.2 United States Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.4.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.5.2 China Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.5.3 China Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.6.2 Japan Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.7.2 South Korea Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.8.2 Southeast Asia Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Electronic Board Level Underfill and Encapsulation Material Sales Value, 2019-2030
6.9.2 India Electronic Board Level Underfill and Encapsulation Material Sales Value by Type (%), 2023 VS 2030
6.9.3 India Electronic Board Level Underfill and Encapsulation Material Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Fuller
7.1.1 Fuller Company Information
7.1.2 Fuller Introduction and Business Overview
7.1.3 Fuller Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Fuller Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.1.5 Fuller Recent Development
7.2 Masterbond
7.2.1 Masterbond Company Information
7.2.2 Masterbond Introduction and Business Overview
7.2.3 Masterbond Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Masterbond Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.2.5 Masterbond Recent Development
7.3 Zymet
7.3.1 Zymet Company Information
7.3.2 Zymet Introduction and Business Overview
7.3.3 Zymet Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Zymet Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.3.5 Zymet Recent Development
7.4 Namics
7.4.1 Namics Company Information
7.4.2 Namics Introduction and Business Overview
7.4.3 Namics Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Namics Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.4.5 Namics Recent Development
7.5 Epoxy Technology
7.5.1 Epoxy Technology Company Information
7.5.2 Epoxy Technology Introduction and Business Overview
7.5.3 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.5.5 Epoxy Technology Recent Development
7.6 Yincae Advanced Materials
7.6.1 Yincae Advanced Materials Company Information
7.6.2 Yincae Advanced Materials Introduction and Business Overview
7.6.3 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.6.5 Yincae Advanced Materials Recent Development
7.7 Henkel
7.7.1 Henkel Company Information
7.7.2 Henkel Introduction and Business Overview
7.7.3 Henkel Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Henkel Electronic Board Level Underfill and Encapsulation Material Product Offerings
7.7.5 Henkel Recent Development
8 Industry Chain Analysis
8.1 Electronic Board Level Underfill and Encapsulation Material Industrial Chain
8.2 Electronic Board Level Underfill and Encapsulation Material Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Electronic Board Level Underfill and Encapsulation Material Sales Model
8.5.2 Sales Channel
8.5.3 Electronic Board Level Underfill and Encapsulation Material Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
听
听
*If Applicable.
