Fan-out Wafer Level Package - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB511246952

Publication Date:

November 18, 2024

Pages:

108

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
The global market for Fan-out Wafer Level Package was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Fan-out Wafer Level Package, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Fan-out Wafer Level Package by region & country, by Type, and by Application.
The Fan-out Wafer Level Package market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-out Wafer Level Package.
Market Segmentation
By Company
ASE
Amkor Technology
Deca Technology
Huatian Technology
Infineon
JCAP
Nepes
Spil
Stats ChipPAC
TSMC
Freescale
NANIUM
Taiwan Semiconductor Manufacturing
Segment by Type:
200mm Wafers
300mm Wafers
450mm Wafers
Others
Segment by Application
Electronics & Semiconductor
Communication Engineering
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Fan-out Wafer Level Package manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Fan-out Wafer Level Package in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Fan-out Wafer Level Package in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 Market Overview
1.1 Fan-out Wafer Level Package Product Introduction
1.2 Global Fan-out Wafer Level Package Market Size Forecast
1.3 Fan-out Wafer Level Package Market Trends & Drivers
1.3.1 Fan-out Wafer Level Package Industry Trends
1.3.2 Fan-out Wafer Level Package Market Drivers & Opportunity
1.3.3 Fan-out Wafer Level Package Market Challenges
1.3.4 Fan-out Wafer Level Package Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Fan-out Wafer Level Package Players Revenue Ranking (2023)
2.2 Global Fan-out Wafer Level Package Revenue by Company (2019-2024)
2.3 Key Companies Fan-out Wafer Level Package Manufacturing Base Distribution and Headquarters
2.4 Key Companies Fan-out Wafer Level Package Product Offered
2.5 Key Companies Time to Begin Mass Production of Fan-out Wafer Level Package
2.6 Fan-out Wafer Level Package Market Competitive Analysis
2.6.1 Fan-out Wafer Level Package Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Fan-out Wafer Level Package Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Fan-out Wafer Level Package as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 200mm Wafers
3.1.2 300mm Wafers
3.1.3 450mm Wafers
3.1.4 Others
3.2 Global Fan-out Wafer Level Package Sales Value by Type
3.2.1 Global Fan-out Wafer Level Package Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Fan-out Wafer Level Package Sales Value, by Type (2019-2030)
3.2.3 Global Fan-out Wafer Level Package Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Electronics & Semiconductor
4.1.2 Communication Engineering
4.1.3 Others
4.2 Global Fan-out Wafer Level Package Sales Value by Application
4.2.1 Global Fan-out Wafer Level Package Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Fan-out Wafer Level Package Sales Value, by Application (2019-2030)
4.2.3 Global Fan-out Wafer Level Package Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Fan-out Wafer Level Package Sales Value by Region
5.1.1 Global Fan-out Wafer Level Package Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Fan-out Wafer Level Package Sales Value by Region (2019-2024)
5.1.3 Global Fan-out Wafer Level Package Sales Value by Region (2025-2030)
5.1.4 Global Fan-out Wafer Level Package Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Fan-out Wafer Level Package Sales Value, 2019-2030
5.2.2 North America Fan-out Wafer Level Package Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Fan-out Wafer Level Package Sales Value, 2019-2030
5.3.2 Europe Fan-out Wafer Level Package Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Fan-out Wafer Level Package Sales Value, 2019-2030
5.4.2 Asia Pacific Fan-out Wafer Level Package Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Fan-out Wafer Level Package Sales Value, 2019-2030
5.5.2 South America Fan-out Wafer Level Package Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Fan-out Wafer Level Package Sales Value, 2019-2030
5.6.2 Middle East & Africa Fan-out Wafer Level Package Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Fan-out Wafer Level Package Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Fan-out Wafer Level Package Sales Value
6.3 United States
6.3.1 United States Fan-out Wafer Level Package Sales Value, 2019-2030
6.3.2 United States Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Fan-out Wafer Level Package Sales Value, 2019-2030
6.4.2 Europe Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Fan-out Wafer Level Package Sales Value, 2019-2030
6.5.2 China Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.5.3 China Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Fan-out Wafer Level Package Sales Value, 2019-2030
6.6.2 Japan Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Fan-out Wafer Level Package Sales Value, 2019-2030
6.7.2 South Korea Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Fan-out Wafer Level Package Sales Value, 2019-2030
6.8.2 Southeast Asia Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Fan-out Wafer Level Package Sales Value, 2019-2030
6.9.2 India Fan-out Wafer Level Package Sales Value by Type (%), 2023 VS 2030
6.9.3 India Fan-out Wafer Level Package Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE
7.1.1 ASE Profile
7.1.2 ASE Main Business
7.1.3 ASE Fan-out Wafer Level Package Products, Services and Solutions
7.1.4 ASE Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Profile
7.2.2 Amkor Technology Main Business
7.2.3 Amkor Technology Fan-out Wafer Level Package Products, Services and Solutions
7.2.4 Amkor Technology Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.2.5 Amkor Technology Recent Developments
7.3 Deca Technology
7.3.1 Deca Technology Profile
7.3.2 Deca Technology Main Business
7.3.3 Deca Technology Fan-out Wafer Level Package Products, Services and Solutions
7.3.4 Deca Technology Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.3.5 Huatian Technology Recent Developments
7.4 Huatian Technology
7.4.1 Huatian Technology Profile
7.4.2 Huatian Technology Main Business
7.4.3 Huatian Technology Fan-out Wafer Level Package Products, Services and Solutions
7.4.4 Huatian Technology Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.4.5 Huatian Technology Recent Developments
7.5 Infineon
7.5.1 Infineon Profile
7.5.2 Infineon Main Business
7.5.3 Infineon Fan-out Wafer Level Package Products, Services and Solutions
7.5.4 Infineon Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.5.5 Infineon Recent Developments
7.6 JCAP
7.6.1 JCAP Profile
7.6.2 JCAP Main Business
7.6.3 JCAP Fan-out Wafer Level Package Products, Services and Solutions
7.6.4 JCAP Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.6.5 JCAP Recent Developments
7.7 Nepes
7.7.1 Nepes Profile
7.7.2 Nepes Main Business
7.7.3 Nepes Fan-out Wafer Level Package Products, Services and Solutions
7.7.4 Nepes Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.7.5 Nepes Recent Developments
7.8 Spil
7.8.1 Spil Profile
7.8.2 Spil Main Business
7.8.3 Spil Fan-out Wafer Level Package Products, Services and Solutions
7.8.4 Spil Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.8.5 Spil Recent Developments
7.9 Stats ChipPAC
7.9.1 Stats ChipPAC Profile
7.9.2 Stats ChipPAC Main Business
7.9.3 Stats ChipPAC Fan-out Wafer Level Package Products, Services and Solutions
7.9.4 Stats ChipPAC Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.9.5 Stats ChipPAC Recent Developments
7.10 TSMC
7.10.1 TSMC Profile
7.10.2 TSMC Main Business
7.10.3 TSMC Fan-out Wafer Level Package Products, Services and Solutions
7.10.4 TSMC Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.10.5 TSMC Recent Developments
7.11 Freescale
7.11.1 Freescale Profile
7.11.2 Freescale Main Business
7.11.3 Freescale Fan-out Wafer Level Package Products, Services and Solutions
7.11.4 Freescale Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.11.5 Freescale Recent Developments
7.12 NANIUM
7.12.1 NANIUM Profile
7.12.2 NANIUM Main Business
7.12.3 NANIUM Fan-out Wafer Level Package Products, Services and Solutions
7.12.4 NANIUM Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.12.5 NANIUM Recent Developments
7.13 Taiwan Semiconductor Manufacturing
7.13.1 Taiwan Semiconductor Manufacturing Profile
7.13.2 Taiwan Semiconductor Manufacturing Main Business
7.13.3 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Products, Services and Solutions
7.13.4 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Revenue (US$ Million) & (2019-2024)
7.13.5 Taiwan Semiconductor Manufacturing Recent Developments
8 Industry Chain Analysis
8.1 Fan-out Wafer Level Package Industrial Chain
8.2 Fan-out Wafer Level Package Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Fan-out Wafer Level Package Sales Model
8.5.2 Sales Channel
8.5.3 Fan-out Wafer Level Package Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

ASE
Amkor Technology
Deca Technology
Huatian Technology
Infineon
JCAP
Nepes
Spil
Stats ChipPAC
TSMC
Freescale
NANIUM
Taiwan Semiconductor Manufacturing

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