Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.
The global market for Flip Chip Ball Grid Array (FCBGA) was estimated to be worth US$ 4369 million in 2023 and is forecast to a readjusted size of US$ 6448.7 million by 2030 with a CAGR of 5.6% during the forecast period 2024-2030
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Flip Chip Ball Grid Array (FCBGA), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Flip Chip Ball Grid Array (FCBGA) by region & country, by Type, and by Application.
The Flip Chip Ball Grid Array (FCBGA) market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Ball Grid Array (FCBGA).
Market Segmentation
By Company
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
础罢锛哠
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China
Segment by Type:
Below 8 Layer
8-20 Layer
Others
Segment by Application
CPU
ASIC
GPU
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Flip Chip Ball Grid Array (FCBGA) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Flip Chip Ball Grid Array (FCBGA) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Flip Chip Ball Grid Array (FCBGA) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Flip Chip Ball Grid Array (FCBGA) Product Introduction
1.2 Global Flip Chip Ball Grid Array (FCBGA) Market Size Forecast
1.2.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Value (2019-2030)
1.2.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume (2019-2030)
1.2.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Price (2019-2030)
1.3 Flip Chip Ball Grid Array (FCBGA) Market Trends & Drivers
1.3.1 Flip Chip Ball Grid Array (FCBGA) Industry Trends
1.3.2 Flip Chip Ball Grid Array (FCBGA) Market Drivers & Opportunity
1.3.3 Flip Chip Ball Grid Array (FCBGA) Market Challenges
1.3.4 Flip Chip Ball Grid Array (FCBGA) Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Flip Chip Ball Grid Array (FCBGA) Players Revenue Ranking (2023)
2.2 Global Flip Chip Ball Grid Array (FCBGA) Revenue by Company (2019-2024)
2.3 Global Flip Chip Ball Grid Array (FCBGA) Players Sales Volume Ranking (2023)
2.4 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Company Players (2019-2024)
2.5 Global Flip Chip Ball Grid Array (FCBGA) Average Price by Company (2019-2024)
2.6 Key Manufacturers Flip Chip Ball Grid Array (FCBGA) Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Flip Chip Ball Grid Array (FCBGA) Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Flip Chip Ball Grid Array (FCBGA)
2.9 Flip Chip Ball Grid Array (FCBGA) Market Competitive Analysis
2.9.1 Flip Chip Ball Grid Array (FCBGA) Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Flip Chip Ball Grid Array (FCBGA) Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Flip Chip Ball Grid Array (FCBGA) as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Below 8 Layer
3.1.2 8-20 Layer
3.1.3 Others
3.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Type
3.2.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Value, by Type (2019-2030)
3.2.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Value, by Type (%) (2019-2030)
3.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Type
3.3.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume, by Type (2019-2030)
3.3.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume, by Type (%) (2019-2030)
3.4 Global Flip Chip Ball Grid Array (FCBGA) Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 CPU
4.1.2 ASIC
4.1.3 GPU
4.1.4 Others
4.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Application
4.2.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Value, by Application (2019-2030)
4.2.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Value, by Application (%) (2019-2030)
4.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Application
4.3.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume, by Application (2019-2030)
4.3.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume, by Application (%) (2019-2030)
4.4 Global Flip Chip Ball Grid Array (FCBGA) Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Region
5.1.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Region (2019-2024)
5.1.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Region (2025-2030)
5.1.4 Global Flip Chip Ball Grid Array (FCBGA) Sales Value by Region (%), (2019-2030)
5.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Region
5.2.1 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Region (2019-2024)
5.2.3 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Region (2025-2030)
5.2.4 Global Flip Chip Ball Grid Array (FCBGA) Sales Volume by Region (%), (2019-2030)
5.3 Global Flip Chip Ball Grid Array (FCBGA) Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
5.4.2 North America Flip Chip Ball Grid Array (FCBGA) Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
5.5.2 Europe Flip Chip Ball Grid Array (FCBGA) Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
5.6.2 Asia Pacific Flip Chip Ball Grid Array (FCBGA) Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
5.7.2 South America Flip Chip Ball Grid Array (FCBGA) Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
5.8.2 Middle East & Africa Flip Chip Ball Grid Array (FCBGA) Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Flip Chip Ball Grid Array (FCBGA) Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Flip Chip Ball Grid Array (FCBGA) Sales Value
6.2.1 Key Countries/Regions Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.2.2 Key Countries/Regions Flip Chip Ball Grid Array (FCBGA) Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.3.2 United States Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.4.2 Europe Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.5.2 China Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.5.3 China Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.6.2 Japan Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.7.2 South Korea Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.8.2 Southeast Asia Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Flip Chip Ball Grid Array (FCBGA) Sales Value, 2019-2030
6.9.2 India Flip Chip Ball Grid Array (FCBGA) Sales Value by Type (%), 2023 VS 2030
6.9.3 India Flip Chip Ball Grid Array (FCBGA) Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Unimicron
7.1.1 Unimicron Company Information
7.1.2 Unimicron Introduction and Business Overview
7.1.3 Unimicron Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Unimicron Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.1.5 Unimicron Recent Development
7.2 Ibiden
7.2.1 Ibiden Company Information
7.2.2 Ibiden Introduction and Business Overview
7.2.3 Ibiden Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Ibiden Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.2.5 Ibiden Recent Development
7.3 Samsung Electro-Mechanics
7.3.1 Samsung Electro-Mechanics Company Information
7.3.2 Samsung Electro-Mechanics Introduction and Business Overview
7.3.3 Samsung Electro-Mechanics Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Samsung Electro-Mechanics Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.3.5 Samsung Electro-Mechanics Recent Development
7.4 Amkor Technology
7.4.1 Amkor Technology Company Information
7.4.2 Amkor Technology Introduction and Business Overview
7.4.3 Amkor Technology Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Amkor Technology Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.4.5 Amkor Technology Recent Development
7.5 Fujitsu
7.5.1 Fujitsu Company Information
7.5.2 Fujitsu Introduction and Business Overview
7.5.3 Fujitsu Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Fujitsu Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.5.5 Fujitsu Recent Development
7.6 TOPPAN INC
7.6.1 TOPPAN INC Company Information
7.6.2 TOPPAN INC Introduction and Business Overview
7.6.3 TOPPAN INC Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.6.4 TOPPAN INC Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.6.5 TOPPAN INC Recent Development
7.7 Shinko Electric
7.7.1 Shinko Electric Company Information
7.7.2 Shinko Electric Introduction and Business Overview
7.7.3 Shinko Electric Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Shinko Electric Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.7.5 Shinko Electric Recent Development
7.8 Nan Ya PCB Corporation
7.8.1 Nan Ya PCB Corporation Company Information
7.8.2 Nan Ya PCB Corporation Introduction and Business Overview
7.8.3 Nan Ya PCB Corporation Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Nan Ya PCB Corporation Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.8.5 Nan Ya PCB Corporation Recent Development
7.9 础罢锛哠
7.9.1 础罢锛哠 Company Information
7.9.2 础罢锛哠 Introduction and Business Overview
7.9.3 础罢锛哠 Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.9.4 础罢锛哠 Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.9.5 础罢锛哠 Recent Development
7.10 Daeduck Electronics
7.10.1 Daeduck Electronics Company Information
7.10.2 Daeduck Electronics Introduction and Business Overview
7.10.3 Daeduck Electronics Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Daeduck Electronics Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.10.5 Daeduck Electronics Recent Development
7.11 Kinsus Interconnect Technology
7.11.1 Kinsus Interconnect Technology Company Information
7.11.2 Kinsus Interconnect Technology Introduction and Business Overview
7.11.3 Kinsus Interconnect Technology Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Kinsus Interconnect Technology Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.11.5 Kinsus Interconnect Technology Recent Development
7.12 Zdtco
7.12.1 Zdtco Company Information
7.12.2 Zdtco Introduction and Business Overview
7.12.3 Zdtco Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Zdtco Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.12.5 Zdtco Recent Development
7.13 KYOCERA
7.13.1 KYOCERA Company Information
7.13.2 KYOCERA Introduction and Business Overview
7.13.3 KYOCERA Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.13.4 KYOCERA Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.13.5 KYOCERA Recent Development
7.14 NCAP China
7.14.1 NCAP China Company Information
7.14.2 NCAP China Introduction and Business Overview
7.14.3 NCAP China Flip Chip Ball Grid Array (FCBGA) Sales, Revenue and Gross Margin (2019-2024)
7.14.4 NCAP China Flip Chip Ball Grid Array (FCBGA) Product Offerings
7.14.5 NCAP China Recent Development
8 Industry Chain Analysis
8.1 Flip Chip Ball Grid Array (FCBGA) Industrial Chain
8.2 Flip Chip Ball Grid Array (FCBGA) Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Flip Chip Ball Grid Array (FCBGA) Sales Model
8.5.2 Sales Channel
8.5.3 Flip Chip Ball Grid Array (FCBGA) Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
础罢锛哠
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China
听
听
*If Applicable.
