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Home > Flip Chip Underfills - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Flip Chip Underfills - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID: 
PB509240677
Publication Date: 
September 19, 2024
Pages: 
126
Publisher: 
MRRPB5
Countries: 
Global [1]
USD 3,950.00

Please choose the suitable license type from above. More details are given under tab "Report License Types" below.

Specialty Chemicals [2]
Manufacturing (Chemicals) [3]
Chemicals [4]
Description: 

Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections.
The global market for Flip Chip Underfills was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Flip Chip Underfills, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Flip Chip Underfills by region & country, by Type, and by Application.
The Flip Chip Underfills market size, estimations, and forecasts are provided in terms of sales volume (MT) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Underfills.
Market Segmentation
By Company
Henkel
NAMICS
LORD Corporation
Panacol
Won Chemical
Hitachi Chemical
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline
Segment by Type:
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
Segment by Application
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Flip Chip Underfills manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Flip Chip Underfills in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Flip Chip Underfills in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents: 

1 Market Overview
1.1 Flip Chip Underfills Product Introduction
1.2 Global Flip Chip Underfills Market Size Forecast
1.2.1 Global Flip Chip Underfills Sales Value (2019-2030)
1.2.2 Global Flip Chip Underfills Sales Volume (2019-2030)
1.2.3 Global Flip Chip Underfills Sales Price (2019-2030)
1.3 Flip Chip Underfills Market Trends & Drivers
1.3.1 Flip Chip Underfills Industry Trends
1.3.2 Flip Chip Underfills Market Drivers & Opportunity
1.3.3 Flip Chip Underfills Market Challenges
1.3.4 Flip Chip Underfills Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Flip Chip Underfills Players Revenue Ranking (2023)
2.2 Global Flip Chip Underfills Revenue by Company (2019-2024)
2.3 Global Flip Chip Underfills Players Sales Volume Ranking (2023)
2.4 Global Flip Chip Underfills Sales Volume by Company Players (2019-2024)
2.5 Global Flip Chip Underfills Average Price by Company (2019-2024)
2.6 Key Manufacturers Flip Chip Underfills Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Flip Chip Underfills Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Flip Chip Underfills
2.9 Flip Chip Underfills Market Competitive Analysis
2.9.1 Flip Chip Underfills Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Flip Chip Underfills Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Flip Chip Underfills as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Capillary Underfill Material (CUF)
3.1.2 No Flow Underfill Material (NUF)
3.1.3 Molded Underfill Material (MUF)
3.2 Global Flip Chip Underfills Sales Value by Type
3.2.1 Global Flip Chip Underfills Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Flip Chip Underfills Sales Value, by Type (2019-2030)
3.2.3 Global Flip Chip Underfills Sales Value, by Type (%) (2019-2030)
3.3 Global Flip Chip Underfills Sales Volume by Type
3.3.1 Global Flip Chip Underfills Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Flip Chip Underfills Sales Volume, by Type (2019-2030)
3.3.3 Global Flip Chip Underfills Sales Volume, by Type (%) (2019-2030)
3.4 Global Flip Chip Underfills Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Industrial Electronics
4.1.2 Defense & Aerospace Electronics
4.1.3 Consumer Electronics
4.1.4 Automotive Electronics
4.1.5 Medical Electronics
4.1.6 Others
4.2 Global Flip Chip Underfills Sales Value by Application
4.2.1 Global Flip Chip Underfills Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Flip Chip Underfills Sales Value, by Application (2019-2030)
4.2.3 Global Flip Chip Underfills Sales Value, by Application (%) (2019-2030)
4.3 Global Flip Chip Underfills Sales Volume by Application
4.3.1 Global Flip Chip Underfills Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Flip Chip Underfills Sales Volume, by Application (2019-2030)
4.3.3 Global Flip Chip Underfills Sales Volume, by Application (%) (2019-2030)
4.4 Global Flip Chip Underfills Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Flip Chip Underfills Sales Value by Region
5.1.1 Global Flip Chip Underfills Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Flip Chip Underfills Sales Value by Region (2019-2024)
5.1.3 Global Flip Chip Underfills Sales Value by Region (2025-2030)
5.1.4 Global Flip Chip Underfills Sales Value by Region (%), (2019-2030)
5.2 Global Flip Chip Underfills Sales Volume by Region
5.2.1 Global Flip Chip Underfills Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Flip Chip Underfills Sales Volume by Region (2019-2024)
5.2.3 Global Flip Chip Underfills Sales Volume by Region (2025-2030)
5.2.4 Global Flip Chip Underfills Sales Volume by Region (%), (2019-2030)
5.3 Global Flip Chip Underfills Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Flip Chip Underfills Sales Value, 2019-2030
5.4.2 North America Flip Chip Underfills Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Flip Chip Underfills Sales Value, 2019-2030
5.5.2 Europe Flip Chip Underfills Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Flip Chip Underfills Sales Value, 2019-2030
5.6.2 Asia Pacific Flip Chip Underfills Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Flip Chip Underfills Sales Value, 2019-2030
5.7.2 South America Flip Chip Underfills Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Flip Chip Underfills Sales Value, 2019-2030
5.8.2 Middle East & Africa Flip Chip Underfills Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Flip Chip Underfills Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Flip Chip Underfills Sales Value
6.2.1 Key Countries/Regions Flip Chip Underfills Sales Value, 2019-2030
6.2.2 Key Countries/Regions Flip Chip Underfills Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Flip Chip Underfills Sales Value, 2019-2030
6.3.2 United States Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Flip Chip Underfills Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Flip Chip Underfills Sales Value, 2019-2030
6.4.2 Europe Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Flip Chip Underfills Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Flip Chip Underfills Sales Value, 2019-2030
6.5.2 China Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.5.3 China Flip Chip Underfills Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Flip Chip Underfills Sales Value, 2019-2030
6.6.2 Japan Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Flip Chip Underfills Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Flip Chip Underfills Sales Value, 2019-2030
6.7.2 South Korea Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Flip Chip Underfills Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Flip Chip Underfills Sales Value, 2019-2030
6.8.2 Southeast Asia Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Flip Chip Underfills Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Flip Chip Underfills Sales Value, 2019-2030
6.9.2 India Flip Chip Underfills Sales Value by Type (%), 2023 VS 2030
6.9.3 India Flip Chip Underfills Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Henkel
7.1.1 Henkel Company Information
7.1.2 Henkel Introduction and Business Overview
7.1.3 Henkel Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Henkel Flip Chip Underfills Product Offerings
7.1.5 Henkel Recent Development
7.2 NAMICS
7.2.1 NAMICS Company Information
7.2.2 NAMICS Introduction and Business Overview
7.2.3 NAMICS Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.2.4 NAMICS Flip Chip Underfills Product Offerings
7.2.5 NAMICS Recent Development
7.3 LORD Corporation
7.3.1 LORD Corporation Company Information
7.3.2 LORD Corporation Introduction and Business Overview
7.3.3 LORD Corporation Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.3.4 LORD Corporation Flip Chip Underfills Product Offerings
7.3.5 LORD Corporation Recent Development
7.4 Panacol
7.4.1 Panacol Company Information
7.4.2 Panacol Introduction and Business Overview
7.4.3 Panacol Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Panacol Flip Chip Underfills Product Offerings
7.4.5 Panacol Recent Development
7.5 Won Chemical
7.5.1 Won Chemical Company Information
7.5.2 Won Chemical Introduction and Business Overview
7.5.3 Won Chemical Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Won Chemical Flip Chip Underfills Product Offerings
7.5.5 Won Chemical Recent Development
7.6 Hitachi Chemical
7.6.1 Hitachi Chemical Company Information
7.6.2 Hitachi Chemical Introduction and Business Overview
7.6.3 Hitachi Chemical Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Hitachi Chemical Flip Chip Underfills Product Offerings
7.6.5 Hitachi Chemical Recent Development
7.7 Shin-Etsu Chemical
7.7.1 Shin-Etsu Chemical Company Information
7.7.2 Shin-Etsu Chemical Introduction and Business Overview
7.7.3 Shin-Etsu Chemical Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Shin-Etsu Chemical Flip Chip Underfills Product Offerings
7.7.5 Shin-Etsu Chemical Recent Development
7.8 AIM Solder
7.8.1 AIM Solder Company Information
7.8.2 AIM Solder Introduction and Business Overview
7.8.3 AIM Solder Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.8.4 AIM Solder Flip Chip Underfills Product Offerings
7.8.5 AIM Solder Recent Development
7.9 Zymet
7.9.1 Zymet Company Information
7.9.2 Zymet Introduction and Business Overview
7.9.3 Zymet Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Zymet Flip Chip Underfills Product Offerings
7.9.5 Zymet Recent Development
7.10 Master Bond
7.10.1 Master Bond Company Information
7.10.2 Master Bond Introduction and Business Overview
7.10.3 Master Bond Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Master Bond Flip Chip Underfills Product Offerings
7.10.5 Master Bond Recent Development
7.11 Bondline
7.11.1 Bondline Company Information
7.11.2 Bondline Introduction and Business Overview
7.11.3 Bondline Flip Chip Underfills Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Bondline Flip Chip Underfills Product Offerings
7.11.5 Bondline Recent Development
8 Industry Chain Analysis
8.1 Flip Chip Underfills Industrial Chain
8.2 Flip Chip Underfills Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Flip Chip Underfills Sales Model
8.5.2 Sales Channel
8.5.3 Flip Chip Underfills Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned: 

Henkel
NAMICS
LORD Corporation
Panacol
Won Chemical
Hitachi Chemical
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline

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