FOUP and FOSB are terms used in semiconductor manufacturing to refer to containers used for transporting and storing silicon wafers, particularly 300 mm wafers, which are the standard size used in modern semiconductor fabrication processes.
FOUP (Front Opening Unified Pod):
A FOUP is a specialized container designed to safely transport, store, and protect silicon wafers during various stages of the semiconductor manufacturing process. It has a front-opening mechanism that allows wafers to be loaded and unloaded robotically without exposing the wafers to the surrounding environment. FOUPs are used to maintain the cleanliness and integrity of wafers, protecting them from contamination, particles, and other factors that could negatively affect the quality of the manufactured chips.
FOUPs often have sophisticated features, such as interlocks, sensors, and RFID (Radio-Frequency Identification) tags, that help ensure the proper handling and tracking of wafers within the cleanroom environment. These containers are an integral part of automated material handling systems within semiconductor fabrication facilities.
FOSB (Front Opening Shipping Box):
Similar to FOUPs, FOSBs are also containers designed to transport and store silicon wafers. However, FOSBs are typically used for shipping wafers between different facilities or locations, such as from a wafer manufacturer to a semiconductor fabrication plant. They are designed to provide extra protection during transportation to prevent damage to wafers.
FOSBs often have additional packaging materials inside, such as foam or other cushioning materials, to absorb shock and vibrations during transit. They may also include mechanisms to secure the wafers within the container to prevent movement that could lead to breakage.
Both FOUPs and FOSBs are critical components of the semiconductor supply chain, ensuring that wafers are handled, transported, and stored in a controlled and protected environment to maintain their quality and usability.
The global 300 mm Wafer FOUP and FOSB market was valued at US$ 709.5 million in 2023 and is anticipated to reach US$ 1136.5 million by 2030, witnessing a CAGR of 7.2% during the forecast period 2024-2030.
Taiwan (China) is the largest consumption region of Semiconductor FOUP and FOSB, with a consumption market share of 19.74% in 2022. The second place is United States; following Taiwan (China) with the consumption market share 19.30% in 2022. New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. At present, the market is occupied by American companies, Japan, Korea and Taiwan. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product鈥檚 types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
This report aims to provide a comprehensive presentation of the global market for 300 mm Wafer FOUP and FOSB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 300 mm Wafer FOUP and FOSB.
Report Scope
The 300 mm Wafer FOUP and FOSB market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 300 mm Wafer FOUP and FOSB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 300 mm Wafer FOUP and FOSB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji
Segment by Type
FOUP
FOSB
Segment by Application
Wafer Foundry
IDM
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 300 mm Wafer FOUP and FOSB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 300 mm Wafer FOUP and FOSB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 300 mm Wafer FOUP and FOSB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 300 mm Wafer FOUP and FOSB Market Overview
1.1 Product Definition
1.2 300 mm Wafer FOUP and FOSB Segment by Type
1.2.1 Global 300 mm Wafer FOUP and FOSB Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 FOUP
1.2.3 FOSB
1.3 300 mm Wafer FOUP and FOSB Segment by Application
1.3.1 Global 300 mm Wafer FOUP and FOSB Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Wafer Foundry
1.3.3 IDM
1.4 Global Market Growth Prospects
1.4.1 Global 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global 300 mm Wafer FOUP and FOSB Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global 300 mm Wafer FOUP and FOSB Production Estimates and Forecasts (2019-2030)
1.4.4 Global 300 mm Wafer FOUP and FOSB Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global 300 mm Wafer FOUP and FOSB Production Market Share by Manufacturers (2019-2024)
2.2 Global 300 mm Wafer FOUP and FOSB Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of 300 mm Wafer FOUP and FOSB, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global 300 mm Wafer FOUP and FOSB Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global 300 mm Wafer FOUP and FOSB Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of 300 mm Wafer FOUP and FOSB, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of 300 mm Wafer FOUP and FOSB, Product Offered and Application
2.8 Global Key Manufacturers of 300 mm Wafer FOUP and FOSB, Date of Enter into This Industry
2.9 300 mm Wafer FOUP and FOSB Market Competitive Situation and Trends
2.9.1 300 mm Wafer FOUP and FOSB Market Concentration Rate
2.9.2 Global 5 and 10 Largest 300 mm Wafer FOUP and FOSB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 300 mm Wafer FOUP and FOSB Production by Region
3.1 Global 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global 300 mm Wafer FOUP and FOSB Production Value by Region (2019-2030)
3.2.1 Global 300 mm Wafer FOUP and FOSB Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of 300 mm Wafer FOUP and FOSB by Region (2025-2030)
3.3 Global 300 mm Wafer FOUP and FOSB Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global 300 mm Wafer FOUP and FOSB Production by Region (2019-2030)
3.4.1 Global 300 mm Wafer FOUP and FOSB Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of 300 mm Wafer FOUP and FOSB by Region (2025-2030)
3.5 Global 300 mm Wafer FOUP and FOSB Market Price Analysis by Region (2019-2024)
3.6 Global 300 mm Wafer FOUP and FOSB Production and Value, Year-over-Year Growth
3.6.1 North America 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
3.6.3 China 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan 300 mm Wafer FOUP and FOSB Production Value Estimates and Forecasts (2019-2030)
4 300 mm Wafer FOUP and FOSB Consumption by Region
4.1 Global 300 mm Wafer FOUP and FOSB Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global 300 mm Wafer FOUP and FOSB Consumption by Region (2019-2030)
4.2.1 Global 300 mm Wafer FOUP and FOSB Consumption by Region (2019-2024)
4.2.2 Global 300 mm Wafer FOUP and FOSB Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America 300 mm Wafer FOUP and FOSB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America 300 mm Wafer FOUP and FOSB Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe 300 mm Wafer FOUP and FOSB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe 300 mm Wafer FOUP and FOSB Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific 300 mm Wafer FOUP and FOSB Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific 300 mm Wafer FOUP and FOSB Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa 300 mm Wafer FOUP and FOSB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa 300 mm Wafer FOUP and FOSB Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global 300 mm Wafer FOUP and FOSB Production by Type (2019-2030)
5.1.1 Global 300 mm Wafer FOUP and FOSB Production by Type (2019-2024)
5.1.2 Global 300 mm Wafer FOUP and FOSB Production by Type (2025-2030)
5.1.3 Global 300 mm Wafer FOUP and FOSB Production Market Share by Type (2019-2030)
5.2 Global 300 mm Wafer FOUP and FOSB Production Value by Type (2019-2030)
5.2.1 Global 300 mm Wafer FOUP and FOSB Production Value by Type (2019-2024)
5.2.2 Global 300 mm Wafer FOUP and FOSB Production Value by Type (2025-2030)
5.2.3 Global 300 mm Wafer FOUP and FOSB Production Value Market Share by Type (2019-2030)
5.3 Global 300 mm Wafer FOUP and FOSB Price by Type (2019-2030)
6 Segment by Application
6.1 Global 300 mm Wafer FOUP and FOSB Production by Application (2019-2030)
6.1.1 Global 300 mm Wafer FOUP and FOSB Production by Application (2019-2024)
6.1.2 Global 300 mm Wafer FOUP and FOSB Production by Application (2025-2030)
6.1.3 Global 300 mm Wafer FOUP and FOSB Production Market Share by Application (2019-2030)
6.2 Global 300 mm Wafer FOUP and FOSB Production Value by Application (2019-2030)
6.2.1 Global 300 mm Wafer FOUP and FOSB Production Value by Application (2019-2024)
6.2.2 Global 300 mm Wafer FOUP and FOSB Production Value by Application (2025-2030)
6.2.3 Global 300 mm Wafer FOUP and FOSB Production Value Market Share by Application (2019-2030)
6.3 Global 300 mm Wafer FOUP and FOSB Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Entegris
7.1.1 Entegris 300 mm Wafer FOUP and FOSB Corporation Information
7.1.2 Entegris 300 mm Wafer FOUP and FOSB Product Portfolio
7.1.3 Entegris 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Entegris Main Business and Markets Served
7.1.5 Entegris Recent Developments/Updates
7.2 Shin-Etsu Polymer
7.2.1 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Corporation Information
7.2.2 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Product Portfolio
7.2.3 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Shin-Etsu Polymer Main Business and Markets Served
7.2.5 Shin-Etsu Polymer Recent Developments/Updates
7.3 Miraial
7.3.1 Miraial 300 mm Wafer FOUP and FOSB Corporation Information
7.3.2 Miraial 300 mm Wafer FOUP and FOSB Product Portfolio
7.3.3 Miraial 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Miraial Main Business and Markets Served
7.3.5 Miraial Recent Developments/Updates
7.4 Chuang King Enterprise
7.4.1 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Corporation Information
7.4.2 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Product Portfolio
7.4.3 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Chuang King Enterprise Main Business and Markets Served
7.4.5 Chuang King Enterprise Recent Developments/Updates
7.5 Gudeng Precision
7.5.1 Gudeng Precision 300 mm Wafer FOUP and FOSB Corporation Information
7.5.2 Gudeng Precision 300 mm Wafer FOUP and FOSB Product Portfolio
7.5.3 Gudeng Precision 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Gudeng Precision Main Business and Markets Served
7.5.5 Gudeng Precision Recent Developments/Updates
7.6 3S Korea
7.6.1 3S Korea 300 mm Wafer FOUP and FOSB Corporation Information
7.6.2 3S Korea 300 mm Wafer FOUP and FOSB Product Portfolio
7.6.3 3S Korea 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.6.4 3S Korea Main Business and Markets Served
7.6.5 3S Korea Recent Developments/Updates
7.7 Dainichi Shoji
7.7.1 Dainichi Shoji 300 mm Wafer FOUP and FOSB Corporation Information
7.7.2 Dainichi Shoji 300 mm Wafer FOUP and FOSB Product Portfolio
7.7.3 Dainichi Shoji 300 mm Wafer FOUP and FOSB Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Dainichi Shoji Main Business and Markets Served
7.7.5 Dainichi Shoji Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 300 mm Wafer FOUP and FOSB Industry Chain Analysis
8.2 300 mm Wafer FOUP and FOSB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 300 mm Wafer FOUP and FOSB Production Mode & Process
8.4 300 mm Wafer FOUP and FOSB Sales and Marketing
8.4.1 300 mm Wafer FOUP and FOSB Sales Channels
8.4.2 300 mm Wafer FOUP and FOSB Distributors
8.5 300 mm Wafer FOUP and FOSB Customers
9 300 mm Wafer FOUP and FOSB Market Dynamics
9.1 300 mm Wafer FOUP and FOSB Industry Trends
9.2 300 mm Wafer FOUP and FOSB Market Drivers
9.3 300 mm Wafer FOUP and FOSB Market Challenges
9.4 300 mm Wafer FOUP and FOSB Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji
听
听
*If Applicable.
