A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC & 2.5D IC Packaging market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
In terms of production side, this report researches the 3D IC & 2.5D IC Packaging production, growth rate, market share by manufacturers and by region (region level and country level), from 2018 to 2023, and forecast to 2029.
In terms of consumption side, this report focuses on the sales of 3D IC & 2.5D IC Packaging by region (region level and country level), by company, by Type and by Application. from 2018 to 2023 and forecast to 2029.
Report Includes:
This report presents an overview of global market for 3D IC & 2.5D IC Packaging, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2018 - 2022, estimates for 2023, and projections of CAGR through 2029.
This report researches the key producers of 3D IC & 2.5D IC Packaging, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for 3D IC & 2.5D IC Packaging, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the 3D IC & 2.5D IC Packaging sales, revenue, market share and industry ranking of main manufacturers, data from 2018 to 2023. Identification of the major stakeholders in the global 3D IC & 2.5D IC Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2018 to 2029. Evaluation and forecast the market size for 3D IC & 2.5D IC Packaging sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Intel Corporation, Toshiba Corp, Samsung Electronics, Stmicroelectronics, Taiwan Semiconductor Manufacturing, Amkor Technology, United Microelectronics, Broadcom and ASE Group, etc.
By Company
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
Segment by Type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Segment by Application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: 3D IC & 2.5D IC Packaging production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of 3D IC & 2.5D IC Packaging in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of 3D IC & 2.5D IC Packaging manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: China by type and by application sales and revenue for each segment.
Chapter 10: Asia (excluding China) by type, by application and by region, sales and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, 3D IC & 2.5D IC Packaging sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 3D IC & 2.5D IC Packaging Product Introduction
1.2 Market by Type
1.2.1 Global 3D IC & 2.5D IC Packaging Market Size by Type, 2018 VS 2022 VS 2029
1.2.2 3D TSV
1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.3 Market by Application
1.3.1 Global 3D IC & 2.5D IC Packaging Market Size by Application, 2018 VS 2022 VS 2029
1.3.2 Automotive
1.3.3 Consumer electronics
1.3.4 Medical devices
1.3.5 Military & aerospace
1.3.6 Telecommunication
1.3.7 Industrial sector and smart technologies
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global 3D IC & 2.5D IC Packaging Production
2.1 Global 3D IC & 2.5D IC Packaging Production Capacity (2018-2029)
2.2 Global 3D IC & 2.5D IC Packaging Production by Region: 2018 VS 2022 VS 2029
2.3 Global 3D IC & 2.5D IC Packaging Production by Region
2.3.1 Global 3D IC & 2.5D IC Packaging Historic Production by Region (2018-2023)
2.3.2 Global 3D IC & 2.5D IC Packaging Forecasted Production by Region (2024-2029)
2.3.3 Global 3D IC & 2.5D IC Packaging Production Market Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global 3D IC & 2.5D IC Packaging Revenue Estimates and Forecasts 2018-2029
3.2 Global 3D IC & 2.5D IC Packaging Revenue by Region
3.2.1 Global 3D IC & 2.5D IC Packaging Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global 3D IC & 2.5D IC Packaging Revenue by Region (2018-2023)
3.2.3 Global 3D IC & 2.5D IC Packaging Revenue by Region (2024-2029)
3.2.4 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Region (2018-2029)
3.3 Global 3D IC & 2.5D IC Packaging Sales Estimates and Forecasts 2018-2029
3.4 Global 3D IC & 2.5D IC Packaging Sales by Region
3.4.1 Global 3D IC & 2.5D IC Packaging Sales by Region: 2018 VS 2022 VS 2029
3.4.2 Global 3D IC & 2.5D IC Packaging Sales by Region (2018-2023)
3.4.3 Global 3D IC & 2.5D IC Packaging Sales by Region (2024-2029)
3.4.4 Global 3D IC & 2.5D IC Packaging Sales Market Share by Region (2018-2029)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global 3D IC & 2.5D IC Packaging Sales by Manufacturers
4.1.1 Global 3D IC & 2.5D IC Packaging Sales by Manufacturers (2018-2023)
4.1.2 Global 3D IC & 2.5D IC Packaging Sales Market Share by Manufacturers (2018-2023)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of 3D IC & 2.5D IC Packaging in 2022
4.2 Global 3D IC & 2.5D IC Packaging Revenue by Manufacturers
4.2.1 Global 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2018-2023)
4.2.2 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Manufacturers (2018-2023)
4.2.3 Global Top 10 and Top 5 Companies by 3D IC & 2.5D IC Packaging Revenue in 2022
4.3 Global 3D IC & 2.5D IC Packaging Sales Price by Manufacturers
4.4 Global Key Players of 3D IC & 2.5D IC Packaging, Industry Ranking, 2021 VS 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global 3D IC & 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of 3D IC & 2.5D IC Packaging, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of 3D IC & 2.5D IC Packaging, Product Offered and Application
4.8 Global Key Manufacturers of 3D IC & 2.5D IC Packaging, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global 3D IC & 2.5D IC Packaging Sales by Type
5.1.1 Global 3D IC & 2.5D IC Packaging Historical Sales by Type (2018-2023)
5.1.2 Global 3D IC & 2.5D IC Packaging Forecasted Sales by Type (2024-2029)
5.1.3 Global 3D IC & 2.5D IC Packaging Sales Market Share by Type (2018-2029)
5.2 Global 3D IC & 2.5D IC Packaging Revenue by Type
5.2.1 Global 3D IC & 2.5D IC Packaging Historical Revenue by Type (2018-2023)
5.2.2 Global 3D IC & 2.5D IC Packaging Forecasted Revenue by Type (2024-2029)
5.2.3 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Type (2018-2029)
5.3 Global 3D IC & 2.5D IC Packaging Price by Type
5.3.1 Global 3D IC & 2.5D IC Packaging Price by Type (2018-2023)
5.3.2 Global 3D IC & 2.5D IC Packaging Price Forecast by Type (2024-2029)
6 Market Size by Application
6.1 Global 3D IC & 2.5D IC Packaging Sales by Application
6.1.1 Global 3D IC & 2.5D IC Packaging Historical Sales by Application (2018-2023)
6.1.2 Global 3D IC & 2.5D IC Packaging Forecasted Sales by Application (2024-2029)
6.1.3 Global 3D IC & 2.5D IC Packaging Sales Market Share by Application (2018-2029)
6.2 Global 3D IC & 2.5D IC Packaging Revenue by Application
6.2.1 Global 3D IC & 2.5D IC Packaging Historical Revenue by Application (2018-2023)
6.2.2 Global 3D IC & 2.5D IC Packaging Forecasted Revenue by Application (2024-2029)
6.2.3 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Application (2018-2029)
6.3 Global 3D IC & 2.5D IC Packaging Price by Application
6.3.1 Global 3D IC & 2.5D IC Packaging Price by Application (2018-2023)
6.3.2 Global 3D IC & 2.5D IC Packaging Price Forecast by Application (2024-2029)
7 US & Canada
7.1 US & Canada 3D IC & 2.5D IC Packaging Market Size by Type
7.1.1 US & Canada 3D IC & 2.5D IC Packaging Sales by Type (2018-2029)
7.1.2 US & Canada 3D IC & 2.5D IC Packaging Revenue by Type (2018-2029)
7.2 US & Canada 3D IC & 2.5D IC Packaging Market Size by Application
7.2.1 US & Canada 3D IC & 2.5D IC Packaging Sales by Application (2018-2029)
7.2.2 US & Canada 3D IC & 2.5D IC Packaging Revenue by Application (2018-2029)
7.3 US & Canada 3D IC & 2.5D IC Packaging Sales by Country
7.3.1 US & Canada 3D IC & 2.5D IC Packaging Revenue by Country: 2018 VS 2022 VS 2029
7.3.2 US & Canada 3D IC & 2.5D IC Packaging Sales by Country (2018-2029)
7.3.3 US & Canada 3D IC & 2.5D IC Packaging Revenue by Country (2018-2029)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe 3D IC & 2.5D IC Packaging Market Size by Type
8.1.1 Europe 3D IC & 2.5D IC Packaging Sales by Type (2018-2029)
8.1.2 Europe 3D IC & 2.5D IC Packaging Revenue by Type (2018-2029)
8.2 Europe 3D IC & 2.5D IC Packaging Market Size by Application
8.2.1 Europe 3D IC & 2.5D IC Packaging Sales by Application (2018-2029)
8.2.2 Europe 3D IC & 2.5D IC Packaging Revenue by Application (2018-2029)
8.3 Europe 3D IC & 2.5D IC Packaging Sales by Country
8.3.1 Europe 3D IC & 2.5D IC Packaging Revenue by Country: 2018 VS 2022 VS 2029
8.3.2 Europe 3D IC & 2.5D IC Packaging Sales by Country (2018-2029)
8.3.3 Europe 3D IC & 2.5D IC Packaging Revenue by Country (2018-2029)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China 3D IC & 2.5D IC Packaging Market Size by Type
9.1.1 China 3D IC & 2.5D IC Packaging Sales by Type (2018-2029)
9.1.2 China 3D IC & 2.5D IC Packaging Revenue by Type (2018-2029)
9.2 China 3D IC & 2.5D IC Packaging Market Size by Application
9.2.1 China 3D IC & 2.5D IC Packaging Sales by Application (2018-2029)
9.2.2 China 3D IC & 2.5D IC Packaging Revenue by Application (2018-2029)
10 Asia (excluding China)
10.1 Asia 3D IC & 2.5D IC Packaging Market Size by Type
10.1.1 Asia 3D IC & 2.5D IC Packaging Sales by Type (2018-2029)
10.1.2 Asia 3D IC & 2.5D IC Packaging Revenue by Type (2018-2029)
10.2 Asia 3D IC & 2.5D IC Packaging Market Size by Application
10.2.1 Asia 3D IC & 2.5D IC Packaging Sales by Application (2018-2029)
10.2.2 Asia 3D IC & 2.5D IC Packaging Revenue by Application (2018-2029)
10.3 Asia 3D IC & 2.5D IC Packaging Sales by Region
10.3.1 Asia 3D IC & 2.5D IC Packaging Revenue by Region: 2018 VS 2022 VS 2029
10.3.2 Asia 3D IC & 2.5D IC Packaging Revenue by Region (2018-2029)
10.3.3 Asia 3D IC & 2.5D IC Packaging Sales by Region (2018-2029)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Market Size by Type
11.1.1 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Sales by Type (2018-2029)
11.1.2 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Revenue by Type (2018-2029)
11.2 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Market Size by Application
11.2.1 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Sales by Application (2018-2029)
11.2.2 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Revenue by Application (2018-2029)
11.3 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Sales by Country
11.3.1 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Revenue by Country: 2018 VS 2022 VS 2029
11.3.2 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Revenue by Country (2018-2029)
11.3.3 Middle East, Africa and Latin America 3D IC & 2.5D IC Packaging Sales by Country (2018-2029)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Intel Corporation
12.1.1 Intel Corporation Company Information
12.1.2 Intel Corporation Overview
12.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Intel Corporation Recent Developments
12.2 Toshiba Corp
12.2.1 Toshiba Corp Company Information
12.2.2 Toshiba Corp Overview
12.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.2.4 Toshiba Corp 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Toshiba Corp Recent Developments
12.3 Samsung Electronics
12.3.1 Samsung Electronics Company Information
12.3.2 Samsung Electronics Overview
12.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.3.4 Samsung Electronics 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Samsung Electronics Recent Developments
12.4 Stmicroelectronics
12.4.1 Stmicroelectronics Company Information
12.4.2 Stmicroelectronics Overview
12.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.4.4 Stmicroelectronics 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Stmicroelectronics Recent Developments
12.5 Taiwan Semiconductor Manufacturing
12.5.1 Taiwan Semiconductor Manufacturing Company Information
12.5.2 Taiwan Semiconductor Manufacturing Overview
12.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.5.4 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Taiwan Semiconductor Manufacturing Recent Developments
12.6 Amkor Technology
12.6.1 Amkor Technology Company Information
12.6.2 Amkor Technology Overview
12.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.6.4 Amkor Technology 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Amkor Technology Recent Developments
12.7 United Microelectronics
12.7.1 United Microelectronics Company Information
12.7.2 United Microelectronics Overview
12.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.7.4 United Microelectronics 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 United Microelectronics Recent Developments
12.8 Broadcom
12.8.1 Broadcom Company Information
12.8.2 Broadcom Overview
12.8.3 Broadcom 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.8.4 Broadcom 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Broadcom Recent Developments
12.9 ASE Group
12.9.1 ASE Group Company Information
12.9.2 ASE Group Overview
12.9.3 ASE Group 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.9.4 ASE Group 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 ASE Group Recent Developments
12.10 Pure Storage
12.10.1 Pure Storage Company Information
12.10.2 Pure Storage Overview
12.10.3 Pure Storage 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.10.4 Pure Storage 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Pure Storage Recent Developments
12.11 Advanced Semiconductor Engineering
12.11.1 Advanced Semiconductor Engineering Company Information
12.11.2 Advanced Semiconductor Engineering Overview
12.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.11.4 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Advanced Semiconductor Engineering Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 3D IC & 2.5D IC Packaging Industry Chain Analysis
13.2 3D IC & 2.5D IC Packaging Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 3D IC & 2.5D IC Packaging Production Mode & Process
13.4 3D IC & 2.5D IC Packaging Sales and Marketing
13.4.1 3D IC & 2.5D IC Packaging Sales Channels
13.4.2 3D IC & 2.5D IC Packaging Distributors
13.5 3D IC & 2.5D IC Packaging Customers
14 3D IC & 2.5D IC Packaging Market Dynamics
14.1 3D IC & 2.5D IC Packaging Industry Trends
14.2 3D IC & 2.5D IC Packaging Market Drivers
14.3 3D IC & 2.5D IC Packaging Market Challenges
14.4 3D IC & 2.5D IC Packaging Market Restraints
15 Key Finding in The Global 3D IC & 2.5D IC Packaging Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
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*If Applicable.
