Global 3D ICs Packaging Solution Market Research Report 2024

Publication ID:

PB506245681

Publication Date:

June 20, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

IC packaging refers to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and allow mounting of the electrical contacts connecting it to the printed circuit board (PCB).
The global 3D ICs Packaging Solution market was valued at US$ 624 million in 2023 and is anticipated to reach US$ 1107.9 million by 2030, witnessing a CAGR of 9.1% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for 3D ICs Packaging Solution, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D ICs Packaging Solution.
Report Scope
The 3D ICs Packaging Solution market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D ICs Packaging Solution market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D ICs Packaging Solution companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor
ASE
Intel
Samsung
AT&S
Toshiba
JCET
IBM
SK Hynix
UTAC
Qualcomm
Segment by Type
Wire Bonding
TSV
Fan Out
Others
Segment by Application
Consumer Electronics
Industrial
Automotive
Telecommunication
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D ICs Packaging Solution companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D ICs Packaging Solution Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Wire Bonding
1.2.3 TSV
1.2.4 Fan Out
1.2.5 Others
1.3 Market by Application
1.3.1 Global 3D ICs Packaging Solution Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive
1.3.5 Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 3D ICs Packaging Solution Market Perspective (2019-2030)
2.2 3D ICs Packaging Solution Growth Trends by Region
2.2.1 Global 3D ICs Packaging Solution Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 3D ICs Packaging Solution Historic Market Size by Region (2019-2024)
2.2.3 3D ICs Packaging Solution Forecasted Market Size by Region (2025-2030)
2.3 3D ICs Packaging Solution Market Dynamics
2.3.1 3D ICs Packaging Solution Industry Trends
2.3.2 3D ICs Packaging Solution Market Drivers
2.3.3 3D ICs Packaging Solution Market Challenges
2.3.4 3D ICs Packaging Solution Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 3D ICs Packaging Solution Players by Revenue
3.1.1 Global Top 3D ICs Packaging Solution Players by Revenue (2019-2024)
3.1.2 Global 3D ICs Packaging Solution Revenue Market Share by Players (2019-2024)
3.2 Global 3D ICs Packaging Solution Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 3D ICs Packaging Solution Revenue
3.4 Global 3D ICs Packaging Solution Market Concentration Ratio
3.4.1 Global 3D ICs Packaging Solution Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D ICs Packaging Solution Revenue in 2023
3.5 3D ICs Packaging Solution Key Players Head office and Area Served
3.6 Key Players 3D ICs Packaging Solution Product Solution and Service
3.7 Date of Enter into 3D ICs Packaging Solution Market
3.8 Mergers & Acquisitions, Expansion Plans
4 3D ICs Packaging Solution Breakdown Data by Type
4.1 Global 3D ICs Packaging Solution Historic Market Size by Type (2019-2024)
4.2 Global 3D ICs Packaging Solution Forecasted Market Size by Type (2025-2030)
5 3D ICs Packaging Solution Breakdown Data by Application
5.1 Global 3D ICs Packaging Solution Historic Market Size by Application (2019-2024)
5.2 Global 3D ICs Packaging Solution Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America 3D ICs Packaging Solution Market Size (2019-2030)
6.2 North America 3D ICs Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 3D ICs Packaging Solution Market Size by Country (2019-2024)
6.4 North America 3D ICs Packaging Solution Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 3D ICs Packaging Solution Market Size (2019-2030)
7.2 Europe 3D ICs Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 3D ICs Packaging Solution Market Size by Country (2019-2024)
7.4 Europe 3D ICs Packaging Solution Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 3D ICs Packaging Solution Market Size (2019-2030)
8.2 Asia-Pacific 3D ICs Packaging Solution Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 3D ICs Packaging Solution Market Size by Region (2019-2024)
8.4 Asia-Pacific 3D ICs Packaging Solution Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 3D ICs Packaging Solution Market Size (2019-2030)
9.2 Latin America 3D ICs Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 3D ICs Packaging Solution Market Size by Country (2019-2024)
9.4 Latin America 3D ICs Packaging Solution Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 3D ICs Packaging Solution Market Size (2019-2030)
10.2 Middle East & Africa 3D ICs Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 3D ICs Packaging Solution Market Size by Country (2019-2024)
10.4 Middle East & Africa 3D ICs Packaging Solution Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor
11.1.1 Amkor Company Detail
11.1.2 Amkor Business Overview
11.1.3 Amkor 3D ICs Packaging Solution Introduction
11.1.4 Amkor Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.1.5 Amkor Recent Development
11.2 ASE
11.2.1 ASE Company Detail
11.2.2 ASE Business Overview
11.2.3 ASE 3D ICs Packaging Solution Introduction
11.2.4 ASE Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.2.5 ASE Recent Development
11.3 Intel
11.3.1 Intel Company Detail
11.3.2 Intel Business Overview
11.3.3 Intel 3D ICs Packaging Solution Introduction
11.3.4 Intel Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.3.5 Intel Recent Development
11.4 Samsung
11.4.1 Samsung Company Detail
11.4.2 Samsung Business Overview
11.4.3 Samsung 3D ICs Packaging Solution Introduction
11.4.4 Samsung Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.4.5 Samsung Recent Development
11.5 AT&S
11.5.1 AT&S Company Detail
11.5.2 AT&S Business Overview
11.5.3 AT&S 3D ICs Packaging Solution Introduction
11.5.4 AT&S Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.5.5 AT&S Recent Development
11.6 Toshiba
11.6.1 Toshiba Company Detail
11.6.2 Toshiba Business Overview
11.6.3 Toshiba 3D ICs Packaging Solution Introduction
11.6.4 Toshiba Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.6.5 Toshiba Recent Development
11.7 JCET
11.7.1 JCET Company Detail
11.7.2 JCET Business Overview
11.7.3 JCET 3D ICs Packaging Solution Introduction
11.7.4 JCET Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.7.5 JCET Recent Development
11.8 IBM
11.8.1 IBM Company Detail
11.8.2 IBM Business Overview
11.8.3 IBM 3D ICs Packaging Solution Introduction
11.8.4 IBM Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.8.5 IBM Recent Development
11.9 SK Hynix
11.9.1 SK Hynix Company Detail
11.9.2 SK Hynix Business Overview
11.9.3 SK Hynix 3D ICs Packaging Solution Introduction
11.9.4 SK Hynix Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.9.5 SK Hynix Recent Development
11.10 UTAC
11.10.1 UTAC Company Detail
11.10.2 UTAC Business Overview
11.10.3 UTAC 3D ICs Packaging Solution Introduction
11.10.4 UTAC Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.10.5 UTAC Recent Development
11.11 Qualcomm
11.11.1 Qualcomm Company Detail
11.11.2 Qualcomm Business Overview
11.11.3 Qualcomm 3D ICs Packaging Solution Introduction
11.11.4 Qualcomm Revenue in 3D ICs Packaging Solution Business (2019-2024)
11.11.5 Qualcomm Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Amkor
ASE
Intel
Samsung
AT&S
Toshiba
JCET
IBM
SK Hynix
UTAC
Qualcomm

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.

91制片厂