3D TSV or silicon through-hole technology is one of the important technologies used in the semiconductor industry.A silicon through-hole is an electrical connection that passes vertically through a stack of silicon wafers or chips.3D TSV replaces 2D packaging techniques such as lead bonding and flip chip.It is widely used to improve non-memory and CMOS logic functions and memory in electronic devices such as tablets, smartphones and televisions.TSV is an enhanced performance interconnection, made of a columnar structure of silicon, copper, tungsten or polysilicon, that can be electrically interlinked via silicon chips or wafers.In the 2.5d structure, the bare sheet is not assembled on the bare sheet.
Market Analysis and Insights: Global 3D TSV and 2.5D Market
The global 3D TSV and 2.5D market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for 3D TSV and 2.5D is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The China market for 3D TSV and 2.5D is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The Europe market for 3D TSV and 2.5D is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The global key companies of 3D TSV and 2.5D include Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics and Broadcom, etc. In 2023, the global top five players had a share approximately % in terms of revenue.
3D TSV and 2.5D is widely used in various fields, such as Consumer Electronics, Information and Communication Technology, Automotive and Military, etc. Consumer Electronics provides greatest supports to the 3D TSV and 2.5D industry development. In 2023, global % revenue of 3D TSV and 2.5D went into Consumer Electronics filed and the proportion will reach to % in 2030.
Report Covers:
This report presents an overview of global market for 3D TSV and 2.5D market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of 3D TSV and 2.5D, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for 3D TSV and 2.5D, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the 3D TSV and 2.5D revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global 3D TSV and 2.5D market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for 3D TSV and 2.5D revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
Toshiba
Taiwan Semiconductor
Samsung Electronics
Pure Storage
ASE Group
Amkor Technology
United Microelectronics
STMicroelectronics
Broadcom
Intel Corporation
Jiangsu Changing Electronics Technology
Segment by Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Segment by Application
Consumer Electronics
Information and Communication Technology
Automotive
Military
Aerospace and Defense
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of 3D TSV and 2.5D in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D TSV and 2.5D companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, 3D TSV and 2.5D revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D TSV and 2.5D Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Memory
1.2.3 MEMS
1.2.4 CMOS Image Sensors
1.2.5 Imaging and Optoelectronics
1.2.6 Advanced LED Packaging
1.2.7 Others
1.3 Market by Application
1.3.1 Global 3D TSV and 2.5D Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Information and Communication Technology
1.3.4 Automotive
1.3.5 Military
1.3.6 Aerospace and Defense
1.3.7 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global 3D TSV and 2.5D Market Perspective (2019-2030)
2.2 Global 3D TSV and 2.5D Growth Trends by Region
2.2.1 3D TSV and 2.5D Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 3D TSV and 2.5D Historic Market Size by Region (2019-2024)
2.2.3 3D TSV and 2.5D Forecasted Market Size by Region (2025-2030)
2.3 3D TSV and 2.5D Market Dynamics
2.3.1 3D TSV and 2.5D Industry Trends
2.3.2 3D TSV and 2.5D Market Drivers
2.3.3 3D TSV and 2.5D Market Challenges
2.3.4 3D TSV and 2.5D Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue 3D TSV and 2.5D by Players
3.1.1 Global 3D TSV and 2.5D Revenue by Players (2019-2024)
3.1.2 Global 3D TSV and 2.5D Revenue Market Share by Players (2019-2024)
3.2 Global 3D TSV and 2.5D Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of 3D TSV and 2.5D, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global 3D TSV and 2.5D Market Concentration Ratio
3.4.1 Global 3D TSV and 2.5D Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D TSV and 2.5D Revenue in 2023
3.5 Global Key Players of 3D TSV and 2.5D Head office and Area Served
3.6 Global Key Players of 3D TSV and 2.5D, Product and Application
3.7 Global Key Players of 3D TSV and 2.5D, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 3D TSV and 2.5D Breakdown Data by Type
4.1 Global 3D TSV and 2.5D Historic Market Size by Type (2019-2024)
4.2 Global 3D TSV and 2.5D Forecasted Market Size by Type (2025-2030)
5 3D TSV and 2.5D Breakdown Data by Application
5.1 Global 3D TSV and 2.5D Historic Market Size by Application (2019-2024)
5.2 Global 3D TSV and 2.5D Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America 3D TSV and 2.5D Market Size (2019-2030)
6.2 North America 3D TSV and 2.5D Market Size by Type
6.2.1 North America 3D TSV and 2.5D Market Size by Type (2019-2024)
6.2.2 North America 3D TSV and 2.5D Market Size by Type (2025-2030)
6.2.3 North America 3D TSV and 2.5D Market Share by Type (2019-2030)
6.3 North America 3D TSV and 2.5D Market Size by Application
6.3.1 North America 3D TSV and 2.5D Market Size by Application (2019-2024)
6.3.2 North America 3D TSV and 2.5D Market Size by Application (2025-2030)
6.3.3 North America 3D TSV and 2.5D Market Share by Application (2019-2030)
6.4 North America 3D TSV and 2.5D Market Size by Country
6.4.1 North America 3D TSV and 2.5D Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America 3D TSV and 2.5D Market Size by Country (2019-2024)
6.4.3 North America 3D TSV and 2.5D Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe 3D TSV and 2.5D Market Size (2019-2030)
7.2 Europe 3D TSV and 2.5D Market Size by Type
7.2.1 Europe 3D TSV and 2.5D Market Size by Type (2019-2024)
7.2.2 Europe 3D TSV and 2.5D Market Size by Type (2025-2030)
7.2.3 Europe 3D TSV and 2.5D Market Share by Type (2019-2030)
7.3 Europe 3D TSV and 2.5D Market Size by Application
7.3.1 Europe 3D TSV and 2.5D Market Size by Application (2019-2024)
7.3.2 Europe 3D TSV and 2.5D Market Size by Application (2025-2030)
7.3.3 Europe 3D TSV and 2.5D Market Share by Application (2019-2030)
7.4 Europe 3D TSV and 2.5D Market Size by Country
7.4.1 Europe 3D TSV and 2.5D Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe 3D TSV and 2.5D Market Size by Country (2019-2024)
7.4.3 Europe 3D TSV and 2.5D Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China 3D TSV and 2.5D Market Size (2019-2030)
8.2 China 3D TSV and 2.5D Market Size by Type
8.2.1 China 3D TSV and 2.5D Market Size by Type (2019-2024)
8.2.2 China 3D TSV and 2.5D Market Size by Type (2025-2030)
8.2.3 China 3D TSV and 2.5D Market Share by Type (2019-2030)
8.3 China 3D TSV and 2.5D Market Size by Application
8.3.1 China 3D TSV and 2.5D Market Size by Application (2019-2024)
8.3.2 China 3D TSV and 2.5D Market Size by Application (2025-2030)
8.3.3 China 3D TSV and 2.5D Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia 3D TSV and 2.5D Market Size (2019-2030)
9.2 Asia 3D TSV and 2.5D Market Size by Type
9.2.1 Asia 3D TSV and 2.5D Market Size by Type (2019-2024)
9.2.2 Asia 3D TSV and 2.5D Market Size by Type (2025-2030)
9.2.3 Asia 3D TSV and 2.5D Market Share by Type (2019-2030)
9.3 Asia 3D TSV and 2.5D Market Size by Application
9.3.1 Asia 3D TSV and 2.5D Market Size by Application (2019-2024)
9.3.2 Asia 3D TSV and 2.5D Market Size by Application (2025-2030)
9.3.3 Asia 3D TSV and 2.5D Market Share by Application (2019-2030)
9.4 Asia 3D TSV and 2.5D Market Size by Region
9.4.1 Asia 3D TSV and 2.5D Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia 3D TSV and 2.5D Market Size by Region (2019-2024)
9.4.3 Asia 3D TSV and 2.5D Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Type
10.2.1 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Application
10.3.1 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Country
10.4.1 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America 3D TSV and 2.5D Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Toshiba
11.1.1 Toshiba Company Details
11.1.2 Toshiba Business Overview
11.1.3 Toshiba 3D TSV and 2.5D Introduction
11.1.4 Toshiba Revenue in 3D TSV and 2.5D Business (2019-2024)
11.1.5 Toshiba Recent Developments
11.2 Taiwan Semiconductor
11.2.1 Taiwan Semiconductor Company Details
11.2.2 Taiwan Semiconductor Business Overview
11.2.3 Taiwan Semiconductor 3D TSV and 2.5D Introduction
11.2.4 Taiwan Semiconductor Revenue in 3D TSV and 2.5D Business (2019-2024)
11.2.5 Taiwan Semiconductor Recent Developments
11.3 Samsung Electronics
11.3.1 Samsung Electronics Company Details
11.3.2 Samsung Electronics Business Overview
11.3.3 Samsung Electronics 3D TSV and 2.5D Introduction
11.3.4 Samsung Electronics Revenue in 3D TSV and 2.5D Business (2019-2024)
11.3.5 Samsung Electronics Recent Developments
11.4 Pure Storage
11.4.1 Pure Storage Company Details
11.4.2 Pure Storage Business Overview
11.4.3 Pure Storage 3D TSV and 2.5D Introduction
11.4.4 Pure Storage Revenue in 3D TSV and 2.5D Business (2019-2024)
11.4.5 Pure Storage Recent Developments
11.5 ASE Group
11.5.1 ASE Group Company Details
11.5.2 ASE Group Business Overview
11.5.3 ASE Group 3D TSV and 2.5D Introduction
11.5.4 ASE Group Revenue in 3D TSV and 2.5D Business (2019-2024)
11.5.5 ASE Group Recent Developments
11.6 Amkor Technology
11.6.1 Amkor Technology Company Details
11.6.2 Amkor Technology Business Overview
11.6.3 Amkor Technology 3D TSV and 2.5D Introduction
11.6.4 Amkor Technology Revenue in 3D TSV and 2.5D Business (2019-2024)
11.6.5 Amkor Technology Recent Developments
11.7 United Microelectronics
11.7.1 United Microelectronics Company Details
11.7.2 United Microelectronics Business Overview
11.7.3 United Microelectronics 3D TSV and 2.5D Introduction
11.7.4 United Microelectronics Revenue in 3D TSV and 2.5D Business (2019-2024)
11.7.5 United Microelectronics Recent Developments
11.8 STMicroelectronics
11.8.1 STMicroelectronics Company Details
11.8.2 STMicroelectronics Business Overview
11.8.3 STMicroelectronics 3D TSV and 2.5D Introduction
11.8.4 STMicroelectronics Revenue in 3D TSV and 2.5D Business (2019-2024)
11.8.5 STMicroelectronics Recent Developments
11.9 Broadcom
11.9.1 Broadcom Company Details
11.9.2 Broadcom Business Overview
11.9.3 Broadcom 3D TSV and 2.5D Introduction
11.9.4 Broadcom Revenue in 3D TSV and 2.5D Business (2019-2024)
11.9.5 Broadcom Recent Developments
11.10 Intel Corporation
11.10.1 Intel Corporation Company Details
11.10.2 Intel Corporation Business Overview
11.10.3 Intel Corporation 3D TSV and 2.5D Introduction
11.10.4 Intel Corporation Revenue in 3D TSV and 2.5D Business (2019-2024)
11.10.5 Intel Corporation Recent Developments
11.11 Jiangsu Changing Electronics Technology
11.11.1 Jiangsu Changing Electronics Technology Company Details
11.11.2 Jiangsu Changing Electronics Technology Business Overview
11.11.3 Jiangsu Changing Electronics Technology 3D TSV and 2.5D Introduction
11.11.4 Jiangsu Changing Electronics Technology Revenue in 3D TSV and 2.5D Business (2019-2024)
11.11.5 Jiangsu Changing Electronics Technology Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Toshiba
Taiwan Semiconductor
Samsung Electronics
Pure Storage
ASE Group
Amkor Technology
United Microelectronics
STMicroelectronics
Broadcom
Intel Corporation
Jiangsu Changing Electronics Technology
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*If Applicable.
