The global market for Adhesives for Electronics Assembly was valued at US$ 1911 million in the year 2024 and is projected to reach a revised size of US$ 2876 million by 2031, growing at a CAGR of 6.1% during the forecast period.
Electronic adhesives are听made from the raw material such as epoxies, silicones, cyanoacrylates, polyurethanes, and polysulfides. They are the part of the electronic components, which is utilized in the assembly and manufacture of electronic circuits and products.
The growing demand for electronic devices, advancements in electronics manufacturing, and the need for efficient and reliable bonding solutions contribute to the growth of the Adhesives for Electronics Assembly market.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Adhesives for Electronics Assembly, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Adhesives for Electronics Assembly.
The Adhesives for Electronics Assembly market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Adhesives for Electronics Assembly market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Adhesives for Electronics Assembly manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
3M
Arkema
Parker Hannifin Corporation
H.B. Fuller
DELO Industrial Adhesives
Panacol-Elosol GmbH
ITW
Dow
Huntsman
Hexion
Meridian Adhesives Group
Sika Group
Permabond
Dymax
Panasonic Electronic
ALTANA AG
Bondline
Boyd Corporation
Wacker Chemie AG
Rogers Corporation
Momentive
ThreeBond Group
Master Bond
Scapa Industrial
Xiamen Weldbond New Material
by Type
Liquid
Paste
Solid
by Application
Consumer Electronics
Industrial
Medical
Transportation
Aviation and Defense
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Adhesives for Electronics Assembly manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Adhesives for Electronics Assembly by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Adhesives for Electronics Assembly in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Adhesives for Electronics Assembly Market Overview
1.1 Product Definition
1.2 Adhesives for Electronics Assembly by Type
1.2.1 Global Adhesives for Electronics Assembly Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Liquid
1.2.3 Paste
1.2.4 Solid
1.3 Adhesives for Electronics Assembly by Application
1.3.1 Global Adhesives for Electronics Assembly Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Medical
1.3.5 Transportation
1.3.6 Aviation and Defense
1.3.7 Others
1.4 Global Market Growth Prospects
1.4.1 Global Adhesives for Electronics Assembly Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Adhesives for Electronics Assembly Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Adhesives for Electronics Assembly Production Estimates and Forecasts (2020-2031)
1.4.4 Global Adhesives for Electronics Assembly Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Adhesives for Electronics Assembly Production Market Share by Manufacturers (2020-2025)
2.2 Global Adhesives for Electronics Assembly Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Adhesives for Electronics Assembly, Industry Ranking, 2023 VS 2024
2.4 Global Adhesives for Electronics Assembly Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Adhesives for Electronics Assembly Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Adhesives for Electronics Assembly, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Adhesives for Electronics Assembly, Product Offered and Application
2.8 Global Key Manufacturers of Adhesives for Electronics Assembly, Date of Enter into This Industry
2.9 Adhesives for Electronics Assembly Market Competitive Situation and Trends
2.9.1 Adhesives for Electronics Assembly Market Concentration Rate
2.9.2 Global 5 and 10 Largest Adhesives for Electronics Assembly Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Adhesives for Electronics Assembly Production by Region
3.1 Global Adhesives for Electronics Assembly Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Adhesives for Electronics Assembly Production Value by Region (2020-2031)
3.2.1 Global Adhesives for Electronics Assembly Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Adhesives for Electronics Assembly by Region (2026-2031)
3.3 Global Adhesives for Electronics Assembly Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Adhesives for Electronics Assembly Production Volume by Region (2020-2031)
3.4.1 Global Adhesives for Electronics Assembly Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Adhesives for Electronics Assembly by Region (2026-2031)
3.5 Global Adhesives for Electronics Assembly Market Price Analysis by Region (2020-2025)
3.6 Global Adhesives for Electronics Assembly Production and Value, Year-over-Year Growth
3.6.1 North America Adhesives for Electronics Assembly Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Adhesives for Electronics Assembly Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Adhesives for Electronics Assembly Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Adhesives for Electronics Assembly Production Value Estimates and Forecasts (2020-2031)
4 Adhesives for Electronics Assembly Consumption by Region
4.1 Global Adhesives for Electronics Assembly Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Adhesives for Electronics Assembly Consumption by Region (2020-2031)
4.2.1 Global Adhesives for Electronics Assembly Consumption by Region (2020-2025)
4.2.2 Global Adhesives for Electronics Assembly Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Adhesives for Electronics Assembly Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Adhesives for Electronics Assembly Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Adhesives for Electronics Assembly Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Adhesives for Electronics Assembly Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Adhesives for Electronics Assembly Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Adhesives for Electronics Assembly Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Adhesives for Electronics Assembly Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Adhesives for Electronics Assembly Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Adhesives for Electronics Assembly Production by Type (2020-2031)
5.1.1 Global Adhesives for Electronics Assembly Production by Type (2020-2025)
5.1.2 Global Adhesives for Electronics Assembly Production by Type (2026-2031)
5.1.3 Global Adhesives for Electronics Assembly Production Market Share by Type (2020-2031)
5.2 Global Adhesives for Electronics Assembly Production Value by Type (2020-2031)
5.2.1 Global Adhesives for Electronics Assembly Production Value by Type (2020-2025)
5.2.2 Global Adhesives for Electronics Assembly Production Value by Type (2026-2031)
5.2.3 Global Adhesives for Electronics Assembly Production Value Market Share by Type (2020-2031)
5.3 Global Adhesives for Electronics Assembly Price by Type (2020-2031)
6 Segment by Application
6.1 Global Adhesives for Electronics Assembly Production by Application (2020-2031)
6.1.1 Global Adhesives for Electronics Assembly Production by Application (2020-2025)
6.1.2 Global Adhesives for Electronics Assembly Production by Application (2026-2031)
6.1.3 Global Adhesives for Electronics Assembly Production Market Share by Application (2020-2031)
6.2 Global Adhesives for Electronics Assembly Production Value by Application (2020-2031)
6.2.1 Global Adhesives for Electronics Assembly Production Value by Application (2020-2025)
6.2.2 Global Adhesives for Electronics Assembly Production Value by Application (2026-2031)
6.2.3 Global Adhesives for Electronics Assembly Production Value Market Share by Application (2020-2031)
6.3 Global Adhesives for Electronics Assembly Price by Application (2020-2031)
7 Key Companies Profiled
7.1 3M
7.1.1 3M Adhesives for Electronics Assembly Company Information
7.1.2 3M Adhesives for Electronics Assembly Product Portfolio
7.1.3 3M Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.1.4 3M Main Business and Markets Served
7.1.5 3M Recent Developments/Updates
7.2 Arkema
7.2.1 Arkema Adhesives for Electronics Assembly Company Information
7.2.2 Arkema Adhesives for Electronics Assembly Product Portfolio
7.2.3 Arkema Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Arkema Main Business and Markets Served
7.2.5 Arkema Recent Developments/Updates
7.3 Parker Hannifin Corporation
7.3.1 Parker Hannifin Corporation Adhesives for Electronics Assembly Company Information
7.3.2 Parker Hannifin Corporation Adhesives for Electronics Assembly Product Portfolio
7.3.3 Parker Hannifin Corporation Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Parker Hannifin Corporation Main Business and Markets Served
7.3.5 Parker Hannifin Corporation Recent Developments/Updates
7.4 H.B. Fuller
7.4.1 H.B. Fuller Adhesives for Electronics Assembly Company Information
7.4.2 H.B. Fuller Adhesives for Electronics Assembly Product Portfolio
7.4.3 H.B. Fuller Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.4.4 H.B. Fuller Main Business and Markets Served
7.4.5 H.B. Fuller Recent Developments/Updates
7.5 DELO Industrial Adhesives
7.5.1 DELO Industrial Adhesives Adhesives for Electronics Assembly Company Information
7.5.2 DELO Industrial Adhesives Adhesives for Electronics Assembly Product Portfolio
7.5.3 DELO Industrial Adhesives Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.5.4 DELO Industrial Adhesives Main Business and Markets Served
7.5.5 DELO Industrial Adhesives Recent Developments/Updates
7.6 Panacol-Elosol GmbH
7.6.1 Panacol-Elosol GmbH Adhesives for Electronics Assembly Company Information
7.6.2 Panacol-Elosol GmbH Adhesives for Electronics Assembly Product Portfolio
7.6.3 Panacol-Elosol GmbH Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Panacol-Elosol GmbH Main Business and Markets Served
7.6.5 Panacol-Elosol GmbH Recent Developments/Updates
7.7 ITW
7.7.1 ITW Adhesives for Electronics Assembly Company Information
7.7.2 ITW Adhesives for Electronics Assembly Product Portfolio
7.7.3 ITW Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.7.4 ITW Main Business and Markets Served
7.7.5 ITW Recent Developments/Updates
7.8 Dow
7.8.1 Dow Adhesives for Electronics Assembly Company Information
7.8.2 Dow Adhesives for Electronics Assembly Product Portfolio
7.8.3 Dow Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Dow Main Business and Markets Served
7.8.5 Dow Recent Developments/Updates
7.9 Huntsman
7.9.1 Huntsman Adhesives for Electronics Assembly Company Information
7.9.2 Huntsman Adhesives for Electronics Assembly Product Portfolio
7.9.3 Huntsman Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Huntsman Main Business and Markets Served
7.9.5 Huntsman Recent Developments/Updates
7.10 Hexion
7.10.1 Hexion Adhesives for Electronics Assembly Company Information
7.10.2 Hexion Adhesives for Electronics Assembly Product Portfolio
7.10.3 Hexion Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Hexion Main Business and Markets Served
7.10.5 Hexion Recent Developments/Updates
7.11 Meridian Adhesives Group
7.11.1 Meridian Adhesives Group Adhesives for Electronics Assembly Company Information
7.11.2 Meridian Adhesives Group Adhesives for Electronics Assembly Product Portfolio
7.11.3 Meridian Adhesives Group Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Meridian Adhesives Group Main Business and Markets Served
7.11.5 Meridian Adhesives Group Recent Developments/Updates
7.12 Sika Group
7.12.1 Sika Group Adhesives for Electronics Assembly Company Information
7.12.2 Sika Group Adhesives for Electronics Assembly Product Portfolio
7.12.3 Sika Group Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Sika Group Main Business and Markets Served
7.12.5 Sika Group Recent Developments/Updates
7.13 Permabond
7.13.1 Permabond Adhesives for Electronics Assembly Company Information
7.13.2 Permabond Adhesives for Electronics Assembly Product Portfolio
7.13.3 Permabond Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Permabond Main Business and Markets Served
7.13.5 Permabond Recent Developments/Updates
7.14 Dymax
7.14.1 Dymax Adhesives for Electronics Assembly Company Information
7.14.2 Dymax Adhesives for Electronics Assembly Product Portfolio
7.14.3 Dymax Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Dymax Main Business and Markets Served
7.14.5 Dymax Recent Developments/Updates
7.15 Panasonic Electronic
7.15.1 Panasonic Electronic Adhesives for Electronics Assembly Company Information
7.15.2 Panasonic Electronic Adhesives for Electronics Assembly Product Portfolio
7.15.3 Panasonic Electronic Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Panasonic Electronic Main Business and Markets Served
7.15.5 Panasonic Electronic Recent Developments/Updates
7.16 ALTANA AG
7.16.1 ALTANA AG Adhesives for Electronics Assembly Company Information
7.16.2 ALTANA AG Adhesives for Electronics Assembly Product Portfolio
7.16.3 ALTANA AG Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.16.4 ALTANA AG Main Business and Markets Served
7.16.5 ALTANA AG Recent Developments/Updates
7.17 Bondline
7.17.1 Bondline Adhesives for Electronics Assembly Company Information
7.17.2 Bondline Adhesives for Electronics Assembly Product Portfolio
7.17.3 Bondline Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Bondline Main Business and Markets Served
7.17.5 Bondline Recent Developments/Updates
7.18 Boyd Corporation
7.18.1 Boyd Corporation Adhesives for Electronics Assembly Company Information
7.18.2 Boyd Corporation Adhesives for Electronics Assembly Product Portfolio
7.18.3 Boyd Corporation Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Boyd Corporation Main Business and Markets Served
7.18.5 Boyd Corporation Recent Developments/Updates
7.19 Wacker Chemie AG
7.19.1 Wacker Chemie AG Adhesives for Electronics Assembly Company Information
7.19.2 Wacker Chemie AG Adhesives for Electronics Assembly Product Portfolio
7.19.3 Wacker Chemie AG Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Wacker Chemie AG Main Business and Markets Served
7.19.5 Wacker Chemie AG Recent Developments/Updates
7.20 Rogers Corporation
7.20.1 Rogers Corporation Adhesives for Electronics Assembly Company Information
7.20.2 Rogers Corporation Adhesives for Electronics Assembly Product Portfolio
7.20.3 Rogers Corporation Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.20.4 Rogers Corporation Main Business and Markets Served
7.20.5 Rogers Corporation Recent Developments/Updates
7.21 Momentive
7.21.1 Momentive Adhesives for Electronics Assembly Company Information
7.21.2 Momentive Adhesives for Electronics Assembly Product Portfolio
7.21.3 Momentive Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.21.4 Momentive Main Business and Markets Served
7.21.5 Momentive Recent Developments/Updates
7.22 ThreeBond Group
7.22.1 ThreeBond Group Adhesives for Electronics Assembly Company Information
7.22.2 ThreeBond Group Adhesives for Electronics Assembly Product Portfolio
7.22.3 ThreeBond Group Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.22.4 ThreeBond Group Main Business and Markets Served
7.22.5 ThreeBond Group Recent Developments/Updates
7.23 Master Bond
7.23.1 Master Bond Adhesives for Electronics Assembly Company Information
7.23.2 Master Bond Adhesives for Electronics Assembly Product Portfolio
7.23.3 Master Bond Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.23.4 Master Bond Main Business and Markets Served
7.23.5 Master Bond Recent Developments/Updates
7.24 Scapa Industrial
7.24.1 Scapa Industrial Adhesives for Electronics Assembly Company Information
7.24.2 Scapa Industrial Adhesives for Electronics Assembly Product Portfolio
7.24.3 Scapa Industrial Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.24.4 Scapa Industrial Main Business and Markets Served
7.24.5 Scapa Industrial Recent Developments/Updates
7.25 Xiamen Weldbond New Material
7.25.1 Xiamen Weldbond New Material Adhesives for Electronics Assembly Company Information
7.25.2 Xiamen Weldbond New Material Adhesives for Electronics Assembly Product Portfolio
7.25.3 Xiamen Weldbond New Material Adhesives for Electronics Assembly Production, Value, Price and Gross Margin (2020-2025)
7.25.4 Xiamen Weldbond New Material Main Business and Markets Served
7.25.5 Xiamen Weldbond New Material Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Adhesives for Electronics Assembly Industry Chain Analysis
8.2 Adhesives for Electronics Assembly Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Adhesives for Electronics Assembly Production Mode & Process Analysis
8.4 Adhesives for Electronics Assembly Sales and Marketing
8.4.1 Adhesives for Electronics Assembly Sales Channels
8.4.2 Adhesives for Electronics Assembly Distributors
8.5 Adhesives for Electronics Assembly Customer Analysis
9 Adhesives for Electronics Assembly Market Dynamics
9.1 Adhesives for Electronics Assembly Industry Trends
9.2 Adhesives for Electronics Assembly Market Drivers
9.3 Adhesives for Electronics Assembly Market Challenges
9.4 Adhesives for Electronics Assembly Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
3M
Arkema
Parker Hannifin Corporation
H.B. Fuller
DELO Industrial Adhesives
Panacol-Elosol GmbH
ITW
Dow
Huntsman
Hexion
Meridian Adhesives Group
Sika Group
Permabond
Dymax
Panasonic Electronic
ALTANA AG
Bondline
Boyd Corporation
Wacker Chemie AG
Rogers Corporation
Momentive
ThreeBond Group
Master Bond
Scapa Industrial
Xiamen Weldbond New Material
听
听
*If Applicable.
