Global Advanced Electronic Packaging Materials Market Research Report 2025

Publication ID:

PB501251725

Publication Date:

January 27, 2025

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global market for Advanced Electronic Packaging Materials was valued at US$ 11220 million in the year 2024 and is projected to reach a revised size of US$ 16670 million by 2031, growing at a CAGR of 5.9% during the forecast period.
Advanced Electronic Packaging Materials include electronic packaging and electronic assembly materials. The main types of materials are: potting, encapsulation and plastic packaging materials, ceramics and glass, soldering materials, electroplating and deposition of metal coatings, bonding materials, printed circuit board materials , packaging substrates, adhesives for electronic packaging and assembly, lower fillers and coatings, and thermal management materials, etc. The report mainly studies electronic-grade adhesives and functional film materials.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Advanced Electronic Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced Electronic Packaging Materials.
The Advanced Electronic Packaging Materials market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Advanced Electronic Packaging Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Advanced Electronic Packaging Materials companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Nitto
Sumitomo Bakelite
Darbond Technology
Huitian New Material
Crystal Clear Electronic Material
Cybrid Technologies
Suzhou Shihua Technology
Segment by Type
Electronic Grade Adhesives
Functional Film Material
Segment by Application
Integrated Circuit Packaging
Smart Terminal Packaging
Power Battery
Photovoltaic Cell Packaging
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Advanced Electronic Packaging Materials company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Advanced Electronic Packaging Materials Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Electronic Grade Adhesives
1.2.3 Functional Film Material
1.3 Market by Application
1.3.1 Global Advanced Electronic Packaging Materials Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Integrated Circuit Packaging
1.3.3 Smart Terminal Packaging
1.3.4 Power Battery
1.3.5 Photovoltaic Cell Packaging
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Advanced Electronic Packaging Materials Market Perspective (2020-2031)
2.2 Global Advanced Electronic Packaging Materials Growth Trends by Region
2.2.1 Global Advanced Electronic Packaging Materials Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 Advanced Electronic Packaging Materials Historic Market Size by Region (2020-2025)
2.2.3 Advanced Electronic Packaging Materials Forecasted Market Size by Region (2026-2031)
2.3 Advanced Electronic Packaging Materials Market Dynamics
2.3.1 Advanced Electronic Packaging Materials Industry Trends
2.3.2 Advanced Electronic Packaging Materials Market Drivers
2.3.3 Advanced Electronic Packaging Materials Market Challenges
2.3.4 Advanced Electronic Packaging Materials Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Advanced Electronic Packaging Materials Players by Revenue
3.1.1 Global Top Advanced Electronic Packaging Materials Players by Revenue (2020-2025)
3.1.2 Global Advanced Electronic Packaging Materials Revenue Market Share by Players (2020-2025)
3.2 Global Advanced Electronic Packaging Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Advanced Electronic Packaging Materials Revenue
3.4 Global Advanced Electronic Packaging Materials Market Concentration Ratio
3.4.1 Global Advanced Electronic Packaging Materials Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Advanced Electronic Packaging Materials Revenue in 2024
3.5 Global Key Players of Advanced Electronic Packaging Materials Head office and Area Served
3.6 Global Key Players of Advanced Electronic Packaging Materials, Product and Application
3.7 Global Key Players of Advanced Electronic Packaging Materials, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Advanced Electronic Packaging Materials Breakdown Data by Type
4.1 Global Advanced Electronic Packaging Materials Historic Market Size by Type (2020-2025)
4.2 Global Advanced Electronic Packaging Materials Forecasted Market Size by Type (2026-2031)
5 Advanced Electronic Packaging Materials Breakdown Data by Application
5.1 Global Advanced Electronic Packaging Materials Historic Market Size by Application (2020-2025)
5.2 Global Advanced Electronic Packaging Materials Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America Advanced Electronic Packaging Materials Market Size (2020-2031)
6.2 North America Advanced Electronic Packaging Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America Advanced Electronic Packaging Materials Market Size by Country (2020-2025)
6.4 North America Advanced Electronic Packaging Materials Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Advanced Electronic Packaging Materials Market Size (2020-2031)
7.2 Europe Advanced Electronic Packaging Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe Advanced Electronic Packaging Materials Market Size by Country (2020-2025)
7.4 Europe Advanced Electronic Packaging Materials Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Advanced Electronic Packaging Materials Market Size (2020-2031)
8.2 Asia-Pacific Advanced Electronic Packaging Materials Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific Advanced Electronic Packaging Materials Market Size by Region (2020-2025)
8.4 Asia-Pacific Advanced Electronic Packaging Materials Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Advanced Electronic Packaging Materials Market Size (2020-2031)
9.2 Latin America Advanced Electronic Packaging Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America Advanced Electronic Packaging Materials Market Size by Country (2020-2025)
9.4 Latin America Advanced Electronic Packaging Materials Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Advanced Electronic Packaging Materials Market Size (2020-2031)
10.2 Middle East & Africa Advanced Electronic Packaging Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa Advanced Electronic Packaging Materials Market Size by Country (2020-2025)
10.4 Middle East & Africa Advanced Electronic Packaging Materials Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Panasonic
11.1.1 Panasonic Company Details
11.1.2 Panasonic Business Overview
11.1.3 Panasonic Advanced Electronic Packaging Materials Introduction
11.1.4 Panasonic Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.1.5 Panasonic Recent Development
11.2 Henkel
11.2.1 Henkel Company Details
11.2.2 Henkel Business Overview
11.2.3 Henkel Advanced Electronic Packaging Materials Introduction
11.2.4 Henkel Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.2.5 Henkel Recent Development
11.3 Shin-Etsu MicroSi
11.3.1 Shin-Etsu MicroSi Company Details
11.3.2 Shin-Etsu MicroSi Business Overview
11.3.3 Shin-Etsu MicroSi Advanced Electronic Packaging Materials Introduction
11.3.4 Shin-Etsu MicroSi Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.3.5 Shin-Etsu MicroSi Recent Development
11.4 Lord
11.4.1 Lord Company Details
11.4.2 Lord Business Overview
11.4.3 Lord Advanced Electronic Packaging Materials Introduction
11.4.4 Lord Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.4.5 Lord Recent Development
11.5 Nitto
11.5.1 Nitto Company Details
11.5.2 Nitto Business Overview
11.5.3 Nitto Advanced Electronic Packaging Materials Introduction
11.5.4 Nitto Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.5.5 Nitto Recent Development
11.6 Sumitomo Bakelite
11.6.1 Sumitomo Bakelite Company Details
11.6.2 Sumitomo Bakelite Business Overview
11.6.3 Sumitomo Bakelite Advanced Electronic Packaging Materials Introduction
11.6.4 Sumitomo Bakelite Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.6.5 Sumitomo Bakelite Recent Development
11.7 Darbond Technology
11.7.1 Darbond Technology Company Details
11.7.2 Darbond Technology Business Overview
11.7.3 Darbond Technology Advanced Electronic Packaging Materials Introduction
11.7.4 Darbond Technology Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.7.5 Darbond Technology Recent Development
11.8 Huitian New Material
11.8.1 Huitian New Material Company Details
11.8.2 Huitian New Material Business Overview
11.8.3 Huitian New Material Advanced Electronic Packaging Materials Introduction
11.8.4 Huitian New Material Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.8.5 Huitian New Material Recent Development
11.9 Crystal Clear Electronic Material
11.9.1 Crystal Clear Electronic Material Company Details
11.9.2 Crystal Clear Electronic Material Business Overview
11.9.3 Crystal Clear Electronic Material Advanced Electronic Packaging Materials Introduction
11.9.4 Crystal Clear Electronic Material Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.9.5 Crystal Clear Electronic Material Recent Development
11.10 Cybrid Technologies
11.10.1 Cybrid Technologies Company Details
11.10.2 Cybrid Technologies Business Overview
11.10.3 Cybrid Technologies Advanced Electronic Packaging Materials Introduction
11.10.4 Cybrid Technologies Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.10.5 Cybrid Technologies Recent Development
11.11 Suzhou Shihua Technology
11.11.1 Suzhou Shihua Technology Company Details
11.11.2 Suzhou Shihua Technology Business Overview
11.11.3 Suzhou Shihua Technology Advanced Electronic Packaging Materials Introduction
11.11.4 Suzhou Shihua Technology Revenue in Advanced Electronic Packaging Materials Business (2020-2025)
11.11.5 Suzhou Shihua Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer

Companies Mentioned:

Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Nitto
Sumitomo Bakelite
Darbond Technology
Huitian New Material
Crystal Clear Electronic Material
Cybrid Technologies
Suzhou Shihua Technology

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.

91制片厂