Global Advanced IC Packaging Solution Market Research Report 2024

Publication ID:

PB509246394

Publication Date:

September 5, 2024

Pages:

100

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

Advanced IC (Integrated Circuit) packaging is a critical technology in semiconductor manufacturing that focuses on improving the performance, efficiency, and form factor of electronic devices. As chip designs become more complex and power demands increase, advanced IC packaging techniques have become essential. The Advanced IC Packaging Solutions catalog includes advanced IC packaging design software tools and advanced IC packaging processing services.
The global Advanced IC Packaging Solution market was valued at US$ 12490 million in 2023 and is anticipated to reach US$ 18480 million by 2030, witnessing a CAGR of 5.7% during the forecast period 2024-2030.
Overseas mergers and acquisitions in recent years have allowed Chinese packaging and testing enterprises to quickly gain access to technology and markets, make up for some structural deficiencies, and greatly promote the upward development of China's packaging and testing industry. China's IC packaging industry started early and developed quickly, but is still dominated by traditional packaging. Although in recent years China's local advanced packaging and testing four strong (JCET Group, TongFu Microelectronics Co,Ltd, Tianshui Huatian Technology Co, China Wafer Level CSP Co., Ltd) through independent research and development and mergers and acquisitions, has basically formed the industrialization of advanced packaging capacity, but from the advanced packaging revenue accounted for the proportion of total revenue and high-density integration and other advanced packaging technology development, China's overall advanced packaging technology level and the international leading level there is still a certain gap.
This report aims to provide a comprehensive presentation of the global market for Advanced IC Packaging Solution, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced IC Packaging Solution.
The Advanced IC Packaging Solution market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Advanced IC Packaging Solution market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Advanced IC Packaging Solution companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Siemens Digital Industries Software
PCB Technologies
Grand Process Technology
Confovis GmbH
ASMPT
ASE
Taiwan Semiconductor Manufacturing Company Limited
SPTS Technologies
Amkor Technology
JCET Group
Ams-OSRAM AG
Global Unichip Corp
Brooks Automation
TongFu Microelectronics Co.,Ltd
Tianshui Huatian Technology Co., Ltd
China Wafer Level CSP Co., Ltd
Powertech Technology
ChipMOS Technologies
Segment by Type
Software
Service
Segment by Application
Consumer Electronics
Industrial
Medical Equipment
Automotive
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Advanced IC Packaging Solution company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Advanced IC Packaging Solution Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Software
1.2.3 Service
1.3 Market by Application
1.3.1 Global Advanced IC Packaging Solution Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Medical Equipment
1.3.5 Automotive
1.3.6 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Advanced IC Packaging Solution Market Perspective (2019-2030)
2.2 Global Advanced IC Packaging Solution Growth Trends by Region
2.2.1 Global Advanced IC Packaging Solution Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Advanced IC Packaging Solution Historic Market Size by Region (2019-2024)
2.2.3 Advanced IC Packaging Solution Forecasted Market Size by Region (2025-2030)
2.3 Advanced IC Packaging Solution Market Dynamics
2.3.1 Advanced IC Packaging Solution Industry Trends
2.3.2 Advanced IC Packaging Solution Market Drivers
2.3.3 Advanced IC Packaging Solution Market Challenges
2.3.4 Advanced IC Packaging Solution Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Advanced IC Packaging Solution Players by Revenue
3.1.1 Global Top Advanced IC Packaging Solution Players by Revenue (2019-2024)
3.1.2 Global Advanced IC Packaging Solution Revenue Market Share by Players (2019-2024)
3.2 Global Advanced IC Packaging Solution Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Advanced IC Packaging Solution Revenue
3.4 Global Advanced IC Packaging Solution Market Concentration Ratio
3.4.1 Global Advanced IC Packaging Solution Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Advanced IC Packaging Solution Revenue in 2023
3.5 Global Key Players of Advanced IC Packaging Solution Head office and Area Served
3.6 Global Key Players of Advanced IC Packaging Solution, Product and Application
3.7 Global Key Players of Advanced IC Packaging Solution, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Advanced IC Packaging Solution Breakdown Data by Type
4.1 Global Advanced IC Packaging Solution Historic Market Size by Type (2019-2024)
4.2 Global Advanced IC Packaging Solution Forecasted Market Size by Type (2025-2030)
5 Advanced IC Packaging Solution Breakdown Data by Application
5.1 Global Advanced IC Packaging Solution Historic Market Size by Application (2019-2024)
5.2 Global Advanced IC Packaging Solution Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Advanced IC Packaging Solution Market Size (2019-2030)
6.2 North America Advanced IC Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Advanced IC Packaging Solution Market Size by Country (2019-2024)
6.4 North America Advanced IC Packaging Solution Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Advanced IC Packaging Solution Market Size (2019-2030)
7.2 Europe Advanced IC Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Advanced IC Packaging Solution Market Size by Country (2019-2024)
7.4 Europe Advanced IC Packaging Solution Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Advanced IC Packaging Solution Market Size (2019-2030)
8.2 Asia-Pacific Advanced IC Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Advanced IC Packaging Solution Market Size by Region (2019-2024)
8.4 Asia-Pacific Advanced IC Packaging Solution Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Advanced IC Packaging Solution Market Size (2019-2030)
9.2 Latin America Advanced IC Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Advanced IC Packaging Solution Market Size by Country (2019-2024)
9.4 Latin America Advanced IC Packaging Solution Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Advanced IC Packaging Solution Market Size (2019-2030)
10.2 Middle East & Africa Advanced IC Packaging Solution Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Advanced IC Packaging Solution Market Size by Country (2019-2024)
10.4 Middle East & Africa Advanced IC Packaging Solution Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Siemens Digital Industries Software
11.1.1 Siemens Digital Industries Software Company Details
11.1.2 Siemens Digital Industries Software Business Overview
11.1.3 Siemens Digital Industries Software Advanced IC Packaging Solution Introduction
11.1.4 Siemens Digital Industries Software Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.1.5 Siemens Digital Industries Software Recent Development
11.2 PCB Technologies
11.2.1 PCB Technologies Company Details
11.2.2 PCB Technologies Business Overview
11.2.3 PCB Technologies Advanced IC Packaging Solution Introduction
11.2.4 PCB Technologies Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.2.5 PCB Technologies Recent Development
11.3 Grand Process Technology
11.3.1 Grand Process Technology Company Details
11.3.2 Grand Process Technology Business Overview
11.3.3 Grand Process Technology Advanced IC Packaging Solution Introduction
11.3.4 Grand Process Technology Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.3.5 Grand Process Technology Recent Development
11.4 Confovis GmbH
11.4.1 Confovis GmbH Company Details
11.4.2 Confovis GmbH Business Overview
11.4.3 Confovis GmbH Advanced IC Packaging Solution Introduction
11.4.4 Confovis GmbH Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.4.5 Confovis GmbH Recent Development
11.5 ASMPT
11.5.1 ASMPT Company Details
11.5.2 ASMPT Business Overview
11.5.3 ASMPT Advanced IC Packaging Solution Introduction
11.5.4 ASMPT Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.5.5 ASMPT Recent Development
11.6 ASE
11.6.1 ASE Company Details
11.6.2 ASE Business Overview
11.6.3 ASE Advanced IC Packaging Solution Introduction
11.6.4 ASE Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.6.5 ASE Recent Development
11.7 Taiwan Semiconductor Manufacturing Company Limited
11.7.1 Taiwan Semiconductor Manufacturing Company Limited Company Details
11.7.2 Taiwan Semiconductor Manufacturing Company Limited Business Overview
11.7.3 Taiwan Semiconductor Manufacturing Company Limited Advanced IC Packaging Solution Introduction
11.7.4 Taiwan Semiconductor Manufacturing Company Limited Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.7.5 Taiwan Semiconductor Manufacturing Company Limited Recent Development
11.8 SPTS Technologies
11.8.1 SPTS Technologies Company Details
11.8.2 SPTS Technologies Business Overview
11.8.3 SPTS Technologies Advanced IC Packaging Solution Introduction
11.8.4 SPTS Technologies Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.8.5 SPTS Technologies Recent Development
11.9 Amkor Technology
11.9.1 Amkor Technology Company Details
11.9.2 Amkor Technology Business Overview
11.9.3 Amkor Technology Advanced IC Packaging Solution Introduction
11.9.4 Amkor Technology Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.9.5 Amkor Technology Recent Development
11.10 JCET Group
11.10.1 JCET Group Company Details
11.10.2 JCET Group Business Overview
11.10.3 JCET Group Advanced IC Packaging Solution Introduction
11.10.4 JCET Group Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.10.5 JCET Group Recent Development
11.11 Ams-OSRAM AG
11.11.1 Ams-OSRAM AG Company Details
11.11.2 Ams-OSRAM AG Business Overview
11.11.3 Ams-OSRAM AG Advanced IC Packaging Solution Introduction
11.11.4 Ams-OSRAM AG Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.11.5 Ams-OSRAM AG Recent Development
11.12 Global Unichip Corp
11.12.1 Global Unichip Corp Company Details
11.12.2 Global Unichip Corp Business Overview
11.12.3 Global Unichip Corp Advanced IC Packaging Solution Introduction
11.12.4 Global Unichip Corp Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.12.5 Global Unichip Corp Recent Development
11.13 Brooks Automation
11.13.1 Brooks Automation Company Details
11.13.2 Brooks Automation Business Overview
11.13.3 Brooks Automation Advanced IC Packaging Solution Introduction
11.13.4 Brooks Automation Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.13.5 Brooks Automation Recent Development
11.14 TongFu Microelectronics Co.,Ltd
11.14.1 TongFu Microelectronics Co.,Ltd Company Details
11.14.2 TongFu Microelectronics Co.,Ltd Business Overview
11.14.3 TongFu Microelectronics Co.,Ltd Advanced IC Packaging Solution Introduction
11.14.4 TongFu Microelectronics Co.,Ltd Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.14.5 TongFu Microelectronics Co.,Ltd Recent Development
11.15 Tianshui Huatian Technology Co., Ltd
11.15.1 Tianshui Huatian Technology Co., Ltd Company Details
11.15.2 Tianshui Huatian Technology Co., Ltd Business Overview
11.15.3 Tianshui Huatian Technology Co., Ltd Advanced IC Packaging Solution Introduction
11.15.4 Tianshui Huatian Technology Co., Ltd Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.15.5 Tianshui Huatian Technology Co., Ltd Recent Development
11.16 China Wafer Level CSP Co., Ltd
11.16.1 China Wafer Level CSP Co., Ltd Company Details
11.16.2 China Wafer Level CSP Co., Ltd Business Overview
11.16.3 China Wafer Level CSP Co., Ltd Advanced IC Packaging Solution Introduction
11.16.4 China Wafer Level CSP Co., Ltd Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.16.5 China Wafer Level CSP Co., Ltd Recent Development
11.17 Powertech Technology
11.17.1 Powertech Technology Company Details
11.17.2 Powertech Technology Business Overview
11.17.3 Powertech Technology Advanced IC Packaging Solution Introduction
11.17.4 Powertech Technology Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.17.5 Powertech Technology Recent Development
11.18 ChipMOS Technologies
11.18.1 ChipMOS Technologies Company Details
11.18.2 ChipMOS Technologies Business Overview
11.18.3 ChipMOS Technologies Advanced IC Packaging Solution Introduction
11.18.4 ChipMOS Technologies Revenue in Advanced IC Packaging Solution Business (2019-2024)
11.18.5 ChipMOS Technologies Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer

Companies Mentioned:

Siemens Digital Industries Software
PCB Technologies
Grand Process Technology
Confovis GmbH
ASMPT
ASE
Taiwan Semiconductor Manufacturing Company Limited
SPTS Technologies
Amkor Technology
JCET Group
Ams-OSRAM AG
Global Unichip Corp
Brooks Automation
TongFu Microelectronics Co.,Ltd
Tianshui Huatian Technology Co., Ltd
China Wafer Level CSP Co., Ltd
Powertech Technology
ChipMOS Technologies

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