Global Advanced Packaging for Semiconductor Market Research Report 2023

Publication ID:

PB510233665

Publication Date:

October 20, 2023

Pages:

100

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.
The global Advanced Packaging for Semiconductor market is projected to reach US$ 20380 million in 2029, increasing from US$ 15670 million in 2022, with the CAGR of 3.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Advanced Packaging for Semiconductor 91制片厂.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Advanced Packaging for Semiconductor market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other End Users
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Advanced Packaging for Semiconductor report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies鈥� Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies鈥� Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Advanced Packaging for Semiconductor Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
1.2.3 Fan-In Wafer-Level Packaging (FI WLP)
1.2.4 Flip Chip (FC)
1.2.5 2.5D/3D
1.3 Market by Application
1.3.1 Global Advanced Packaging for Semiconductor Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other End Users
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Advanced Packaging for Semiconductor Market Perspective (2018-2029)
2.2 Advanced Packaging for Semiconductor Growth Trends by Region
2.2.1 Global Advanced Packaging for Semiconductor Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Advanced Packaging for Semiconductor Historic Market Size by Region (2018-2023)
2.2.3 Advanced Packaging for Semiconductor Forecasted Market Size by Region (2024-2029)
2.3 Advanced Packaging for Semiconductor Market Dynamics
2.3.1 Advanced Packaging for Semiconductor Industry Trends
2.3.2 Advanced Packaging for Semiconductor Market Drivers
2.3.3 Advanced Packaging for Semiconductor Market Challenges
2.3.4 Advanced Packaging for Semiconductor Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Advanced Packaging for Semiconductor Players by Revenue
3.1.1 Global Top Advanced Packaging for Semiconductor Players by Revenue (2018-2023)
3.1.2 Global Advanced Packaging for Semiconductor Revenue Market Share by Players (2018-2023)
3.2 Global Advanced Packaging for Semiconductor Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Advanced Packaging for Semiconductor Revenue
3.4 Global Advanced Packaging for Semiconductor Market Concentration Ratio
3.4.1 Global Advanced Packaging for Semiconductor Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Advanced Packaging for Semiconductor Revenue in 2022
3.5 Advanced Packaging for Semiconductor Key Players Head office and Area Served
3.6 Key Players Advanced Packaging for Semiconductor Product Solution and Service
3.7 Date of Enter into Advanced Packaging for Semiconductor Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Advanced Packaging for Semiconductor Breakdown Data by Type
4.1 Global Advanced Packaging for Semiconductor Historic Market Size by Type (2018-2023)
4.2 Global Advanced Packaging for Semiconductor Forecasted Market Size by Type (2024-2029)
5 Advanced Packaging for Semiconductor Breakdown Data by Application
5.1 Global Advanced Packaging for Semiconductor Historic Market Size by Application (2018-2023)
5.2 Global Advanced Packaging for Semiconductor Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Advanced Packaging for Semiconductor Market Size (2018-2029)
6.2 North America Advanced Packaging for Semiconductor Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Advanced Packaging for Semiconductor Market Size by Country (2018-2023)
6.4 North America Advanced Packaging for Semiconductor Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Advanced Packaging for Semiconductor Market Size (2018-2029)
7.2 Europe Advanced Packaging for Semiconductor Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Advanced Packaging for Semiconductor Market Size by Country (2018-2023)
7.4 Europe Advanced Packaging for Semiconductor Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Advanced Packaging for Semiconductor Market Size (2018-2029)
8.2 Asia-Pacific Advanced Packaging for Semiconductor Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Advanced Packaging for Semiconductor Market Size by Region (2018-2023)
8.4 Asia-Pacific Advanced Packaging for Semiconductor Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Advanced Packaging for Semiconductor Market Size (2018-2029)
9.2 Latin America Advanced Packaging for Semiconductor Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Advanced Packaging for Semiconductor Market Size by Country (2018-2023)
9.4 Latin America Advanced Packaging for Semiconductor Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Advanced Packaging for Semiconductor Market Size (2018-2029)
10.2 Middle East & Africa Advanced Packaging for Semiconductor Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Advanced Packaging for Semiconductor Market Size by Country (2018-2023)
10.4 Middle East & Africa Advanced Packaging for Semiconductor Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor
11.1.1 Amkor Company Detail
11.1.2 Amkor Business Overview
11.1.3 Amkor Advanced Packaging for Semiconductor Introduction
11.1.4 Amkor Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.1.5 Amkor Recent Development
11.2 SPIL
11.2.1 SPIL Company Detail
11.2.2 SPIL Business Overview
11.2.3 SPIL Advanced Packaging for Semiconductor Introduction
11.2.4 SPIL Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.2.5 SPIL Recent Development
11.3 Intel Corp
11.3.1 Intel Corp Company Detail
11.3.2 Intel Corp Business Overview
11.3.3 Intel Corp Advanced Packaging for Semiconductor Introduction
11.3.4 Intel Corp Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.3.5 Intel Corp Recent Development
11.4 JCET
11.4.1 JCET Company Detail
11.4.2 JCET Business Overview
11.4.3 JCET Advanced Packaging for Semiconductor Introduction
11.4.4 JCET Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.4.5 JCET Recent Development
11.5 ASE
11.5.1 ASE Company Detail
11.5.2 ASE Business Overview
11.5.3 ASE Advanced Packaging for Semiconductor Introduction
11.5.4 ASE Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.5.5 ASE Recent Development
11.6 TFME
11.6.1 TFME Company Detail
11.6.2 TFME Business Overview
11.6.3 TFME Advanced Packaging for Semiconductor Introduction
11.6.4 TFME Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.6.5 TFME Recent Development
11.7 TSMC
11.7.1 TSMC Company Detail
11.7.2 TSMC Business Overview
11.7.3 TSMC Advanced Packaging for Semiconductor Introduction
11.7.4 TSMC Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.7.5 TSMC Recent Development
11.8 Huatian
11.8.1 Huatian Company Detail
11.8.2 Huatian Business Overview
11.8.3 Huatian Advanced Packaging for Semiconductor Introduction
11.8.4 Huatian Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.8.5 Huatian Recent Development
11.9 Powertech Technology Inc
11.9.1 Powertech Technology Inc Company Detail
11.9.2 Powertech Technology Inc Business Overview
11.9.3 Powertech Technology Inc Advanced Packaging for Semiconductor Introduction
11.9.4 Powertech Technology Inc Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.9.5 Powertech Technology Inc Recent Development
11.10 UTAC
11.10.1 UTAC Company Detail
11.10.2 UTAC Business Overview
11.10.3 UTAC Advanced Packaging for Semiconductor Introduction
11.10.4 UTAC Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.10.5 UTAC Recent Development
11.11 Nepes
11.11.1 Nepes Company Detail
11.11.2 Nepes Business Overview
11.11.3 Nepes Advanced Packaging for Semiconductor Introduction
11.11.4 Nepes Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.11.5 Nepes Recent Development
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Detail
11.12.2 Walton Advanced Engineering Business Overview
11.12.3 Walton Advanced Engineering Advanced Packaging for Semiconductor Introduction
11.12.4 Walton Advanced Engineering Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.12.5 Walton Advanced Engineering Recent Development
11.13 Kyocera
11.13.1 Kyocera Company Detail
11.13.2 Kyocera Business Overview
11.13.3 Kyocera Advanced Packaging for Semiconductor Introduction
11.13.4 Kyocera Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.13.5 Kyocera Recent Development
11.14 Chipbond
11.14.1 Chipbond Company Detail
11.14.2 Chipbond Business Overview
11.14.3 Chipbond Advanced Packaging for Semiconductor Introduction
11.14.4 Chipbond Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.14.5 Chipbond Recent Development
11.15 Chipmos
11.15.1 Chipmos Company Detail
11.15.2 Chipmos Business Overview
11.15.3 Chipmos Advanced Packaging for Semiconductor Introduction
11.15.4 Chipmos Revenue in Advanced Packaging for Semiconductor Business (2018-2023)
11.15.5 Chipmos Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos

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