The term "AI Server PCB" typically refers to the printed circuit board (PCB) used in an Artificial Intelligence (AI) server. An AI server is a computer system specifically designed to handle complex AI tasks, such as machine learning and deep learning algorithms. The PCB in an AI server plays a crucial role in providing connectivity and electrical pathways for various components, including processors, memory modules, storage devices, network interfaces, power management circuits, and other peripherals.
The global AI Server HDI (high-density interconnect) PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for AI Server HDI (high-density interconnect) PCB is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for AI Server HDI (high-density interconnect) PCB is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of AI Server HDI (high-density interconnect) PCB include Victory Giant Technology, Wus Printed Circuit, GCE, Unimicron, SCC, Olympic Country, Shengyi Technology, Compeq Co, Zhending, HannStar Board, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for AI Server HDI (high-density interconnect) PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding AI Server HDI (high-density interconnect) PCB.
The AI Server HDI (high-density interconnect) PCB market size, estimations, and forecasts are provided in terms of output/shipments (Sq m) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global AI Server HDI (high-density interconnect) PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the AI Server HDI (high-density interconnect) PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Victory Giant Technology
Wus Printed Circuit
GCE
Unimicron
SCC
Olympic Country
Shengyi Technology
Compeq Co
Zhending
HannStar Board
by Type
20 Layers
24 Layers
Other
by Application
Universal Server
Logical Server
Training Server
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of AI Server HDI (high-density interconnect) PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of AI Server HDI (high-density interconnect) PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of AI Server HDI (high-density interconnect) PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 AI Server HDI (high-density interconnect) PCB Market Overview
1.1 Product Definition
1.2 AI Server HDI (high-density interconnect) PCB by Type
1.2.1 Global AI Server HDI (high-density interconnect) PCB Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 20 Layers
1.2.3 24 Layers
1.2.4 Other
1.3 AI Server HDI (high-density interconnect) PCB by Application
1.3.1 Global AI Server HDI (high-density interconnect) PCB Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Universal Server
1.3.3 Logical Server
1.3.4 Training Server
1.4 Global Market Growth Prospects
1.4.1 Global AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global AI Server HDI (high-density interconnect) PCB Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global AI Server HDI (high-density interconnect) PCB Production Estimates and Forecasts (2019-2030)
1.4.4 Global AI Server HDI (high-density interconnect) PCB Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global AI Server HDI (high-density interconnect) PCB Production Market Share by Manufacturers (2019-2024)
2.2 Global AI Server HDI (high-density interconnect) PCB Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of AI Server HDI (high-density interconnect) PCB, Industry Ranking, 2022 VS 2023
2.4 Global AI Server HDI (high-density interconnect) PCB Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global AI Server HDI (high-density interconnect) PCB Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of AI Server HDI (high-density interconnect) PCB, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of AI Server HDI (high-density interconnect) PCB, Product Type & Application
2.8 Global Key Manufacturers of AI Server HDI (high-density interconnect) PCB, Date of Enter into This Industry
2.9 Global AI Server HDI (high-density interconnect) PCB Market Competitive Situation and Trends
2.9.1 Global AI Server HDI (high-density interconnect) PCB Market Concentration Rate
2.9.2 Global 5 and 10 Largest AI Server HDI (high-density interconnect) PCB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 AI Server HDI (high-density interconnect) PCB Production by Region
3.1 Global AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global AI Server HDI (high-density interconnect) PCB Production Value by Region (2019-2030)
3.2.1 Global AI Server HDI (high-density interconnect) PCB Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of AI Server HDI (high-density interconnect) PCB by Region (2025-2030)
3.3 Global AI Server HDI (high-density interconnect) PCB Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global AI Server HDI (high-density interconnect) PCB Production by Region (2019-2030)
3.4.1 Global AI Server HDI (high-density interconnect) PCB Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of AI Server HDI (high-density interconnect) PCB by Region (2025-2030)
3.5 Global AI Server HDI (high-density interconnect) PCB Market Price Analysis by Region (2019-2024)
3.6 Global AI Server HDI (high-density interconnect) PCB Production and Value, Year-over-Year Growth
3.6.1 North America AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.3 China AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea AI Server HDI (high-density interconnect) PCB Production Value Estimates and Forecasts (2019-2030)
4 AI Server HDI (high-density interconnect) PCB Consumption by Region
4.1 Global AI Server HDI (high-density interconnect) PCB Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global AI Server HDI (high-density interconnect) PCB Consumption by Region (2019-2030)
4.2.1 Global AI Server HDI (high-density interconnect) PCB Consumption by Region (2019-2030)
4.2.2 Global AI Server HDI (high-density interconnect) PCB Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America AI Server HDI (high-density interconnect) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America AI Server HDI (high-density interconnect) PCB Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe AI Server HDI (high-density interconnect) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe AI Server HDI (high-density interconnect) PCB Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific AI Server HDI (high-density interconnect) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific AI Server HDI (high-density interconnect) PCB Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa AI Server HDI (high-density interconnect) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa AI Server HDI (high-density interconnect) PCB Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global AI Server HDI (high-density interconnect) PCB Production by Type (2019-2030)
5.1.1 Global AI Server HDI (high-density interconnect) PCB Production by Type (2019-2024)
5.1.2 Global AI Server HDI (high-density interconnect) PCB Production by Type (2025-2030)
5.1.3 Global AI Server HDI (high-density interconnect) PCB Production Market Share by Type (2019-2030)
5.2 Global AI Server HDI (high-density interconnect) PCB Production Value by Type (2019-2030)
5.2.1 Global AI Server HDI (high-density interconnect) PCB Production Value by Type (2019-2024)
5.2.2 Global AI Server HDI (high-density interconnect) PCB Production Value by Type (2025-2030)
5.2.3 Global AI Server HDI (high-density interconnect) PCB Production Value Market Share by Type (2019-2030)
5.3 Global AI Server HDI (high-density interconnect) PCB Price by Type (2019-2030)
6 Segment by Application
6.1 Global AI Server HDI (high-density interconnect) PCB Production by Application (2019-2030)
6.1.1 Global AI Server HDI (high-density interconnect) PCB Production by Application (2019-2024)
6.1.2 Global AI Server HDI (high-density interconnect) PCB Production by Application (2025-2030)
6.1.3 Global AI Server HDI (high-density interconnect) PCB Production Market Share by Application (2019-2030)
6.2 Global AI Server HDI (high-density interconnect) PCB Production Value by Application (2019-2030)
6.2.1 Global AI Server HDI (high-density interconnect) PCB Production Value by Application (2019-2024)
6.2.2 Global AI Server HDI (high-density interconnect) PCB Production Value by Application (2025-2030)
6.2.3 Global AI Server HDI (high-density interconnect) PCB Production Value Market Share by Application (2019-2030)
6.3 Global AI Server HDI (high-density interconnect) PCB Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Victory Giant Technology
7.1.1 Victory Giant Technology AI Server HDI (high-density interconnect) PCB Company Information
7.1.2 Victory Giant Technology AI Server HDI (high-density interconnect) PCB Product Portfolio
7.1.3 Victory Giant Technology AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Victory Giant Technology Main Business and Markets Served
7.1.5 Victory Giant Technology Recent Developments/Updates
7.2 Wus Printed Circuit
7.2.1 Wus Printed Circuit AI Server HDI (high-density interconnect) PCB Company Information
7.2.2 Wus Printed Circuit AI Server HDI (high-density interconnect) PCB Product Portfolio
7.2.3 Wus Printed Circuit AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Wus Printed Circuit Main Business and Markets Served
7.2.5 Wus Printed Circuit Recent Developments/Updates
7.3 GCE
7.3.1 GCE AI Server HDI (high-density interconnect) PCB Company Information
7.3.2 GCE AI Server HDI (high-density interconnect) PCB Product Portfolio
7.3.3 GCE AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.3.4 GCE Main Business and Markets Served
7.3.5 GCE Recent Developments/Updates
7.4 Unimicron
7.4.1 Unimicron AI Server HDI (high-density interconnect) PCB Company Information
7.4.2 Unimicron AI Server HDI (high-density interconnect) PCB Product Portfolio
7.4.3 Unimicron AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Unimicron Main Business and Markets Served
7.4.5 Unimicron Recent Developments/Updates
7.5 SCC
7.5.1 SCC AI Server HDI (high-density interconnect) PCB Company Information
7.5.2 SCC AI Server HDI (high-density interconnect) PCB Product Portfolio
7.5.3 SCC AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.5.4 SCC Main Business and Markets Served
7.5.5 SCC Recent Developments/Updates
7.6 Olympic Country
7.6.1 Olympic Country AI Server HDI (high-density interconnect) PCB Company Information
7.6.2 Olympic Country AI Server HDI (high-density interconnect) PCB Product Portfolio
7.6.3 Olympic Country AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Olympic Country Main Business and Markets Served
7.6.5 Olympic Country Recent Developments/Updates
7.7 Shengyi Technology
7.7.1 Shengyi Technology AI Server HDI (high-density interconnect) PCB Company Information
7.7.2 Shengyi Technology AI Server HDI (high-density interconnect) PCB Product Portfolio
7.7.3 Shengyi Technology AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Shengyi Technology Main Business and Markets Served
7.7.5 Shengyi Technology Recent Developments/Updates
7.8 Compeq Co
7.8.1 Compeq Co AI Server HDI (high-density interconnect) PCB Company Information
7.8.2 Compeq Co AI Server HDI (high-density interconnect) PCB Product Portfolio
7.8.3 Compeq Co AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Compeq Co Main Business and Markets Served
7.8.5 Compeq Co Recent Developments/Updates
7.9 Zhending
7.9.1 Zhending AI Server HDI (high-density interconnect) PCB Company Information
7.9.2 Zhending AI Server HDI (high-density interconnect) PCB Product Portfolio
7.9.3 Zhending AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Zhending Main Business and Markets Served
7.9.5 Zhending Recent Developments/Updates
7.10 HannStar Board
7.10.1 HannStar Board AI Server HDI (high-density interconnect) PCB Company Information
7.10.2 HannStar Board AI Server HDI (high-density interconnect) PCB Product Portfolio
7.10.3 HannStar Board AI Server HDI (high-density interconnect) PCB Production, Value, Price and Gross Margin (2019-2024)
7.10.4 HannStar Board Main Business and Markets Served
7.10.5 HannStar Board Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 AI Server HDI (high-density interconnect) PCB Industry Chain Analysis
8.2 AI Server HDI (high-density interconnect) PCB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 AI Server HDI (high-density interconnect) PCB Production Mode & Process
8.4 AI Server HDI (high-density interconnect) PCB Sales and Marketing
8.4.1 AI Server HDI (high-density interconnect) PCB Sales Channels
8.4.2 AI Server HDI (high-density interconnect) PCB Distributors
8.5 AI Server HDI (high-density interconnect) PCB Customers
9 AI Server HDI (high-density interconnect) PCB Market Dynamics
9.1 AI Server HDI (high-density interconnect) PCB Industry Trends
9.2 AI Server HDI (high-density interconnect) PCB Market Drivers
9.3 AI Server HDI (high-density interconnect) PCB Market Challenges
9.4 AI Server HDI (high-density interconnect) PCB Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Victory Giant Technology
Wus Printed Circuit
GCE
Unimicron
SCC
Olympic Country
Shengyi Technology
Compeq Co
Zhending
HannStar Board
听
听
*If Applicable.
