
OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.
Global Outsourced Semiconductor Assembly and Test (OSAT) key players include ASE Group, Amkor, JECT, SPIL, etc. Global top four manufacturers hold a share of over 30%.
The United States is the largest market, with a share of about 30%, followed by China, and China Taiwan, both have a share of about 35 percent.Ìý
In terms of product, Assembly Service is the largest segment, with a share of about 80%. And in terms of application, the largest application is Communications, followed by Automotive, Computing, Consumer, etc.
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The global Outsourced Semiconductor Assembly and Test (OSAT) market is projected to reach US$ 81010 million by 2027, from US$ 56910 million in 2020, at a CAGR of X.2% during 2023-2029.
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ASE Group
Amkor
JECT
SPIL
Powertech Technology Inc
TSHT
TFME
UTAC
Chipbond
ChipMOS
KYEC
Unisem
Walton Advanced Engineering
Signetics
Hana Micron
NEPES
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*If Applicable.
