Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) and silicon chips using bonding wires, which are fine wires made of materials such as gold and aluminium. The two most common processes are gold ball bonding and aluminium wedge bonding.
The global Automatic Wire Bonding Machine market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Automatic Wire Bonding Machine is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Automatic Wire Bonding Machine is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Automatic Wire Bonding Machine include ASM Pacific Technology, MPP/Kulicke and Soffa Industries, Inc., Palomar Technologies, BE Semiconductor Industries, F & K DELVOTEC Bondtechnik GmbH, DIAS Automation, West Bond, Hesse Mechatronics and SHINKAWA, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Automatic Wire Bonding Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Automatic Wire Bonding Machine.
The Automatic Wire Bonding Machine market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Automatic Wire Bonding Machine market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Automatic Wire Bonding Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASM Pacific Technology
MPP/Kulicke and Soffa Industries, Inc.
Palomar Technologies
BE Semiconductor Industries
F & K DELVOTEC Bondtechnik GmbH
DIAS Automation
West Bond
Hesse Mechatronics
SHINKAWA
F&S BONDTEC Semiconductor GmbH
SHIBUYA
Ultrasonic Engineering Co.,Ltd.
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
Gold Ball Bonding
Aluminium Wedge Bonding
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Automatic Wire Bonding Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Automatic Wire Bonding Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Automatic Wire Bonding Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Automatic Wire Bonding Machine Market Overview
1.1 Product Definition
1.2 Automatic Wire Bonding Machine Segment by Type
1.2.1 Global Automatic Wire Bonding Machine Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Automatic Wire Bonding Machine Segment by Application
1.3.1 Global Automatic Wire Bonding Machine Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Gold Ball Bonding
1.3.3 Aluminium Wedge Bonding
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Automatic Wire Bonding Machine Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Automatic Wire Bonding Machine Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Automatic Wire Bonding Machine Production Estimates and Forecasts (2018-2029)
1.4.4 Global Automatic Wire Bonding Machine Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Automatic Wire Bonding Machine Production Market Share by Manufacturers (2018-2023)
2.2 Global Automatic Wire Bonding Machine Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Automatic Wire Bonding Machine, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Automatic Wire Bonding Machine Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Automatic Wire Bonding Machine Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Automatic Wire Bonding Machine, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Automatic Wire Bonding Machine, Product Offered and Application
2.8 Global Key Manufacturers of Automatic Wire Bonding Machine, Date of Enter into This Industry
2.9 Automatic Wire Bonding Machine Market Competitive Situation and Trends
2.9.1 Automatic Wire Bonding Machine Market Concentration Rate
2.9.2 Global 5 and 10 Largest Automatic Wire Bonding Machine Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Automatic Wire Bonding Machine Production by Region
3.1 Global Automatic Wire Bonding Machine Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Automatic Wire Bonding Machine Production Value by Region (2018-2029)
3.2.1 Global Automatic Wire Bonding Machine Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Automatic Wire Bonding Machine by Region (2024-2029)
3.3 Global Automatic Wire Bonding Machine Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Automatic Wire Bonding Machine Production by Region (2018-2029)
3.4.1 Global Automatic Wire Bonding Machine Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Automatic Wire Bonding Machine by Region (2024-2029)
3.5 Global Automatic Wire Bonding Machine Market Price Analysis by Region (2018-2023)
3.6 Global Automatic Wire Bonding Machine Production and Value, Year-over-Year Growth
3.6.1 North America Automatic Wire Bonding Machine Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Automatic Wire Bonding Machine Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Automatic Wire Bonding Machine Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Automatic Wire Bonding Machine Production Value Estimates and Forecasts (2018-2029)
4 Automatic Wire Bonding Machine Consumption by Region
4.1 Global Automatic Wire Bonding Machine Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Automatic Wire Bonding Machine Consumption by Region (2018-2029)
4.2.1 Global Automatic Wire Bonding Machine Consumption by Region (2018-2023)
4.2.2 Global Automatic Wire Bonding Machine Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Automatic Wire Bonding Machine Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Automatic Wire Bonding Machine Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Automatic Wire Bonding Machine Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Automatic Wire Bonding Machine Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Automatic Wire Bonding Machine Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Automatic Wire Bonding Machine Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Automatic Wire Bonding Machine Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Automatic Wire Bonding Machine Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Automatic Wire Bonding Machine Production by Type (2018-2029)
5.1.1 Global Automatic Wire Bonding Machine Production by Type (2018-2023)
5.1.2 Global Automatic Wire Bonding Machine Production by Type (2024-2029)
5.1.3 Global Automatic Wire Bonding Machine Production Market Share by Type (2018-2029)
5.2 Global Automatic Wire Bonding Machine Production Value by Type (2018-2029)
5.2.1 Global Automatic Wire Bonding Machine Production Value by Type (2018-2023)
5.2.2 Global Automatic Wire Bonding Machine Production Value by Type (2024-2029)
5.2.3 Global Automatic Wire Bonding Machine Production Value Market Share by Type (2018-2029)
5.3 Global Automatic Wire Bonding Machine Price by Type (2018-2029)
6 Segment by Application
6.1 Global Automatic Wire Bonding Machine Production by Application (2018-2029)
6.1.1 Global Automatic Wire Bonding Machine Production by Application (2018-2023)
6.1.2 Global Automatic Wire Bonding Machine Production by Application (2024-2029)
6.1.3 Global Automatic Wire Bonding Machine Production Market Share by Application (2018-2029)
6.2 Global Automatic Wire Bonding Machine Production Value by Application (2018-2029)
6.2.1 Global Automatic Wire Bonding Machine Production Value by Application (2018-2023)
6.2.2 Global Automatic Wire Bonding Machine Production Value by Application (2024-2029)
6.2.3 Global Automatic Wire Bonding Machine Production Value Market Share by Application (2018-2029)
6.3 Global Automatic Wire Bonding Machine Price by Application (2018-2029)
7 Key Companies Profiled
7.1 ASM Pacific Technology
7.1.1 ASM Pacific Technology Automatic Wire Bonding Machine Corporation Information
7.1.2 ASM Pacific Technology Automatic Wire Bonding Machine Product Portfolio
7.1.3 ASM Pacific Technology Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.1.4 ASM Pacific Technology Main Business and Markets Served
7.1.5 ASM Pacific Technology Recent Developments/Updates
7.2 MPP/Kulicke and Soffa Industries, Inc.
7.2.1 MPP/Kulicke and Soffa Industries, Inc. Automatic Wire Bonding Machine Corporation Information
7.2.2 MPP/Kulicke and Soffa Industries, Inc. Automatic Wire Bonding Machine Product Portfolio
7.2.3 MPP/Kulicke and Soffa Industries, Inc. Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.2.4 MPP/Kulicke and Soffa Industries, Inc. Main Business and Markets Served
7.2.5 MPP/Kulicke and Soffa Industries, Inc. Recent Developments/Updates
7.3 Palomar Technologies
7.3.1 Palomar Technologies Automatic Wire Bonding Machine Corporation Information
7.3.2 Palomar Technologies Automatic Wire Bonding Machine Product Portfolio
7.3.3 Palomar Technologies Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Palomar Technologies Main Business and Markets Served
7.3.5 Palomar Technologies Recent Developments/Updates
7.4 BE Semiconductor Industries
7.4.1 BE Semiconductor Industries Automatic Wire Bonding Machine Corporation Information
7.4.2 BE Semiconductor Industries Automatic Wire Bonding Machine Product Portfolio
7.4.3 BE Semiconductor Industries Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.4.4 BE Semiconductor Industries Main Business and Markets Served
7.4.5 BE Semiconductor Industries Recent Developments/Updates
7.5 F & K DELVOTEC Bondtechnik GmbH
7.5.1 F & K DELVOTEC Bondtechnik GmbH Automatic Wire Bonding Machine Corporation Information
7.5.2 F & K DELVOTEC Bondtechnik GmbH Automatic Wire Bonding Machine Product Portfolio
7.5.3 F & K DELVOTEC Bondtechnik GmbH Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.5.4 F & K DELVOTEC Bondtechnik GmbH Main Business and Markets Served
7.5.5 F & K DELVOTEC Bondtechnik GmbH Recent Developments/Updates
7.6 DIAS Automation
7.6.1 DIAS Automation Automatic Wire Bonding Machine Corporation Information
7.6.2 DIAS Automation Automatic Wire Bonding Machine Product Portfolio
7.6.3 DIAS Automation Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.6.4 DIAS Automation Main Business and Markets Served
7.6.5 DIAS Automation Recent Developments/Updates
7.7 West Bond
7.7.1 West Bond Automatic Wire Bonding Machine Corporation Information
7.7.2 West Bond Automatic Wire Bonding Machine Product Portfolio
7.7.3 West Bond Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.7.4 West Bond Main Business and Markets Served
7.7.5 West Bond Recent Developments/Updates
7.8 Hesse Mechatronics
7.8.1 Hesse Mechatronics Automatic Wire Bonding Machine Corporation Information
7.8.2 Hesse Mechatronics Automatic Wire Bonding Machine Product Portfolio
7.8.3 Hesse Mechatronics Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Hesse Mechatronics Main Business and Markets Served
7.7.5 Hesse Mechatronics Recent Developments/Updates
7.9 SHINKAWA
7.9.1 SHINKAWA Automatic Wire Bonding Machine Corporation Information
7.9.2 SHINKAWA Automatic Wire Bonding Machine Product Portfolio
7.9.3 SHINKAWA Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.9.4 SHINKAWA Main Business and Markets Served
7.9.5 SHINKAWA Recent Developments/Updates
7.10 F&S BONDTEC Semiconductor GmbH
7.10.1 F&S BONDTEC Semiconductor GmbH Automatic Wire Bonding Machine Corporation Information
7.10.2 F&S BONDTEC Semiconductor GmbH Automatic Wire Bonding Machine Product Portfolio
7.10.3 F&S BONDTEC Semiconductor GmbH Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.10.4 F&S BONDTEC Semiconductor GmbH Main Business and Markets Served
7.10.5 F&S BONDTEC Semiconductor GmbH Recent Developments/Updates
7.11 SHIBUYA
7.11.1 SHIBUYA Automatic Wire Bonding Machine Corporation Information
7.11.2 SHIBUYA Automatic Wire Bonding Machine Product Portfolio
7.11.3 SHIBUYA Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.11.4 SHIBUYA Main Business and Markets Served
7.11.5 SHIBUYA Recent Developments/Updates
7.12 Ultrasonic Engineering Co.,Ltd.
7.12.1 Ultrasonic Engineering Co.,Ltd. Automatic Wire Bonding Machine Corporation Information
7.12.2 Ultrasonic Engineering Co.,Ltd. Automatic Wire Bonding Machine Product Portfolio
7.12.3 Ultrasonic Engineering Co.,Ltd. Automatic Wire Bonding Machine Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Ultrasonic Engineering Co.,Ltd. Main Business and Markets Served
7.12.5 Ultrasonic Engineering Co.,Ltd. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Automatic Wire Bonding Machine Industry Chain Analysis
8.2 Automatic Wire Bonding Machine Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Automatic Wire Bonding Machine Production Mode & Process
8.4 Automatic Wire Bonding Machine Sales and Marketing
8.4.1 Automatic Wire Bonding Machine Sales Channels
8.4.2 Automatic Wire Bonding Machine Distributors
8.5 Automatic Wire Bonding Machine Customers
9 Automatic Wire Bonding Machine Market Dynamics
9.1 Automatic Wire Bonding Machine Industry Trends
9.2 Automatic Wire Bonding Machine Market Drivers
9.3 Automatic Wire Bonding Machine Market Challenges
9.4 Automatic Wire Bonding Machine Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
ASM Pacific Technology
MPP/Kulicke and Soffa Industries, Inc.
Palomar Technologies
BE Semiconductor Industries
F & K DELVOTEC Bondtechnik GmbH
DIAS Automation
West Bond
Hesse Mechatronics
SHINKAWA
F&S BONDTEC Semiconductor GmbH
SHIBUYA
Ultrasonic Engineering Co.,Ltd.
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*If Applicable.