Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components.
The automotive industry is going through a revolution, and with this growth comes opportunities for stakeholders to add economic value to end users. Several environmental, economic and social factors are influencing future electric vehicle designs, safety and powertrain choices. Whether it’s ADAS, infotainment or electrification applications, performance and reliability aspects shape each player’s strategy.
Semiconductor suppliers, including OSATs, offer packaging technologies that are cutting edge, reliable and cost effective to realize various functional ability for evolving automotive applications. Amkor is the leading automotive OSAT for providing turnkey solutions, including wafer sort, bump services, packaging, test and burn-in, to meet aggressive go-to-market plans.
The global Automotive IC Package market is projected to grow from US$ 10050 million in 2024 to US$ 20450 million by 2030, at a Compound Annual Growth Rate (CAGR) of 12.6% during the forecast period.
Global key players of Automotive OSAT include Amkor and ASE (SPIL), etc. The top two players hold a share over 60%. North America is the largest market, has a share about 46%. In terms of product type, Leadframe is the largest segment, occupied for a share of about 35%.
Global key players of Automotive IC Substrate include Unimicron, Ibiden and Nan Ya PCB, etc. The top three players hold a share over 50%. North America is the largest market, has a share about 62%. In terms of product type, Automotive IDM is the largest segment, occupied for a share of about 60%.
In terms of production side, this report researches the Automotive IC Package production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Automotive IC Package by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for Automotive IC Package, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Automotive IC Package, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Automotive IC Package, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Automotive IC Package sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Automotive IC Package market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Automotive IC Package sales, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
Amkor
ASE (SPIL)
NXP Semiconductors
Infineon (Cypress)
Renesas
TI (Texas Instruments)
STMicroelectronics
onsemi
UTAC
Bosch
Rohm
ADI (Analog Devices, Inc)
JCET (STATS ChipPAC)
Mitsubishi Electric
Carsem
Tongfu Microelectronics (TFME)
King Yuan Electronics Corp. (KYEC)
Powertech Technology Inc. (PTI)
Microchip (Microsemi)
Unisem Group
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Toshiba
BYD
Zhuzhou CRRC Times Electric
China Resources Microelectronics Limited
Hangzhou Silan Microelectronics
Rapidus
Segment by Type
Automotive OSAT
Automotive IDM
Segment by Application
Advanced Packaging
Mainstream Packaging
Production by Region
North America
Europe
South Korea
China Taiwan
China
Japan
Southeast Asia
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Automotive IC Package production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Automotive IC Package in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Automotive IC Package manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Automotive IC Package sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 Automotive IC Package Product Introduction
1.2 Market by Type
1.2.1 Global Automotive IC Package Market Size by Type, 2019 VS 2023 VS 2030
1.2.2 Automotive OSAT
1.2.3 Automotive IDM
1.3 Market by Application
1.3.1 Global Automotive IC Package Market Size by Application, 2019 VS 2023 VS 2030
1.3.2 Advanced Packaging
1.3.3 Mainstream Packaging
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Automotive IC Package Production
2.1 Global Automotive IC Package Production Capacity (2019-2030)
2.2 Global Automotive IC Package Production by Region: 2019 VS 2023 VS 2030
2.3 Global Automotive IC Package Production by Region
2.3.1 Global Automotive IC Package Historic Production by Region (2019-2024)
2.3.2 Global Automotive IC Package Forecasted Production by Region (2025-2030)
2.3.3 Global Automotive IC Package Production Market Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 South Korea
2.7 China Taiwan
2.8 China
2.9 Japan
2.10 Southeast Asia
3 Executive Summary
3.1 Global Automotive IC Package Revenue Estimates and Forecasts 2019-2030
3.2 Global Automotive IC Package Revenue by Region
3.2.1 Global Automotive IC Package Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global Automotive IC Package Revenue by Region (2019-2024)
3.2.3 Global Automotive IC Package Revenue by Region (2025-2030)
3.2.4 Global Automotive IC Package Revenue Market Share by Region (2019-2030)
3.3 Global Automotive IC Package Sales Estimates and Forecasts 2019-2030
3.4 Global Automotive IC Package Sales by Region
3.4.1 Global Automotive IC Package Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global Automotive IC Package Sales by Region (2019-2024)
3.4.3 Global Automotive IC Package Sales by Region (2025-2030)
3.4.4 Global Automotive IC Package Sales Market Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Automotive IC Package Sales by Manufacturers
4.1.1 Global Automotive IC Package Sales by Manufacturers (2019-2024)
4.1.2 Global Automotive IC Package Sales Market Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Automotive IC Package in 2023
4.2 Global Automotive IC Package Revenue by Manufacturers
4.2.1 Global Automotive IC Package Revenue by Manufacturers (2019-2024)
4.2.2 Global Automotive IC Package Revenue Market Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by Automotive IC Package Revenue in 2023
4.3 Global Automotive IC Package Sales Price by Manufacturers
4.4 Global Key Players of Automotive IC Package, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Automotive IC Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Automotive IC Package, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Automotive IC Package, Product Offered and Application
4.8 Global Key Manufacturers of Automotive IC Package, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Automotive IC Package Sales by Type
5.1.1 Global Automotive IC Package Historical Sales by Type (2019-2024)
5.1.2 Global Automotive IC Package Forecasted Sales by Type (2025-2030)
5.1.3 Global Automotive IC Package Sales Market Share by Type (2019-2030)
5.2 Global Automotive IC Package Revenue by Type
5.2.1 Global Automotive IC Package Historical Revenue by Type (2019-2024)
5.2.2 Global Automotive IC Package Forecasted Revenue by Type (2025-2030)
5.2.3 Global Automotive IC Package Revenue Market Share by Type (2019-2030)
5.3 Global Automotive IC Package Price by Type
5.3.1 Global Automotive IC Package Price by Type (2019-2024)
5.3.2 Global Automotive IC Package Price Forecast by Type (2025-2030)
6 Market Size by Application
6.1 Global Automotive IC Package Sales by Application
6.1.1 Global Automotive IC Package Historical Sales by Application (2019-2024)
6.1.2 Global Automotive IC Package Forecasted Sales by Application (2025-2030)
6.1.3 Global Automotive IC Package Sales Market Share by Application (2019-2030)
6.2 Global Automotive IC Package Revenue by Application
6.2.1 Global Automotive IC Package Historical Revenue by Application (2019-2024)
6.2.2 Global Automotive IC Package Forecasted Revenue by Application (2025-2030)
6.2.3 Global Automotive IC Package Revenue Market Share by Application (2019-2030)
6.3 Global Automotive IC Package Price by Application
6.3.1 Global Automotive IC Package Price by Application (2019-2024)
6.3.2 Global Automotive IC Package Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada Automotive IC Package Market Size by Type
7.1.1 US & Canada Automotive IC Package Sales by Type (2019-2030)
7.1.2 US & Canada Automotive IC Package Revenue by Type (2019-2030)
7.2 US & Canada Automotive IC Package Market Size by Application
7.2.1 US & Canada Automotive IC Package Sales by Application (2019-2030)
7.2.2 US & Canada Automotive IC Package Revenue by Application (2019-2030)
7.3 US & Canada Automotive IC Package Sales by Country
7.3.1 US & Canada Automotive IC Package Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada Automotive IC Package Sales by Country (2019-2030)
7.3.3 US & Canada Automotive IC Package Revenue by Country (2019-2030)
7.3.4 United States
7.3.5 Canada
8 Europe
8.1 Europe Automotive IC Package Market Size by Type
8.1.1 Europe Automotive IC Package Sales by Type (2019-2030)
8.1.2 Europe Automotive IC Package Revenue by Type (2019-2030)
8.2 Europe Automotive IC Package Market Size by Application
8.2.1 Europe Automotive IC Package Sales by Application (2019-2030)
8.2.2 Europe Automotive IC Package Revenue by Application (2019-2030)
8.3 Europe Automotive IC Package Sales by Country
8.3.1 Europe Automotive IC Package Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe Automotive IC Package Sales by Country (2019-2030)
8.3.3 Europe Automotive IC Package Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Automotive IC Package Market Size by Type
9.1.1 China Automotive IC Package Sales by Type (2019-2030)
9.1.2 China Automotive IC Package Revenue by Type (2019-2030)
9.2 China Automotive IC Package Market Size by Application
9.2.1 China Automotive IC Package Sales by Application (2019-2030)
9.2.2 China Automotive IC Package Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia Automotive IC Package Market Size by Type
10.1.1 Asia Automotive IC Package Sales by Type (2019-2030)
10.1.2 Asia Automotive IC Package Revenue by Type (2019-2030)
10.2 Asia Automotive IC Package Market Size by Application
10.2.1 Asia Automotive IC Package Sales by Application (2019-2030)
10.2.2 Asia Automotive IC Package Revenue by Application (2019-2030)
10.3 Asia Automotive IC Package Sales by Region
10.3.1 Asia Automotive IC Package Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia Automotive IC Package Revenue by Region (2019-2030)
10.3.3 Asia Automotive IC Package Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Automotive IC Package Market Size by Type
11.1.1 Middle East, Africa and Latin America Automotive IC Package Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America Automotive IC Package Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America Automotive IC Package Market Size by Application
11.2.1 Middle East, Africa and Latin America Automotive IC Package Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America Automotive IC Package Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America Automotive IC Package Sales by Country
11.3.1 Middle East, Africa and Latin America Automotive IC Package Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America Automotive IC Package Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America Automotive IC Package Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Amkor
12.1.1 Amkor Company Information
12.1.2 Amkor Overview
12.1.3 Amkor Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 Amkor Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Amkor Recent Developments
12.2 ASE (SPIL)
12.2.1 ASE (SPIL) Company Information
12.2.2 ASE (SPIL) Overview
12.2.3 ASE (SPIL) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 ASE (SPIL) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 ASE (SPIL) Recent Developments
12.3 NXP Semiconductors
12.3.1 NXP Semiconductors Company Information
12.3.2 NXP Semiconductors Overview
12.3.3 NXP Semiconductors Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 NXP Semiconductors Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 NXP Semiconductors Recent Developments
12.4 Infineon (Cypress)
12.4.1 Infineon (Cypress) Company Information
12.4.2 Infineon (Cypress) Overview
12.4.3 Infineon (Cypress) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 Infineon (Cypress) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Infineon (Cypress) Recent Developments
12.5 Renesas
12.5.1 Renesas Company Information
12.5.2 Renesas Overview
12.5.3 Renesas Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 Renesas Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Renesas Recent Developments
12.6 TI (Texas Instruments)
12.6.1 TI (Texas Instruments) Company Information
12.6.2 TI (Texas Instruments) Overview
12.6.3 TI (Texas Instruments) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 TI (Texas Instruments) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 TI (Texas Instruments) Recent Developments
12.7 STMicroelectronics
12.7.1 STMicroelectronics Company Information
12.7.2 STMicroelectronics Overview
12.7.3 STMicroelectronics Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 STMicroelectronics Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 STMicroelectronics Recent Developments
12.8 onsemi
12.8.1 onsemi Company Information
12.8.2 onsemi Overview
12.8.3 onsemi Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 onsemi Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 onsemi Recent Developments
12.9 UTAC
12.9.1 UTAC Company Information
12.9.2 UTAC Overview
12.9.3 UTAC Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 UTAC Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 UTAC Recent Developments
12.10 Bosch
12.10.1 Bosch Company Information
12.10.2 Bosch Overview
12.10.3 Bosch Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.10.4 Bosch Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Bosch Recent Developments
12.11 Rohm
12.11.1 Rohm Company Information
12.11.2 Rohm Overview
12.11.3 Rohm Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.11.4 Rohm Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Rohm Recent Developments
12.12 ADI (Analog Devices, Inc)
12.12.1 ADI (Analog Devices, Inc) Company Information
12.12.2 ADI (Analog Devices, Inc) Overview
12.12.3 ADI (Analog Devices, Inc) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.12.4 ADI (Analog Devices, Inc) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 ADI (Analog Devices, Inc) Recent Developments
12.13 JCET (STATS ChipPAC)
12.13.1 JCET (STATS ChipPAC) Company Information
12.13.2 JCET (STATS ChipPAC) Overview
12.13.3 JCET (STATS ChipPAC) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.13.4 JCET (STATS ChipPAC) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 JCET (STATS ChipPAC) Recent Developments
12.14 Mitsubishi Electric
12.14.1 Mitsubishi Electric Company Information
12.14.2 Mitsubishi Electric Overview
12.14.3 Mitsubishi Electric Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.14.4 Mitsubishi Electric Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Mitsubishi Electric Recent Developments
12.15 Carsem
12.15.1 Carsem Company Information
12.15.2 Carsem Overview
12.15.3 Carsem Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.15.4 Carsem Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 Carsem Recent Developments
12.16 Tongfu Microelectronics (TFME)
12.16.1 Tongfu Microelectronics (TFME) Company Information
12.16.2 Tongfu Microelectronics (TFME) Overview
12.16.3 Tongfu Microelectronics (TFME) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.16.4 Tongfu Microelectronics (TFME) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 Tongfu Microelectronics (TFME) Recent Developments
12.17 King Yuan Electronics Corp. (KYEC)
12.17.1 King Yuan Electronics Corp. (KYEC) Company Information
12.17.2 King Yuan Electronics Corp. (KYEC) Overview
12.17.3 King Yuan Electronics Corp. (KYEC) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.17.4 King Yuan Electronics Corp. (KYEC) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 King Yuan Electronics Corp. (KYEC) Recent Developments
12.18 Powertech Technology Inc. (PTI)
12.18.1 Powertech Technology Inc. (PTI) Company Information
12.18.2 Powertech Technology Inc. (PTI) Overview
12.18.3 Powertech Technology Inc. (PTI) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.18.4 Powertech Technology Inc. (PTI) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 Powertech Technology Inc. (PTI) Recent Developments
12.19 Microchip (Microsemi)
12.19.1 Microchip (Microsemi) Company Information
12.19.2 Microchip (Microsemi) Overview
12.19.3 Microchip (Microsemi) Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.19.4 Microchip (Microsemi) Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 Microchip (Microsemi) Recent Developments
12.20 Unisem Group
12.20.1 Unisem Group Company Information
12.20.2 Unisem Group Overview
12.20.3 Unisem Group Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.20.4 Unisem Group Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.20.5 Unisem Group Recent Developments
12.21 SFA Semicon
12.21.1 SFA Semicon Company Information
12.21.2 SFA Semicon Overview
12.21.3 SFA Semicon Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.21.4 SFA Semicon Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.21.5 SFA Semicon Recent Developments
12.22 Forehope Electronic (Ningbo) Co.,Ltd.
12.22.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Information
12.22.2 Forehope Electronic (Ningbo) Co.,Ltd. Overview
12.22.3 Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.22.4 Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.22.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Developments
12.23 Toshiba
12.23.1 Toshiba Company Information
12.23.2 Toshiba Overview
12.23.3 Toshiba Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.23.4 Toshiba Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.23.5 Toshiba Recent Developments
12.24 BYD
12.24.1 BYD Company Information
12.24.2 BYD Overview
12.24.3 BYD Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.24.4 BYD Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.24.5 BYD Recent Developments
12.25 Zhuzhou CRRC Times Electric
12.25.1 Zhuzhou CRRC Times Electric Company Information
12.25.2 Zhuzhou CRRC Times Electric Overview
12.25.3 Zhuzhou CRRC Times Electric Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.25.4 Zhuzhou CRRC Times Electric Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.25.5 Zhuzhou CRRC Times Electric Recent Developments
12.26 China Resources Microelectronics Limited
12.26.1 China Resources Microelectronics Limited Company Information
12.26.2 China Resources Microelectronics Limited Overview
12.26.3 China Resources Microelectronics Limited Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.26.4 China Resources Microelectronics Limited Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.26.5 China Resources Microelectronics Limited Recent Developments
12.27 Hangzhou Silan Microelectronics
12.27.1 Hangzhou Silan Microelectronics Company Information
12.27.2 Hangzhou Silan Microelectronics Overview
12.27.3 Hangzhou Silan Microelectronics Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.27.4 Hangzhou Silan Microelectronics Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.27.5 Hangzhou Silan Microelectronics Recent Developments
12.28 Rapidus
12.28.1 Rapidus Company Information
12.28.2 Rapidus Overview
12.28.3 Rapidus Automotive IC Package Sales, Price, Revenue and Gross Margin (2019-2024)
12.28.4 Rapidus Automotive IC Package Product Model Numbers, Pictures, Descriptions and Specifications
12.28.5 Rapidus Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Automotive IC Package Industry Chain Analysis
13.2 Automotive IC Package Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Automotive IC Package Production Mode & Process
13.4 Automotive IC Package Sales and Marketing
13.4.1 Automotive IC Package Sales Channels
13.4.2 Automotive IC Package Distributors
13.5 Automotive IC Package Customers
14 Automotive IC Package Market Dynamics
14.1 Automotive IC Package Industry Trends
14.2 Automotive IC Package Market Drivers
14.3 Automotive IC Package Market Challenges
14.4 Automotive IC Package Market Restraints
15 Key Finding in The Global Automotive IC Package Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Amkor
ASE (SPIL)
NXP Semiconductors
Infineon (Cypress)
Renesas
TI (Texas Instruments)
STMicroelectronics
onsemi
UTAC
Bosch
Rohm
ADI (Analog Devices, Inc)
JCET (STATS ChipPAC)
Mitsubishi Electric
Carsem
Tongfu Microelectronics (TFME)
King Yuan Electronics Corp. (KYEC)
Powertech Technology Inc. (PTI)
Microchip (Microsemi)
Unisem Group
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Toshiba
BYD
Zhuzhou CRRC Times Electric
China Resources Microelectronics Limited
Hangzhou Silan Microelectronics
Rapidus
Ìý
Ìý
*If Applicable.
