The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back of the BGA package. The component is placed over the PCB and then soldered. After soldering, the package looks as if it is pasted on the board with glue. There are no leads or connections on the side of the BGA package, and it makes the PCB more reliable and offers many benefits.
The global Ball Grid Array (BGA) PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
This report aims to provide a comprehensive presentation of the global market for Ball Grid Array (BGA) PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ball Grid Array (BGA) PCB.
Report Scope
The Ball Grid Array (BGA) PCB market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Ball Grid Array (BGA) PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Ball Grid Array (BGA) PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung Electro-Mechanics
Nanya PCB
TTM Technologies Inc.
Unimicron
Shennan Circuits
CMK Corporation
Kingboard
Creative Hi-tech Ltd.
Mer-Mar Electronics
JHYPCB
Multi Circuit Boards Ltd.
PCBAStore
Sierra Circuits
Cirexx
Pcbcart
RayMing
UCREATE ELECTRONIC GROUP
Segment by Type
Plastic Ball Grid Array
Ceramic Ball Grid Array
Tape Ball Grid Array
Enhanced Ball Grid Array
Flip Chip Ball Grid Array
Micro BGA
Segment by Application
Consumer Electronics
Communications Industrial
Industrial
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Ball Grid Array (BGA) PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Ball Grid Array (BGA) PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Ball Grid Array (BGA) PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Ball Grid Array (BGA) PCB Market Overview
1.1 Product Definition
1.2 Ball Grid Array (BGA) PCB Segment by Type
1.2.1 Global Ball Grid Array (BGA) PCB Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Plastic Ball Grid Array
1.2.3 Ceramic Ball Grid Array
1.2.4 Tape Ball Grid Array
1.2.5 Enhanced Ball Grid Array
1.2.6 Flip Chip Ball Grid Array
1.2.7 Micro BGA
1.3 Ball Grid Array (BGA) PCB Segment by Application
1.3.1 Global Ball Grid Array (BGA) PCB Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Communications Industrial
1.3.4 Industrial
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Ball Grid Array (BGA) PCB Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Ball Grid Array (BGA) PCB Production Estimates and Forecasts (2019-2030)
1.4.4 Global Ball Grid Array (BGA) PCB Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Ball Grid Array (BGA) PCB Production Market Share by Manufacturers (2019-2024)
2.2 Global Ball Grid Array (BGA) PCB Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Ball Grid Array (BGA) PCB, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Ball Grid Array (BGA) PCB Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Ball Grid Array (BGA) PCB Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Ball Grid Array (BGA) PCB, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Ball Grid Array (BGA) PCB, Product Offered and Application
2.8 Global Key Manufacturers of Ball Grid Array (BGA) PCB, Date of Enter into This Industry
2.9 Ball Grid Array (BGA) PCB Market Competitive Situation and Trends
2.9.1 Ball Grid Array (BGA) PCB Market Concentration Rate
2.9.2 Global 5 and 10 Largest Ball Grid Array (BGA) PCB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Ball Grid Array (BGA) PCB Production by Region
3.1 Global Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Ball Grid Array (BGA) PCB Production Value by Region (2019-2030)
3.2.1 Global Ball Grid Array (BGA) PCB Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Ball Grid Array (BGA) PCB by Region (2025-2030)
3.3 Global Ball Grid Array (BGA) PCB Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Ball Grid Array (BGA) PCB Production by Region (2019-2030)
3.4.1 Global Ball Grid Array (BGA) PCB Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Ball Grid Array (BGA) PCB by Region (2025-2030)
3.5 Global Ball Grid Array (BGA) PCB Market Price Analysis by Region (2019-2024)
3.6 Global Ball Grid Array (BGA) PCB Production and Value, Year-over-Year Growth
3.6.1 North America Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2019-2030)
4 Ball Grid Array (BGA) PCB Consumption by Region
4.1 Global Ball Grid Array (BGA) PCB Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Ball Grid Array (BGA) PCB Consumption by Region (2019-2030)
4.2.1 Global Ball Grid Array (BGA) PCB Consumption by Region (2019-2024)
4.2.2 Global Ball Grid Array (BGA) PCB Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Ball Grid Array (BGA) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Ball Grid Array (BGA) PCB Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Ball Grid Array (BGA) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Ball Grid Array (BGA) PCB Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Ball Grid Array (BGA) PCB Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Ball Grid Array (BGA) PCB Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Ball Grid Array (BGA) PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Ball Grid Array (BGA) PCB Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Ball Grid Array (BGA) PCB Production by Type (2019-2030)
5.1.1 Global Ball Grid Array (BGA) PCB Production by Type (2019-2024)
5.1.2 Global Ball Grid Array (BGA) PCB Production by Type (2025-2030)
5.1.3 Global Ball Grid Array (BGA) PCB Production Market Share by Type (2019-2030)
5.2 Global Ball Grid Array (BGA) PCB Production Value by Type (2019-2030)
5.2.1 Global Ball Grid Array (BGA) PCB Production Value by Type (2019-2024)
5.2.2 Global Ball Grid Array (BGA) PCB Production Value by Type (2025-2030)
5.2.3 Global Ball Grid Array (BGA) PCB Production Value Market Share by Type (2019-2030)
5.3 Global Ball Grid Array (BGA) PCB Price by Type (2019-2030)
6 Segment by Application
6.1 Global Ball Grid Array (BGA) PCB Production by Application (2019-2030)
6.1.1 Global Ball Grid Array (BGA) PCB Production by Application (2019-2024)
6.1.2 Global Ball Grid Array (BGA) PCB Production by Application (2025-2030)
6.1.3 Global Ball Grid Array (BGA) PCB Production Market Share by Application (2019-2030)
6.2 Global Ball Grid Array (BGA) PCB Production Value by Application (2019-2030)
6.2.1 Global Ball Grid Array (BGA) PCB Production Value by Application (2019-2024)
6.2.2 Global Ball Grid Array (BGA) PCB Production Value by Application (2025-2030)
6.2.3 Global Ball Grid Array (BGA) PCB Production Value Market Share by Application (2019-2030)
6.3 Global Ball Grid Array (BGA) PCB Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Corporation Information
7.1.2 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Product Portfolio
7.1.3 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 Nanya PCB
7.2.1 Nanya PCB Ball Grid Array (BGA) PCB Corporation Information
7.2.2 Nanya PCB Ball Grid Array (BGA) PCB Product Portfolio
7.2.3 Nanya PCB Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nanya PCB Main Business and Markets Served
7.2.5 Nanya PCB Recent Developments/Updates
7.3 TTM Technologies Inc.
7.3.1 TTM Technologies Inc. Ball Grid Array (BGA) PCB Corporation Information
7.3.2 TTM Technologies Inc. Ball Grid Array (BGA) PCB Product Portfolio
7.3.3 TTM Technologies Inc. Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.3.4 TTM Technologies Inc. Main Business and Markets Served
7.3.5 TTM Technologies Inc. Recent Developments/Updates
7.4 Unimicron
7.4.1 Unimicron Ball Grid Array (BGA) PCB Corporation Information
7.4.2 Unimicron Ball Grid Array (BGA) PCB Product Portfolio
7.4.3 Unimicron Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Unimicron Main Business and Markets Served
7.4.5 Unimicron Recent Developments/Updates
7.5 Shennan Circuits
7.5.1 Shennan Circuits Ball Grid Array (BGA) PCB Corporation Information
7.5.2 Shennan Circuits Ball Grid Array (BGA) PCB Product Portfolio
7.5.3 Shennan Circuits Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Shennan Circuits Main Business and Markets Served
7.5.5 Shennan Circuits Recent Developments/Updates
7.6 CMK Corporation
7.6.1 CMK Corporation Ball Grid Array (BGA) PCB Corporation Information
7.6.2 CMK Corporation Ball Grid Array (BGA) PCB Product Portfolio
7.6.3 CMK Corporation Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.6.4 CMK Corporation Main Business and Markets Served
7.6.5 CMK Corporation Recent Developments/Updates
7.7 Kingboard
7.7.1 Kingboard Ball Grid Array (BGA) PCB Corporation Information
7.7.2 Kingboard Ball Grid Array (BGA) PCB Product Portfolio
7.7.3 Kingboard Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Kingboard Main Business and Markets Served
7.7.5 Kingboard Recent Developments/Updates
7.8 Creative Hi-tech Ltd.
7.8.1 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Corporation Information
7.8.2 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Product Portfolio
7.8.3 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Creative Hi-tech Ltd. Main Business and Markets Served
7.7.5 Creative Hi-tech Ltd. Recent Developments/Updates
7.9 Mer-Mar Electronics
7.9.1 Mer-Mar Electronics Ball Grid Array (BGA) PCB Corporation Information
7.9.2 Mer-Mar Electronics Ball Grid Array (BGA) PCB Product Portfolio
7.9.3 Mer-Mar Electronics Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Mer-Mar Electronics Main Business and Markets Served
7.9.5 Mer-Mar Electronics Recent Developments/Updates
7.10 JHYPCB
7.10.1 JHYPCB Ball Grid Array (BGA) PCB Corporation Information
7.10.2 JHYPCB Ball Grid Array (BGA) PCB Product Portfolio
7.10.3 JHYPCB Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.10.4 JHYPCB Main Business and Markets Served
7.10.5 JHYPCB Recent Developments/Updates
7.11 Multi Circuit Boards Ltd.
7.11.1 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Corporation Information
7.11.2 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Product Portfolio
7.11.3 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Multi Circuit Boards Ltd. Main Business and Markets Served
7.11.5 Multi Circuit Boards Ltd. Recent Developments/Updates
7.12 PCBAStore
7.12.1 PCBAStore Ball Grid Array (BGA) PCB Corporation Information
7.12.2 PCBAStore Ball Grid Array (BGA) PCB Product Portfolio
7.12.3 PCBAStore Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.12.4 PCBAStore Main Business and Markets Served
7.12.5 PCBAStore Recent Developments/Updates
7.13 Sierra Circuits
7.13.1 Sierra Circuits Ball Grid Array (BGA) PCB Corporation Information
7.13.2 Sierra Circuits Ball Grid Array (BGA) PCB Product Portfolio
7.13.3 Sierra Circuits Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Sierra Circuits Main Business and Markets Served
7.13.5 Sierra Circuits Recent Developments/Updates
7.14 Cirexx
7.14.1 Cirexx Ball Grid Array (BGA) PCB Corporation Information
7.14.2 Cirexx Ball Grid Array (BGA) PCB Product Portfolio
7.14.3 Cirexx Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Cirexx Main Business and Markets Served
7.14.5 Cirexx Recent Developments/Updates
7.15 Pcbcart
7.15.1 Pcbcart Ball Grid Array (BGA) PCB Corporation Information
7.15.2 Pcbcart Ball Grid Array (BGA) PCB Product Portfolio
7.15.3 Pcbcart Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Pcbcart Main Business and Markets Served
7.15.5 Pcbcart Recent Developments/Updates
7.16 RayMing
7.16.1 RayMing Ball Grid Array (BGA) PCB Corporation Information
7.16.2 RayMing Ball Grid Array (BGA) PCB Product Portfolio
7.16.3 RayMing Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.16.4 RayMing Main Business and Markets Served
7.16.5 RayMing Recent Developments/Updates
7.17 UCREATE ELECTRONIC GROUP
7.17.1 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Corporation Information
7.17.2 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Product Portfolio
7.17.3 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2019-2024)
7.17.4 UCREATE ELECTRONIC GROUP Main Business and Markets Served
7.17.5 UCREATE ELECTRONIC GROUP Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Ball Grid Array (BGA) PCB Industry Chain Analysis
8.2 Ball Grid Array (BGA) PCB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Ball Grid Array (BGA) PCB Production Mode & Process
8.4 Ball Grid Array (BGA) PCB Sales and Marketing
8.4.1 Ball Grid Array (BGA) PCB Sales Channels
8.4.2 Ball Grid Array (BGA) PCB Distributors
8.5 Ball Grid Array (BGA) PCB Customers
9 Ball Grid Array (BGA) PCB Market Dynamics
9.1 Ball Grid Array (BGA) PCB Industry Trends
9.2 Ball Grid Array (BGA) PCB Market Drivers
9.3 Ball Grid Array (BGA) PCB Market Challenges
9.4 Ball Grid Array (BGA) PCB Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Samsung Electro-Mechanics
Nanya PCB
TTM Technologies Inc.
Unimicron
Shennan Circuits
CMK Corporation
Kingboard
Creative Hi-tech Ltd.
Mer-Mar Electronics
JHYPCB
Multi Circuit Boards Ltd.
PCBAStore
Sierra Circuits
Cirexx
Pcbcart
RayMing
UCREATE ELECTRONIC GROUP
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听
*If Applicable.
