The global market for BGA Package Substrate was valued at US$ 7020 million in the year 2024 and is projected to reach a revised size of US$ 10630 million by 2031, growing at a CAGR of 6.2% during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for BGA Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Package Substrate.
The BGA Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global BGA Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the BGA Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
IBIDEN
SHINKO
SimmTech
Korea Circuit
SAMSUNG ELECTRO-MECHANICS
SEP Co ., Ltd
Nan Ya PCB Corporation
Siliconware Precision Industries
LG Innotek
TOPPAN INC
Kyocera
QP Technologies
FICT Limited
Shenzhen Hemeijingyi
Zhen Ding Technology
AT&S
KINSUS
Daeduck Electronics
ASE Technology
ACCESS
by Type
WB BGA
FC-BGA
by Application
MPU/CPU/Chipset
GPU and CPU
ASIC/DSP Chip/FPGA
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 BGA Package Substrate Market Overview
1.1 Product Definition
1.2 BGA Package Substrate by Type
1.2.1 Global BGA Package Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 WB BGA
1.2.3 FC-BGA
1.3 BGA Package Substrate by Application
1.3.1 Global BGA Package Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 MPU/CPU/Chipset
1.3.3 GPU and CPU
1.3.4 ASIC/DSP Chip/FPGA
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global BGA Package Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global BGA Package Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global BGA Package Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global BGA Package Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global BGA Package Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global BGA Package Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of BGA Package Substrate, Industry Ranking, 2023 VS 2024
2.4 Global BGA Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global BGA Package Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of BGA Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of BGA Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of BGA Package Substrate, Date of Enter into This Industry
2.9 BGA Package Substrate Market Competitive Situation and Trends
2.9.1 BGA Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest BGA Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 BGA Package Substrate Production by Region
3.1 Global BGA Package Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global BGA Package Substrate Production Value by Region (2020-2031)
3.2.1 Global BGA Package Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of BGA Package Substrate by Region (2026-2031)
3.3 Global BGA Package Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global BGA Package Substrate Production Volume by Region (2020-2031)
3.4.1 Global BGA Package Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of BGA Package Substrate by Region (2026-2031)
3.5 Global BGA Package Substrate Market Price Analysis by Region (2020-2025)
3.6 Global BGA Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America BGA Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe BGA Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China BGA Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan BGA Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea BGA Package Substrate Production Value Estimates and Forecasts (2020-2031)
4 BGA Package Substrate Consumption by Region
4.1 Global BGA Package Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global BGA Package Substrate Consumption by Region (2020-2031)
4.2.1 Global BGA Package Substrate Consumption by Region (2020-2025)
4.2.2 Global BGA Package Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America BGA Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America BGA Package Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe BGA Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe BGA Package Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific BGA Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific BGA Package Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa BGA Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa BGA Package Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global BGA Package Substrate Production by Type (2020-2031)
5.1.1 Global BGA Package Substrate Production by Type (2020-2025)
5.1.2 Global BGA Package Substrate Production by Type (2026-2031)
5.1.3 Global BGA Package Substrate Production Market Share by Type (2020-2031)
5.2 Global BGA Package Substrate Production Value by Type (2020-2031)
5.2.1 Global BGA Package Substrate Production Value by Type (2020-2025)
5.2.2 Global BGA Package Substrate Production Value by Type (2026-2031)
5.2.3 Global BGA Package Substrate Production Value Market Share by Type (2020-2031)
5.3 Global BGA Package Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global BGA Package Substrate Production by Application (2020-2031)
6.1.1 Global BGA Package Substrate Production by Application (2020-2025)
6.1.2 Global BGA Package Substrate Production by Application (2026-2031)
6.1.3 Global BGA Package Substrate Production Market Share by Application (2020-2031)
6.2 Global BGA Package Substrate Production Value by Application (2020-2031)
6.2.1 Global BGA Package Substrate Production Value by Application (2020-2025)
6.2.2 Global BGA Package Substrate Production Value by Application (2026-2031)
6.2.3 Global BGA Package Substrate Production Value Market Share by Application (2020-2031)
6.3 Global BGA Package Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 IBIDEN
7.1.1 IBIDEN BGA Package Substrate Company Information
7.1.2 IBIDEN BGA Package Substrate Product Portfolio
7.1.3 IBIDEN BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 IBIDEN Main Business and Markets Served
7.1.5 IBIDEN Recent Developments/Updates
7.2 SHINKO
7.2.1 SHINKO BGA Package Substrate Company Information
7.2.2 SHINKO BGA Package Substrate Product Portfolio
7.2.3 SHINKO BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 SHINKO Main Business and Markets Served
7.2.5 SHINKO Recent Developments/Updates
7.3 SimmTech
7.3.1 SimmTech BGA Package Substrate Company Information
7.3.2 SimmTech BGA Package Substrate Product Portfolio
7.3.3 SimmTech BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 SimmTech Main Business and Markets Served
7.3.5 SimmTech Recent Developments/Updates
7.4 Korea Circuit
7.4.1 Korea Circuit BGA Package Substrate Company Information
7.4.2 Korea Circuit BGA Package Substrate Product Portfolio
7.4.3 Korea Circuit BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Korea Circuit Main Business and Markets Served
7.4.5 Korea Circuit Recent Developments/Updates
7.5 SAMSUNG ELECTRO-MECHANICS
7.5.1 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Company Information
7.5.2 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Product Portfolio
7.5.3 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 SAMSUNG ELECTRO-MECHANICS Main Business and Markets Served
7.5.5 SAMSUNG ELECTRO-MECHANICS Recent Developments/Updates
7.6 SEP Co ., Ltd
7.6.1 SEP Co ., Ltd BGA Package Substrate Company Information
7.6.2 SEP Co ., Ltd BGA Package Substrate Product Portfolio
7.6.3 SEP Co ., Ltd BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 SEP Co ., Ltd Main Business and Markets Served
7.6.5 SEP Co ., Ltd Recent Developments/Updates
7.7 Nan Ya PCB Corporation
7.7.1 Nan Ya PCB Corporation BGA Package Substrate Company Information
7.7.2 Nan Ya PCB Corporation BGA Package Substrate Product Portfolio
7.7.3 Nan Ya PCB Corporation BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Nan Ya PCB Corporation Main Business and Markets Served
7.7.5 Nan Ya PCB Corporation Recent Developments/Updates
7.8 Siliconware Precision Industries
7.8.1 Siliconware Precision Industries BGA Package Substrate Company Information
7.8.2 Siliconware Precision Industries BGA Package Substrate Product Portfolio
7.8.3 Siliconware Precision Industries BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Siliconware Precision Industries Main Business and Markets Served
7.8.5 Siliconware Precision Industries Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek BGA Package Substrate Company Information
7.9.2 LG Innotek BGA Package Substrate Product Portfolio
7.9.3 LG Innotek BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 TOPPAN INC
7.10.1 TOPPAN INC BGA Package Substrate Company Information
7.10.2 TOPPAN INC BGA Package Substrate Product Portfolio
7.10.3 TOPPAN INC BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 TOPPAN INC Main Business and Markets Served
7.10.5 TOPPAN INC Recent Developments/Updates
7.11 Kyocera
7.11.1 Kyocera BGA Package Substrate Company Information
7.11.2 Kyocera BGA Package Substrate Product Portfolio
7.11.3 Kyocera BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Kyocera Main Business and Markets Served
7.11.5 Kyocera Recent Developments/Updates
7.12 QP Technologies
7.12.1 QP Technologies BGA Package Substrate Company Information
7.12.2 QP Technologies BGA Package Substrate Product Portfolio
7.12.3 QP Technologies BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 QP Technologies Main Business and Markets Served
7.12.5 QP Technologies Recent Developments/Updates
7.13 FICT Limited
7.13.1 FICT Limited BGA Package Substrate Company Information
7.13.2 FICT Limited BGA Package Substrate Product Portfolio
7.13.3 FICT Limited BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 FICT Limited Main Business and Markets Served
7.13.5 FICT Limited Recent Developments/Updates
7.14 Shenzhen Hemeijingyi
7.14.1 Shenzhen Hemeijingyi BGA Package Substrate Company Information
7.14.2 Shenzhen Hemeijingyi BGA Package Substrate Product Portfolio
7.14.3 Shenzhen Hemeijingyi BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Shenzhen Hemeijingyi Main Business and Markets Served
7.14.5 Shenzhen Hemeijingyi Recent Developments/Updates
7.15 Zhen Ding Technology
7.15.1 Zhen Ding Technology BGA Package Substrate Company Information
7.15.2 Zhen Ding Technology BGA Package Substrate Product Portfolio
7.15.3 Zhen Ding Technology BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Zhen Ding Technology Main Business and Markets Served
7.15.5 Zhen Ding Technology Recent Developments/Updates
7.16 AT&S
7.16.1 AT&S BGA Package Substrate Company Information
7.16.2 AT&S BGA Package Substrate Product Portfolio
7.16.3 AT&S BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 AT&S Main Business and Markets Served
7.16.5 AT&S Recent Developments/Updates
7.17 KINSUS
7.17.1 KINSUS BGA Package Substrate Company Information
7.17.2 KINSUS BGA Package Substrate Product Portfolio
7.17.3 KINSUS BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.17.4 KINSUS Main Business and Markets Served
7.17.5 KINSUS Recent Developments/Updates
7.18 Daeduck Electronics
7.18.1 Daeduck Electronics BGA Package Substrate Company Information
7.18.2 Daeduck Electronics BGA Package Substrate Product Portfolio
7.18.3 Daeduck Electronics BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Daeduck Electronics Main Business and Markets Served
7.18.5 Daeduck Electronics Recent Developments/Updates
7.19 ASE Technology
7.19.1 ASE Technology BGA Package Substrate Company Information
7.19.2 ASE Technology BGA Package Substrate Product Portfolio
7.19.3 ASE Technology BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.19.4 ASE Technology Main Business and Markets Served
7.19.5 ASE Technology Recent Developments/Updates
7.20 ACCESS
7.20.1 ACCESS BGA Package Substrate Company Information
7.20.2 ACCESS BGA Package Substrate Product Portfolio
7.20.3 ACCESS BGA Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.20.4 ACCESS Main Business and Markets Served
7.20.5 ACCESS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 BGA Package Substrate Industry Chain Analysis
8.2 BGA Package Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 BGA Package Substrate Production Mode & Process Analysis
8.4 BGA Package Substrate Sales and Marketing
8.4.1 BGA Package Substrate Sales Channels
8.4.2 BGA Package Substrate Distributors
8.5 BGA Package Substrate Customer Analysis
9 BGA Package Substrate Market Dynamics
9.1 BGA Package Substrate Industry Trends
9.2 BGA Package Substrate Market Drivers
9.3 BGA Package Substrate Market Challenges
9.4 BGA Package Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
IBIDEN
SHINKO
SimmTech
Korea Circuit
SAMSUNG ELECTRO-MECHANICS
SEP Co ., Ltd
Nan Ya PCB Corporation
Siliconware Precision Industries
LG Innotek
TOPPAN INC
Kyocera
QP Technologies
FICT Limited
Shenzhen Hemeijingyi
Zhen Ding Technology
AT&S
KINSUS
Daeduck Electronics
ASE Technology
ACCESS
听
听
*If Applicable.
