On-board Ethernet can not only support higher rate transmission, but also have large bandwidth, low delay and low electromagnetic interference
Disturbance and other advantages, as well as the normalization of the link connection form, reduce the vehicle link type and cost, and can be widely used in entertainment, ADAS, Internet of Vehicles and other systems. Therefore, on-board Ethernet is expected to gradually replace the traditional bus technology and become the next generation of on-board network architecture.
Ethernet circuit interface is mainly composed of data link layer (MAC) and physical layer (PHY). At present, most of the automotive processors have included MAC control, while Ethernet physical layer chip (PHY) is used as an independent chip to provide Ethernet access channel, which plays the role of connecting the processor and communication media.
The global On-board Ethernet Physical Layer Chip market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for On-board Ethernet Physical Layer Chip is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for On-board Ethernet Physical Layer Chip is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of On-board Ethernet Physical Layer Chip include Marvell, Broadcom Inc, Realtek Semiconductor Corp, Texas Instruments, NXP Semiconductors and Motorcomm Electronic, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for On-board Ethernet Physical Layer Chip, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding On-board Ethernet Physical Layer Chip.
The On-board Ethernet Physical Layer Chip market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global On-board Ethernet Physical Layer Chip market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the On-board Ethernet Physical Layer Chip manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Marvell
Broadcom Inc
Realtek Semiconductor Corp
Texas Instruments
NXP Semiconductors
Motorcomm Electronic
Segment by Type
<2.5 GE
2.5-5 GE
>5 GE
Segment by Application
Passenger Cars
Commercial Vehicles
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of On-board Ethernet Physical Layer Chip manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of On-board Ethernet Physical Layer Chip by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of On-board Ethernet Physical Layer Chip in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 On-board Ethernet Physical Layer Chip Market Overview
1.1 Product Definition
1.2 On-board Ethernet Physical Layer Chip Segment by Type
1.2.1 Global On-board Ethernet Physical Layer Chip Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 <2.5 GE
1.2.3 2.5-5 GE
1.2.4 >5 GE
1.3 On-board Ethernet Physical Layer Chip Segment by Application
1.3.1 Global On-board Ethernet Physical Layer Chip Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Passenger Cars
1.3.3 Commercial Vehicles
1.4 Global Market Growth Prospects
1.4.1 Global On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global On-board Ethernet Physical Layer Chip Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global On-board Ethernet Physical Layer Chip Production Estimates and Forecasts (2018-2029)
1.4.4 Global On-board Ethernet Physical Layer Chip Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global On-board Ethernet Physical Layer Chip Production Market Share by Manufacturers (2018-2023)
2.2 Global On-board Ethernet Physical Layer Chip Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of On-board Ethernet Physical Layer Chip, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global On-board Ethernet Physical Layer Chip Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global On-board Ethernet Physical Layer Chip Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of On-board Ethernet Physical Layer Chip, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of On-board Ethernet Physical Layer Chip, Product Offered and Application
2.8 Global Key Manufacturers of On-board Ethernet Physical Layer Chip, Date of Enter into This Industry
2.9 On-board Ethernet Physical Layer Chip Market Competitive Situation and Trends
2.9.1 On-board Ethernet Physical Layer Chip Market Concentration Rate
2.9.2 Global 5 and 10 Largest On-board Ethernet Physical Layer Chip Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 On-board Ethernet Physical Layer Chip Production by Region
3.1 Global On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global On-board Ethernet Physical Layer Chip Production Value by Region (2018-2029)
3.2.1 Global On-board Ethernet Physical Layer Chip Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of On-board Ethernet Physical Layer Chip by Region (2024-2029)
3.3 Global On-board Ethernet Physical Layer Chip Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global On-board Ethernet Physical Layer Chip Production by Region (2018-2029)
3.4.1 Global On-board Ethernet Physical Layer Chip Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of On-board Ethernet Physical Layer Chip by Region (2024-2029)
3.5 Global On-board Ethernet Physical Layer Chip Market Price Analysis by Region (2018-2023)
3.6 Global On-board Ethernet Physical Layer Chip Production and Value, Year-over-Year Growth
3.6.1 North America On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts (2018-2029)
3.6.3 China On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea On-board Ethernet Physical Layer Chip Production Value Estimates and Forecasts (2018-2029)
4 On-board Ethernet Physical Layer Chip Consumption by Region
4.1 Global On-board Ethernet Physical Layer Chip Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global On-board Ethernet Physical Layer Chip Consumption by Region (2018-2029)
4.2.1 Global On-board Ethernet Physical Layer Chip Consumption by Region (2018-2023)
4.2.2 Global On-board Ethernet Physical Layer Chip Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America On-board Ethernet Physical Layer Chip Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America On-board Ethernet Physical Layer Chip Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe On-board Ethernet Physical Layer Chip Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe On-board Ethernet Physical Layer Chip Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific On-board Ethernet Physical Layer Chip Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific On-board Ethernet Physical Layer Chip Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa On-board Ethernet Physical Layer Chip Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa On-board Ethernet Physical Layer Chip Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global On-board Ethernet Physical Layer Chip Production by Type (2018-2029)
5.1.1 Global On-board Ethernet Physical Layer Chip Production by Type (2018-2023)
5.1.2 Global On-board Ethernet Physical Layer Chip Production by Type (2024-2029)
5.1.3 Global On-board Ethernet Physical Layer Chip Production Market Share by Type (2018-2029)
5.2 Global On-board Ethernet Physical Layer Chip Production Value by Type (2018-2029)
5.2.1 Global On-board Ethernet Physical Layer Chip Production Value by Type (2018-2023)
5.2.2 Global On-board Ethernet Physical Layer Chip Production Value by Type (2024-2029)
5.2.3 Global On-board Ethernet Physical Layer Chip Production Value Market Share by Type (2018-2029)
5.3 Global On-board Ethernet Physical Layer Chip Price by Type (2018-2029)
6 Segment by Application
6.1 Global On-board Ethernet Physical Layer Chip Production by Application (2018-2029)
6.1.1 Global On-board Ethernet Physical Layer Chip Production by Application (2018-2023)
6.1.2 Global On-board Ethernet Physical Layer Chip Production by Application (2024-2029)
6.1.3 Global On-board Ethernet Physical Layer Chip Production Market Share by Application (2018-2029)
6.2 Global On-board Ethernet Physical Layer Chip Production Value by Application (2018-2029)
6.2.1 Global On-board Ethernet Physical Layer Chip Production Value by Application (2018-2023)
6.2.2 Global On-board Ethernet Physical Layer Chip Production Value by Application (2024-2029)
6.2.3 Global On-board Ethernet Physical Layer Chip Production Value Market Share by Application (2018-2029)
6.3 Global On-board Ethernet Physical Layer Chip Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Marvell
7.1.1 Marvell On-board Ethernet Physical Layer Chip Corporation Information
7.1.2 Marvell On-board Ethernet Physical Layer Chip Product Portfolio
7.1.3 Marvell On-board Ethernet Physical Layer Chip Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Marvell Main Business and Markets Served
7.1.5 Marvell Recent Developments/Updates
7.2 Broadcom Inc
7.2.1 Broadcom Inc On-board Ethernet Physical Layer Chip Corporation Information
7.2.2 Broadcom Inc On-board Ethernet Physical Layer Chip Product Portfolio
7.2.3 Broadcom Inc On-board Ethernet Physical Layer Chip Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Broadcom Inc Main Business and Markets Served
7.2.5 Broadcom Inc Recent Developments/Updates
7.3 Realtek Semiconductor Corp
7.3.1 Realtek Semiconductor Corp On-board Ethernet Physical Layer Chip Corporation Information
7.3.2 Realtek Semiconductor Corp On-board Ethernet Physical Layer Chip Product Portfolio
7.3.3 Realtek Semiconductor Corp On-board Ethernet Physical Layer Chip Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Realtek Semiconductor Corp Main Business and Markets Served
7.3.5 Realtek Semiconductor Corp Recent Developments/Updates
7.4 Texas Instruments
7.4.1 Texas Instruments On-board Ethernet Physical Layer Chip Corporation Information
7.4.2 Texas Instruments On-board Ethernet Physical Layer Chip Product Portfolio
7.4.3 Texas Instruments On-board Ethernet Physical Layer Chip Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Texas Instruments Main Business and Markets Served
7.4.5 Texas Instruments Recent Developments/Updates
7.5 NXP Semiconductors
7.5.1 NXP Semiconductors On-board Ethernet Physical Layer Chip Corporation Information
7.5.2 NXP Semiconductors On-board Ethernet Physical Layer Chip Product Portfolio
7.5.3 NXP Semiconductors On-board Ethernet Physical Layer Chip Production, Value, Price and Gross Margin (2018-2023)
7.5.4 NXP Semiconductors Main Business and Markets Served
7.5.5 NXP Semiconductors Recent Developments/Updates
7.6 Motorcomm Electronic
7.6.1 Motorcomm Electronic On-board Ethernet Physical Layer Chip Corporation Information
7.6.2 Motorcomm Electronic On-board Ethernet Physical Layer Chip Product Portfolio
7.6.3 Motorcomm Electronic On-board Ethernet Physical Layer Chip Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Motorcomm Electronic Main Business and Markets Served
7.6.5 Motorcomm Electronic Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 On-board Ethernet Physical Layer Chip Industry Chain Analysis
8.2 On-board Ethernet Physical Layer Chip Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 On-board Ethernet Physical Layer Chip Production Mode & Process
8.4 On-board Ethernet Physical Layer Chip Sales and Marketing
8.4.1 On-board Ethernet Physical Layer Chip Sales Channels
8.4.2 On-board Ethernet Physical Layer Chip Distributors
8.5 On-board Ethernet Physical Layer Chip Customers
9 On-board Ethernet Physical Layer Chip Market Dynamics
9.1 On-board Ethernet Physical Layer Chip Industry Trends
9.2 On-board Ethernet Physical Layer Chip Market Drivers
9.3 On-board Ethernet Physical Layer Chip Market Challenges
9.4 On-board Ethernet Physical Layer Chip Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Marvell
Broadcom Inc
Realtek Semiconductor Corp
Texas Instruments
NXP Semiconductors
Motorcomm Electronic
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*If Applicable.
