The global market for Bonding Wires for Power Device was valued at US$ 1360 million in the year 2024 and is projected to reach a revised size of US$ 2489 million by 2031, growing at a CAGR of 9.5% during the forecast period.
Bonding wire, as the core inner lead material in the packaging process, is an indispensable basic component in the manufacturing process of integrated circuits and discrete semiconductor devices. It specifically refers to the fine metal wire used to electrically connect the bonding points of the internal circuit of the chip with the internal contact points of the lead frame through wire bonding technology during the assembly process of semiconductor devices and integrated circuits. Bonding wire for power devices mainly refers to bonding wire used for devices such as IGBT and MOSFET.
North American market for Bonding Wires for Power Device is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Bonding Wires for Power Device is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Bonding Wires for Power Device include TANAKA Precious Metals, Heraeus, Nippon Micrometal Corporation, TATSUTA Electric Wire & Cable, Precision Packaging Materials, MK Electron, LT Metal, Niche-Tech, Microbonds, AMETEK Coining, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Bonding Wires for Power Device, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonding Wires for Power Device.
The Bonding Wires for Power Device market size, estimations, and forecasts are provided in terms of output/shipments (M Meter) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Bonding Wires for Power Device market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Bonding Wires for Power Device manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TANAKA Precious Metals
Heraeus
Nippon Micrometal Corporation
TATSUTA Electric Wire & Cable
Precision Packaging Materials
MK Electron
LT Metal
Niche-Tech
Microbonds
AMETEK Coining
Shanghai MATFRON
Shanghai Wonsung
Ningbo Kangqiang Electronics
Zhejiang Yipu
Sichuan Winner
Yantai Zhaojin Kanfort Precious Metals Co., Ltd
Yantai Yesno
Jiangsu Jincan Electronics
Sigma
by Type
Aluminum Bonding Wire
Copper Bonding Wire
Silver Bonding Wire
Gold Bonding Wire
by Application
IGBT
MOSFET
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Bonding Wires for Power Device manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Bonding Wires for Power Device by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Bonding Wires for Power Device in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Bonding Wires for Power Device Market Overview
1.1 Product Definition
1.2 Bonding Wires for Power Device by Type
1.2.1 Global Bonding Wires for Power Device Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Aluminum Bonding Wire
1.2.3 Copper Bonding Wire
1.2.4 Silver Bonding Wire
1.2.5 Gold Bonding Wire
1.3 Bonding Wires for Power Device by Application
1.3.1 Global Bonding Wires for Power Device Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 IGBT
1.3.3 MOSFET
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Bonding Wires for Power Device Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Bonding Wires for Power Device Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Bonding Wires for Power Device Production Estimates and Forecasts (2020-2031)
1.4.4 Global Bonding Wires for Power Device Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Bonding Wires for Power Device Production Market Share by Manufacturers (2020-2025)
2.2 Global Bonding Wires for Power Device Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Bonding Wires for Power Device, Industry Ranking, 2023 VS 2024
2.4 Global Bonding Wires for Power Device Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Bonding Wires for Power Device Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Bonding Wires for Power Device, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Bonding Wires for Power Device, Product Offered and Application
2.8 Global Key Manufacturers of Bonding Wires for Power Device, Date of Enter into This Industry
2.9 Bonding Wires for Power Device Market Competitive Situation and Trends
2.9.1 Bonding Wires for Power Device Market Concentration Rate
2.9.2 Global 5 and 10 Largest Bonding Wires for Power Device Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Bonding Wires for Power Device Production by Region
3.1 Global Bonding Wires for Power Device Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Bonding Wires for Power Device Production Value by Region (2020-2031)
3.2.1 Global Bonding Wires for Power Device Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Bonding Wires for Power Device by Region (2026-2031)
3.3 Global Bonding Wires for Power Device Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Bonding Wires for Power Device Production Volume by Region (2020-2031)
3.4.1 Global Bonding Wires for Power Device Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Bonding Wires for Power Device by Region (2026-2031)
3.5 Global Bonding Wires for Power Device Market Price Analysis by Region (2020-2025)
3.6 Global Bonding Wires for Power Device Production and Value, Year-over-Year Growth
3.6.1 North America Bonding Wires for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Bonding Wires for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Bonding Wires for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Bonding Wires for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Bonding Wires for Power Device Production Value Estimates and Forecasts (2020-2031)
4 Bonding Wires for Power Device Consumption by Region
4.1 Global Bonding Wires for Power Device Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Bonding Wires for Power Device Consumption by Region (2020-2031)
4.2.1 Global Bonding Wires for Power Device Consumption by Region (2020-2025)
4.2.2 Global Bonding Wires for Power Device Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Bonding Wires for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Bonding Wires for Power Device Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Bonding Wires for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Bonding Wires for Power Device Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Bonding Wires for Power Device Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Bonding Wires for Power Device Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Bonding Wires for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Bonding Wires for Power Device Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Bonding Wires for Power Device Production by Type (2020-2031)
5.1.1 Global Bonding Wires for Power Device Production by Type (2020-2025)
5.1.2 Global Bonding Wires for Power Device Production by Type (2026-2031)
5.1.3 Global Bonding Wires for Power Device Production Market Share by Type (2020-2031)
5.2 Global Bonding Wires for Power Device Production Value by Type (2020-2031)
5.2.1 Global Bonding Wires for Power Device Production Value by Type (2020-2025)
5.2.2 Global Bonding Wires for Power Device Production Value by Type (2026-2031)
5.2.3 Global Bonding Wires for Power Device Production Value Market Share by Type (2020-2031)
5.3 Global Bonding Wires for Power Device Price by Type (2020-2031)
6 Segment by Application
6.1 Global Bonding Wires for Power Device Production by Application (2020-2031)
6.1.1 Global Bonding Wires for Power Device Production by Application (2020-2025)
6.1.2 Global Bonding Wires for Power Device Production by Application (2026-2031)
6.1.3 Global Bonding Wires for Power Device Production Market Share by Application (2020-2031)
6.2 Global Bonding Wires for Power Device Production Value by Application (2020-2031)
6.2.1 Global Bonding Wires for Power Device Production Value by Application (2020-2025)
6.2.2 Global Bonding Wires for Power Device Production Value by Application (2026-2031)
6.2.3 Global Bonding Wires for Power Device Production Value Market Share by Application (2020-2031)
6.3 Global Bonding Wires for Power Device Price by Application (2020-2031)
7 Key Companies Profiled
7.1 TANAKA Precious Metals
7.1.1 TANAKA Precious Metals Bonding Wires for Power Device Company Information
7.1.2 TANAKA Precious Metals Bonding Wires for Power Device Product Portfolio
7.1.3 TANAKA Precious Metals Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.1.4 TANAKA Precious Metals Main Business and Markets Served
7.1.5 TANAKA Precious Metals Recent Developments/Updates
7.2 Heraeus
7.2.1 Heraeus Bonding Wires for Power Device Company Information
7.2.2 Heraeus Bonding Wires for Power Device Product Portfolio
7.2.3 Heraeus Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Heraeus Main Business and Markets Served
7.2.5 Heraeus Recent Developments/Updates
7.3 Nippon Micrometal Corporation
7.3.1 Nippon Micrometal Corporation Bonding Wires for Power Device Company Information
7.3.2 Nippon Micrometal Corporation Bonding Wires for Power Device Product Portfolio
7.3.3 Nippon Micrometal Corporation Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Nippon Micrometal Corporation Main Business and Markets Served
7.3.5 Nippon Micrometal Corporation Recent Developments/Updates
7.4 TATSUTA Electric Wire & Cable
7.4.1 TATSUTA Electric Wire & Cable Bonding Wires for Power Device Company Information
7.4.2 TATSUTA Electric Wire & Cable Bonding Wires for Power Device Product Portfolio
7.4.3 TATSUTA Electric Wire & Cable Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.4.4 TATSUTA Electric Wire & Cable Main Business and Markets Served
7.4.5 TATSUTA Electric Wire & Cable Recent Developments/Updates
7.5 Precision Packaging Materials
7.5.1 Precision Packaging Materials Bonding Wires for Power Device Company Information
7.5.2 Precision Packaging Materials Bonding Wires for Power Device Product Portfolio
7.5.3 Precision Packaging Materials Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Precision Packaging Materials Main Business and Markets Served
7.5.5 Precision Packaging Materials Recent Developments/Updates
7.6 MK Electron
7.6.1 MK Electron Bonding Wires for Power Device Company Information
7.6.2 MK Electron Bonding Wires for Power Device Product Portfolio
7.6.3 MK Electron Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.6.4 MK Electron Main Business and Markets Served
7.6.5 MK Electron Recent Developments/Updates
7.7 LT Metal
7.7.1 LT Metal Bonding Wires for Power Device Company Information
7.7.2 LT Metal Bonding Wires for Power Device Product Portfolio
7.7.3 LT Metal Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.7.4 LT Metal Main Business and Markets Served
7.7.5 LT Metal Recent Developments/Updates
7.8 Niche-Tech
7.8.1 Niche-Tech Bonding Wires for Power Device Company Information
7.8.2 Niche-Tech Bonding Wires for Power Device Product Portfolio
7.8.3 Niche-Tech Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Niche-Tech Main Business and Markets Served
7.8.5 Niche-Tech Recent Developments/Updates
7.9 Microbonds
7.9.1 Microbonds Bonding Wires for Power Device Company Information
7.9.2 Microbonds Bonding Wires for Power Device Product Portfolio
7.9.3 Microbonds Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Microbonds Main Business and Markets Served
7.9.5 Microbonds Recent Developments/Updates
7.10 AMETEK Coining
7.10.1 AMETEK Coining Bonding Wires for Power Device Company Information
7.10.2 AMETEK Coining Bonding Wires for Power Device Product Portfolio
7.10.3 AMETEK Coining Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.10.4 AMETEK Coining Main Business and Markets Served
7.10.5 AMETEK Coining Recent Developments/Updates
7.11 Shanghai MATFRON
7.11.1 Shanghai MATFRON Bonding Wires for Power Device Company Information
7.11.2 Shanghai MATFRON Bonding Wires for Power Device Product Portfolio
7.11.3 Shanghai MATFRON Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Shanghai MATFRON Main Business and Markets Served
7.11.5 Shanghai MATFRON Recent Developments/Updates
7.12 Shanghai Wonsung
7.12.1 Shanghai Wonsung Bonding Wires for Power Device Company Information
7.12.2 Shanghai Wonsung Bonding Wires for Power Device Product Portfolio
7.12.3 Shanghai Wonsung Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Shanghai Wonsung Main Business and Markets Served
7.12.5 Shanghai Wonsung Recent Developments/Updates
7.13 Ningbo Kangqiang Electronics
7.13.1 Ningbo Kangqiang Electronics Bonding Wires for Power Device Company Information
7.13.2 Ningbo Kangqiang Electronics Bonding Wires for Power Device Product Portfolio
7.13.3 Ningbo Kangqiang Electronics Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Ningbo Kangqiang Electronics Main Business and Markets Served
7.13.5 Ningbo Kangqiang Electronics Recent Developments/Updates
7.14 Zhejiang Yipu
7.14.1 Zhejiang Yipu Bonding Wires for Power Device Company Information
7.14.2 Zhejiang Yipu Bonding Wires for Power Device Product Portfolio
7.14.3 Zhejiang Yipu Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Zhejiang Yipu Main Business and Markets Served
7.14.5 Zhejiang Yipu Recent Developments/Updates
7.15 Sichuan Winner
7.15.1 Sichuan Winner Bonding Wires for Power Device Company Information
7.15.2 Sichuan Winner Bonding Wires for Power Device Product Portfolio
7.15.3 Sichuan Winner Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Sichuan Winner Main Business and Markets Served
7.15.5 Sichuan Winner Recent Developments/Updates
7.16 Yantai Zhaojin Kanfort Precious Metals Co., Ltd
7.16.1 Yantai Zhaojin Kanfort Precious Metals Co., Ltd Bonding Wires for Power Device Company Information
7.16.2 Yantai Zhaojin Kanfort Precious Metals Co., Ltd Bonding Wires for Power Device Product Portfolio
7.16.3 Yantai Zhaojin Kanfort Precious Metals Co., Ltd Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Yantai Zhaojin Kanfort Precious Metals Co., Ltd Main Business and Markets Served
7.16.5 Yantai Zhaojin Kanfort Precious Metals Co., Ltd Recent Developments/Updates
7.17 Yantai Yesno
7.17.1 Yantai Yesno Bonding Wires for Power Device Company Information
7.17.2 Yantai Yesno Bonding Wires for Power Device Product Portfolio
7.17.3 Yantai Yesno Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Yantai Yesno Main Business and Markets Served
7.17.5 Yantai Yesno Recent Developments/Updates
7.18 Jiangsu Jincan Electronics
7.18.1 Jiangsu Jincan Electronics Bonding Wires for Power Device Company Information
7.18.2 Jiangsu Jincan Electronics Bonding Wires for Power Device Product Portfolio
7.18.3 Jiangsu Jincan Electronics Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Jiangsu Jincan Electronics Main Business and Markets Served
7.18.5 Jiangsu Jincan Electronics Recent Developments/Updates
7.19 Sigma
7.19.1 Sigma Bonding Wires for Power Device Company Information
7.19.2 Sigma Bonding Wires for Power Device Product Portfolio
7.19.3 Sigma Bonding Wires for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Sigma Main Business and Markets Served
7.19.5 Sigma Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Bonding Wires for Power Device Industry Chain Analysis
8.2 Bonding Wires for Power Device Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Bonding Wires for Power Device Production Mode & Process Analysis
8.4 Bonding Wires for Power Device Sales and Marketing
8.4.1 Bonding Wires for Power Device Sales Channels
8.4.2 Bonding Wires for Power Device Distributors
8.5 Bonding Wires for Power Device Customer Analysis
9 Bonding Wires for Power Device Market Dynamics
9.1 Bonding Wires for Power Device Industry Trends
9.2 Bonding Wires for Power Device Market Drivers
9.3 Bonding Wires for Power Device Market Challenges
9.4 Bonding Wires for Power Device Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
TANAKA Precious Metals
Heraeus
Nippon Micrometal Corporation
TATSUTA Electric Wire & Cable
Precision Packaging Materials
MK Electron
LT Metal
Niche-Tech
Microbonds
AMETEK Coining
Shanghai MATFRON
Shanghai Wonsung
Ningbo Kangqiang Electronics
Zhejiang Yipu
Sichuan Winner
Yantai Zhaojin Kanfort Precious Metals Co., Ltd
Yantai Yesno
Jiangsu Jincan Electronics
Sigma
听
听
*If Applicable.
