Market Analysis and Insights: Global Chip Assembly and Testing Market
The global Chip Assembly and Testing market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Covers:
This report presents an overview of global market for Chip Assembly and Testing market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Chip Assembly and Testing, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Chip Assembly and Testing, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Chip Assembly and Testing revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Chip Assembly and Testing market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Chip Assembly and Testing revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
King Yuan ELECTRONICS
Leadyo IC Testing
Sino Ic Technology
Ardentec Technology
Teradyne
ASE Technology Holding
Amkor Technology
JCET Group
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
ChipMOS TECHNOLOGIES
Chipbond Technology
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
UTAC
Hana Micron
OSE
NEPES
Unisem
Signetics
Carsem
Segment by Type
Wafer Probing
Final Test
Other
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Chip Assembly and Testing in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Assembly and Testing companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Chip Assembly and Testing revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Assembly and Testing Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Wafer Probing
1.2.3 Final Test
1.2.4 Other
1.3 Market by Application
1.3.1 Global Chip Assembly and Testing Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Assembly and Testing Market Perspective (2019-2030)
2.2 Global Chip Assembly and Testing Growth Trends by Region
2.2.1 Chip Assembly and Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Assembly and Testing Historic Market Size by Region (2019-2024)
2.2.3 Chip Assembly and Testing Forecasted Market Size by Region (2025-2030)
2.3 Chip Assembly and Testing Market Dynamics
2.3.1 Chip Assembly and Testing Industry Trends
2.3.2 Chip Assembly and Testing Market Drivers
2.3.3 Chip Assembly and Testing Market Challenges
2.3.4 Chip Assembly and Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Chip Assembly and Testing by Players
3.1.1 Global Chip Assembly and Testing Revenue by Players (2019-2024)
3.1.2 Global Chip Assembly and Testing Revenue Market Share by Players (2019-2024)
3.2 Global Chip Assembly and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Chip Assembly and Testing, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Chip Assembly and Testing Market Concentration Ratio
3.4.1 Global Chip Assembly and Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Assembly and Testing Revenue in 2023
3.5 Global Key Players of Chip Assembly and Testing Head office and Area Served
3.6 Global Key Players of Chip Assembly and Testing, Product and Application
3.7 Global Key Players of Chip Assembly and Testing, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Assembly and Testing Breakdown Data by Type
4.1 Global Chip Assembly and Testing Historic Market Size by Type (2019-2024)
4.2 Global Chip Assembly and Testing Forecasted Market Size by Type (2025-2030)
5 Chip Assembly and Testing Breakdown Data by Application
5.1 Global Chip Assembly and Testing Historic Market Size by Application (2019-2024)
5.2 Global Chip Assembly and Testing Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Assembly and Testing Market Size (2019-2030)
6.2 North America Chip Assembly and Testing Market Size by Type
6.2.1 North America Chip Assembly and Testing Market Size by Type (2019-2024)
6.2.2 North America Chip Assembly and Testing Market Size by Type (2025-2030)
6.2.3 North America Chip Assembly and Testing Market Share by Type (2019-2030)
6.3 North America Chip Assembly and Testing Market Size by Application
6.3.1 North America Chip Assembly and Testing Market Size by Application (2019-2024)
6.3.2 North America Chip Assembly and Testing Market Size by Application (2025-2030)
6.3.3 North America Chip Assembly and Testing Market Share by Application (2019-2030)
6.4 North America Chip Assembly and Testing Market Size by Country
6.4.1 North America Chip Assembly and Testing Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Chip Assembly and Testing Market Size by Country (2019-2024)
6.4.3 North America Chip Assembly and Testing Market Size by Country (2025-2030)
6.4.4 United States
6.4.5 Canada
7 Europe
7.1 Europe Chip Assembly and Testing Market Size (2019-2030)
7.2 Europe Chip Assembly and Testing Market Size by Type
7.2.1 Europe Chip Assembly and Testing Market Size by Type (2019-2024)
7.2.2 Europe Chip Assembly and Testing Market Size by Type (2025-2030)
7.2.3 Europe Chip Assembly and Testing Market Share by Type (2019-2030)
7.3 Europe Chip Assembly and Testing Market Size by Application
7.3.1 Europe Chip Assembly and Testing Market Size by Application (2019-2024)
7.3.2 Europe Chip Assembly and Testing Market Size by Application (2025-2030)
7.3.3 Europe Chip Assembly and Testing Market Share by Application (2019-2030)
7.4 Europe Chip Assembly and Testing Market Size by Country
7.4.1 Europe Chip Assembly and Testing Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Chip Assembly and Testing Market Size by Country (2019-2024)
7.4.3 Europe Chip Assembly and Testing Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Chip Assembly and Testing Market Size (2019-2030)
8.2 China Chip Assembly and Testing Market Size by Type
8.2.1 China Chip Assembly and Testing Market Size by Type (2019-2024)
8.2.2 China Chip Assembly and Testing Market Size by Type (2025-2030)
8.2.3 China Chip Assembly and Testing Market Share by Type (2019-2030)
8.3 China Chip Assembly and Testing Market Size by Application
8.3.1 China Chip Assembly and Testing Market Size by Application (2019-2024)
8.3.2 China Chip Assembly and Testing Market Size by Application (2025-2030)
8.3.3 China Chip Assembly and Testing Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Chip Assembly and Testing Market Size (2019-2030)
9.2 Asia Chip Assembly and Testing Market Size by Type
9.2.1 Asia Chip Assembly and Testing Market Size by Type (2019-2024)
9.2.2 Asia Chip Assembly and Testing Market Size by Type (2025-2030)
9.2.3 Asia Chip Assembly and Testing Market Share by Type (2019-2030)
9.3 Asia Chip Assembly and Testing Market Size by Application
9.3.1 Asia Chip Assembly and Testing Market Size by Application (2019-2024)
9.3.2 Asia Chip Assembly and Testing Market Size by Application (2025-2030)
9.3.3 Asia Chip Assembly and Testing Market Share by Application (2019-2030)
9.4 Asia Chip Assembly and Testing Market Size by Region
9.4.1 Asia Chip Assembly and Testing Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Chip Assembly and Testing Market Size by Region (2019-2024)
9.4.3 Asia Chip Assembly and Testing Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Type
10.2.1 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Chip Assembly and Testing Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Application
10.3.1 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Chip Assembly and Testing Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Country
10.4.1 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Chip Assembly and Testing Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 King Yuan ELECTRONICS
11.1.1 King Yuan ELECTRONICS Company Details
11.1.2 King Yuan ELECTRONICS Business Overview
11.1.3 King Yuan ELECTRONICS Chip Assembly and Testing Introduction
11.1.4 King Yuan ELECTRONICS Revenue in Chip Assembly and Testing Business (2019-2024)
11.1.5 King Yuan ELECTRONICS Recent Developments
11.2 Leadyo IC Testing
11.2.1 Leadyo IC Testing Company Details
11.2.2 Leadyo IC Testing Business Overview
11.2.3 Leadyo IC Testing Chip Assembly and Testing Introduction
11.2.4 Leadyo IC Testing Revenue in Chip Assembly and Testing Business (2019-2024)
11.2.5 Leadyo IC Testing Recent Developments
11.3 Sino Ic Technology
11.3.1 Sino Ic Technology Company Details
11.3.2 Sino Ic Technology Business Overview
11.3.3 Sino Ic Technology Chip Assembly and Testing Introduction
11.3.4 Sino Ic Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.3.5 Sino Ic Technology Recent Developments
11.4 Ardentec Technology
11.4.1 Ardentec Technology Company Details
11.4.2 Ardentec Technology Business Overview
11.4.3 Ardentec Technology Chip Assembly and Testing Introduction
11.4.4 Ardentec Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.4.5 Ardentec Technology Recent Developments
11.5 Teradyne
11.5.1 Teradyne Company Details
11.5.2 Teradyne Business Overview
11.5.3 Teradyne Chip Assembly and Testing Introduction
11.5.4 Teradyne Revenue in Chip Assembly and Testing Business (2019-2024)
11.5.5 Teradyne Recent Developments
11.6 ASE Technology Holding
11.6.1 ASE Technology Holding Company Details
11.6.2 ASE Technology Holding Business Overview
11.6.3 ASE Technology Holding Chip Assembly and Testing Introduction
11.6.4 ASE Technology Holding Revenue in Chip Assembly and Testing Business (2019-2024)
11.6.5 ASE Technology Holding Recent Developments
11.7 Amkor Technology
11.7.1 Amkor Technology Company Details
11.7.2 Amkor Technology Business Overview
11.7.3 Amkor Technology Chip Assembly and Testing Introduction
11.7.4 Amkor Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.7.5 Amkor Technology Recent Developments
11.8 JCET Group
11.8.1 JCET Group Company Details
11.8.2 JCET Group Business Overview
11.8.3 JCET Group Chip Assembly and Testing Introduction
11.8.4 JCET Group Revenue in Chip Assembly and Testing Business (2019-2024)
11.8.5 JCET Group Recent Developments
11.9 Siliconware Precision Industries
11.9.1 Siliconware Precision Industries Company Details
11.9.2 Siliconware Precision Industries Business Overview
11.9.3 Siliconware Precision Industries Chip Assembly and Testing Introduction
11.9.4 Siliconware Precision Industries Revenue in Chip Assembly and Testing Business (2019-2024)
11.9.5 Siliconware Precision Industries Recent Developments
11.10 Powertech Technology
11.10.1 Powertech Technology Company Details
11.10.2 Powertech Technology Business Overview
11.10.3 Powertech Technology Chip Assembly and Testing Introduction
11.10.4 Powertech Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.10.5 Powertech Technology Recent Developments
11.11 Tongfu Microelectronics
11.11.1 Tongfu Microelectronics Company Details
11.11.2 Tongfu Microelectronics Business Overview
11.11.3 Tongfu Microelectronics Chip Assembly and Testing Introduction
11.11.4 Tongfu Microelectronics Revenue in Chip Assembly and Testing Business (2019-2024)
11.11.5 Tongfu Microelectronics Recent Developments
11.12 Tianshui Huatian Technology
11.12.1 Tianshui Huatian Technology Company Details
11.12.2 Tianshui Huatian Technology Business Overview
11.12.3 Tianshui Huatian Technology Chip Assembly and Testing Introduction
11.12.4 Tianshui Huatian Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.12.5 Tianshui Huatian Technology Recent Developments
11.13 ChipMOS TECHNOLOGIES
11.13.1 ChipMOS TECHNOLOGIES Company Details
11.13.2 ChipMOS TECHNOLOGIES Business Overview
11.13.3 ChipMOS TECHNOLOGIES Chip Assembly and Testing Introduction
11.13.4 ChipMOS TECHNOLOGIES Revenue in Chip Assembly and Testing Business (2019-2024)
11.13.5 ChipMOS TECHNOLOGIES Recent Developments
11.14 Chipbond Technology
11.14.1 Chipbond Technology Company Details
11.14.2 Chipbond Technology Business Overview
11.14.3 Chipbond Technology Chip Assembly and Testing Introduction
11.14.4 Chipbond Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.14.5 Chipbond Technology Recent Developments
11.15 Applied Materials
11.15.1 Applied Materials Company Details
11.15.2 Applied Materials Business Overview
11.15.3 Applied Materials Chip Assembly and Testing Introduction
11.15.4 Applied Materials Revenue in Chip Assembly and Testing Business (2019-2024)
11.15.5 Applied Materials Recent Developments
11.16 ASM Pacific Technology
11.16.1 ASM Pacific Technology Company Details
11.16.2 ASM Pacific Technology Business Overview
11.16.3 ASM Pacific Technology Chip Assembly and Testing Introduction
11.16.4 ASM Pacific Technology Revenue in Chip Assembly and Testing Business (2019-2024)
11.16.5 ASM Pacific Technology Recent Developments
11.17 Kulicke & Soffa Industries
11.17.1 Kulicke & Soffa Industries Company Details
11.17.2 Kulicke & Soffa Industries Business Overview
11.17.3 Kulicke & Soffa Industries Chip Assembly and Testing Introduction
11.17.4 Kulicke & Soffa Industries Revenue in Chip Assembly and Testing Business (2019-2024)
11.17.5 Kulicke & Soffa Industries Recent Developments
11.18 TEL
11.18.1 TEL Company Details
11.18.2 TEL Business Overview
11.18.3 TEL Chip Assembly and Testing Introduction
11.18.4 TEL Revenue in Chip Assembly and Testing Business (2019-2024)
11.18.5 TEL Recent Developments
11.19 Tokyo Seimitsu
11.19.1 Tokyo Seimitsu Company Details
11.19.2 Tokyo Seimitsu Business Overview
11.19.3 Tokyo Seimitsu Chip Assembly and Testing Introduction
11.19.4 Tokyo Seimitsu Revenue in Chip Assembly and Testing Business (2019-2024)
11.19.5 Tokyo Seimitsu Recent Developments
11.20 UTAC
11.20.1 UTAC Company Details
11.20.2 UTAC Business Overview
11.20.3 UTAC Chip Assembly and Testing Introduction
11.20.4 UTAC Revenue in Chip Assembly and Testing Business (2019-2024)
11.20.5 UTAC Recent Developments
11.21 Hana Micron
11.21.1 Hana Micron Company Details
11.21.2 Hana Micron Business Overview
11.21.3 Hana Micron Chip Assembly and Testing Introduction
11.21.4 Hana Micron Revenue in Chip Assembly and Testing Business (2019-2024)
11.21.5 Hana Micron Recent Developments
11.22 OSE
11.22.1 OSE Company Details
11.22.2 OSE Business Overview
11.22.3 OSE Chip Assembly and Testing Introduction
11.22.4 OSE Revenue in Chip Assembly and Testing Business (2019-2024)
11.22.5 OSE Recent Developments
11.23 NEPES
11.23.1 NEPES Company Details
11.23.2 NEPES Business Overview
11.23.3 NEPES Chip Assembly and Testing Introduction
11.23.4 NEPES Revenue in Chip Assembly and Testing Business (2019-2024)
11.23.5 NEPES Recent Developments
11.24 Unisem
11.24.1 Unisem Company Details
11.24.2 Unisem Business Overview
11.24.3 Unisem Chip Assembly and Testing Introduction
11.24.4 Unisem Revenue in Chip Assembly and Testing Business (2019-2024)
11.24.5 Unisem Recent Developments
11.25 Signetics
11.25.1 Signetics Company Details
11.25.2 Signetics Business Overview
11.25.3 Signetics Chip Assembly and Testing Introduction
11.25.4 Signetics Revenue in Chip Assembly and Testing Business (2019-2024)
11.25.5 Signetics Recent Developments
11.26 Carsem
11.26.1 Carsem Company Details
11.26.2 Carsem Business Overview
11.26.3 Carsem Chip Assembly and Testing Introduction
11.26.4 Carsem Revenue in Chip Assembly and Testing Business (2019-2024)
11.26.5 Carsem Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
King Yuan ELECTRONICS
Leadyo IC Testing
Sino Ic Technology
Ardentec Technology
Teradyne
ASE Technology Holding
Amkor Technology
JCET Group
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
ChipMOS TECHNOLOGIES
Chipbond Technology
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
UTAC
Hana Micron
OSE
NEPES
Unisem
Signetics
Carsem
听
听
*If Applicable.
