Global Chip On Board (COB) Packaging Technology Market Research Report 2024

Publication ID:

PB508242860

Publication Date:

August 22, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

Chip On Board (COB) packaging technology is a packaging technique used in electronic devices, primarily for integrated circuits (ICs). In COB packaging, the bare semiconductor chip is directly mounted and electrically connected onto a printed circuit board (PCB) or a substrate.
COB technology eliminates the need for a traditional IC package, such as a plastic or ceramic package, by directly bonding the chip to the PCB. The chip is typically wire bonded to the PCB, and then covered with a protective resin or epoxy coating.
The global Chip On Board (COB) Packaging Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Chip On Board (COB) Packaging Technology is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Chip On Board (COB) Packaging Technology is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Chip On Board (COB) Packaging Technology in Lighting is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Chip On Board (COB) Packaging Technology include Cree, Inc., Lumileds, Samsung Electronics Co., Ltd., LG Innotek, OSRAM Opto Semiconductors, Bridgelux, Inc., Everlight Electronics Co., Ltd., Nichia Corporation and Epistar Corporation, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Chip On Board (COB) Packaging Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip On Board (COB) Packaging Technology.
Report Scope
The Chip On Board (COB) Packaging Technology market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip On Board (COB) Packaging Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip On Board (COB) Packaging Technology companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Cree, Inc.
Lumileds
Samsung Electronics Co., Ltd.
LG Innotek
OSRAM Opto Semiconductors
Bridgelux, Inc.
Everlight Electronics Co., Ltd.
Nichia Corporation
Epistar Corporation
Seoul Semiconductor Co., Ltd.
Sharp Corporation
Kingbright Electronic Co., Ltd.
Segment by Type
Traditional COB Packaging Technology
Modular COB Packaging Technology
Others
Segment by Application
Lighting
Electronics
Industrial
Displays
Automotive
Medical and Healthcare
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip On Board (COB) Packaging Technology companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip On Board (COB) Packaging Technology Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Traditional COB Packaging Technology
1.2.3 Modular COB Packaging Technology
1.2.4 Others
1.3 Market by Application
1.3.1 Global Chip On Board (COB) Packaging Technology Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Lighting
1.3.3 Electronics
1.3.4 Industrial
1.3.5 Displays
1.3.6 Automotive
1.3.7 Medical and Healthcare
1.3.8 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip On Board (COB) Packaging Technology Market Perspective (2019-2030)
2.2 Chip On Board (COB) Packaging Technology Growth Trends by Region
2.2.1 Global Chip On Board (COB) Packaging Technology Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip On Board (COB) Packaging Technology Historic Market Size by Region (2019-2024)
2.2.3 Chip On Board (COB) Packaging Technology Forecasted Market Size by Region (2025-2030)
2.3 Chip On Board (COB) Packaging Technology Market Dynamics
2.3.1 Chip On Board (COB) Packaging Technology Industry Trends
2.3.2 Chip On Board (COB) Packaging Technology Market Drivers
2.3.3 Chip On Board (COB) Packaging Technology Market Challenges
2.3.4 Chip On Board (COB) Packaging Technology Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip On Board (COB) Packaging Technology Players by Revenue
3.1.1 Global Top Chip On Board (COB) Packaging Technology Players by Revenue (2019-2024)
3.1.2 Global Chip On Board (COB) Packaging Technology Revenue Market Share by Players (2019-2024)
3.2 Global Chip On Board (COB) Packaging Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip On Board (COB) Packaging Technology Revenue
3.4 Global Chip On Board (COB) Packaging Technology Market Concentration Ratio
3.4.1 Global Chip On Board (COB) Packaging Technology Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip On Board (COB) Packaging Technology Revenue in 2023
3.5 Chip On Board (COB) Packaging Technology Key Players Head office and Area Served
3.6 Key Players Chip On Board (COB) Packaging Technology Product Solution and Service
3.7 Date of Enter into Chip On Board (COB) Packaging Technology Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip On Board (COB) Packaging Technology Breakdown Data by Type
4.1 Global Chip On Board (COB) Packaging Technology Historic Market Size by Type (2019-2024)
4.2 Global Chip On Board (COB) Packaging Technology Forecasted Market Size by Type (2025-2030)
5 Chip On Board (COB) Packaging Technology Breakdown Data by Application
5.1 Global Chip On Board (COB) Packaging Technology Historic Market Size by Application (2019-2024)
5.2 Global Chip On Board (COB) Packaging Technology Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip On Board (COB) Packaging Technology Market Size (2019-2030)
6.2 North America Chip On Board (COB) Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip On Board (COB) Packaging Technology Market Size by Country (2019-2024)
6.4 North America Chip On Board (COB) Packaging Technology Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip On Board (COB) Packaging Technology Market Size (2019-2030)
7.2 Europe Chip On Board (COB) Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip On Board (COB) Packaging Technology Market Size by Country (2019-2024)
7.4 Europe Chip On Board (COB) Packaging Technology Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip On Board (COB) Packaging Technology Market Size (2019-2030)
8.2 Asia-Pacific Chip On Board (COB) Packaging Technology Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip On Board (COB) Packaging Technology Market Size by Region (2019-2024)
8.4 Asia-Pacific Chip On Board (COB) Packaging Technology Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip On Board (COB) Packaging Technology Market Size (2019-2030)
9.2 Latin America Chip On Board (COB) Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip On Board (COB) Packaging Technology Market Size by Country (2019-2024)
9.4 Latin America Chip On Board (COB) Packaging Technology Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip On Board (COB) Packaging Technology Market Size (2019-2030)
10.2 Middle East & Africa Chip On Board (COB) Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip On Board (COB) Packaging Technology Market Size by Country (2019-2024)
10.4 Middle East & Africa Chip On Board (COB) Packaging Technology Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Cree, Inc.
11.1.1 Cree, Inc. Company Detail
11.1.2 Cree, Inc. Business Overview
11.1.3 Cree, Inc. Chip On Board (COB) Packaging Technology Introduction
11.1.4 Cree, Inc. Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.1.5 Cree, Inc. Recent Development
11.2 Lumileds
11.2.1 Lumileds Company Detail
11.2.2 Lumileds Business Overview
11.2.3 Lumileds Chip On Board (COB) Packaging Technology Introduction
11.2.4 Lumileds Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.2.5 Lumileds Recent Development
11.3 Samsung Electronics Co., Ltd.
11.3.1 Samsung Electronics Co., Ltd. Company Detail
11.3.2 Samsung Electronics Co., Ltd. Business Overview
11.3.3 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Introduction
11.3.4 Samsung Electronics Co., Ltd. Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.3.5 Samsung Electronics Co., Ltd. Recent Development
11.4 LG Innotek
11.4.1 LG Innotek Company Detail
11.4.2 LG Innotek Business Overview
11.4.3 LG Innotek Chip On Board (COB) Packaging Technology Introduction
11.4.4 LG Innotek Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.4.5 LG Innotek Recent Development
11.5 OSRAM Opto Semiconductors
11.5.1 OSRAM Opto Semiconductors Company Detail
11.5.2 OSRAM Opto Semiconductors Business Overview
11.5.3 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Introduction
11.5.4 OSRAM Opto Semiconductors Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.5.5 OSRAM Opto Semiconductors Recent Development
11.6 Bridgelux, Inc.
11.6.1 Bridgelux, Inc. Company Detail
11.6.2 Bridgelux, Inc. Business Overview
11.6.3 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Introduction
11.6.4 Bridgelux, Inc. Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.6.5 Bridgelux, Inc. Recent Development
11.7 Everlight Electronics Co., Ltd.
11.7.1 Everlight Electronics Co., Ltd. Company Detail
11.7.2 Everlight Electronics Co., Ltd. Business Overview
11.7.3 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Introduction
11.7.4 Everlight Electronics Co., Ltd. Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.7.5 Everlight Electronics Co., Ltd. Recent Development
11.8 Nichia Corporation
11.8.1 Nichia Corporation Company Detail
11.8.2 Nichia Corporation Business Overview
11.8.3 Nichia Corporation Chip On Board (COB) Packaging Technology Introduction
11.8.4 Nichia Corporation Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.8.5 Nichia Corporation Recent Development
11.9 Epistar Corporation
11.9.1 Epistar Corporation Company Detail
11.9.2 Epistar Corporation Business Overview
11.9.3 Epistar Corporation Chip On Board (COB) Packaging Technology Introduction
11.9.4 Epistar Corporation Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.9.5 Epistar Corporation Recent Development
11.10 Seoul Semiconductor Co., Ltd.
11.10.1 Seoul Semiconductor Co., Ltd. Company Detail
11.10.2 Seoul Semiconductor Co., Ltd. Business Overview
11.10.3 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Introduction
11.10.4 Seoul Semiconductor Co., Ltd. Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.10.5 Seoul Semiconductor Co., Ltd. Recent Development
11.11 Sharp Corporation
11.11.1 Sharp Corporation Company Detail
11.11.2 Sharp Corporation Business Overview
11.11.3 Sharp Corporation Chip On Board (COB) Packaging Technology Introduction
11.11.4 Sharp Corporation Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.11.5 Sharp Corporation Recent Development
11.12 Kingbright Electronic Co., Ltd.
11.12.1 Kingbright Electronic Co., Ltd. Company Detail
11.12.2 Kingbright Electronic Co., Ltd. Business Overview
11.12.3 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Introduction
11.12.4 Kingbright Electronic Co., Ltd. Revenue in Chip On Board (COB) Packaging Technology Business (2019-2024)
11.12.5 Kingbright Electronic Co., Ltd. Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Cree, Inc.
Lumileds
Samsung Electronics Co., Ltd.
LG Innotek
OSRAM Opto Semiconductors
Bridgelux, Inc.
Everlight Electronics Co., Ltd.
Nichia Corporation
Epistar Corporation
Seoul Semiconductor Co., Ltd.
Sharp Corporation
Kingbright Electronic Co., Ltd.

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