Global Chip Encapsulation Material Market Insights, Forecast to 2030

Publication ID:

PB508247761

Publication Date:

August 5, 2024

Pages:

110

Publisher:

MRRPB5

Countries:

Global [1]

USD 4,900.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

Market Analysis and Insights: Global Chip Encapsulation Material Market
The global Chip Encapsulation Material market is projected to grow from US$ 25810 million in 2024 to US$ 34470 million by 2030, at a Compound Annual Growth Rate (CAGR) of 4.9% during the forecast period.
Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.
Report Covers:
This report presents an overview of global market for Chip Encapsulation Material market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Chip Encapsulation Material, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Chip Encapsulation Material, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Chip Encapsulation Material revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Chip Encapsulation Material market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Chip Encapsulation Material revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Segment by Type
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Segment by Application
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Chip Encapsulation Material in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Encapsulation Material companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Chip Encapsulation Material revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Encapsulation Material Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Substrates
1.2.3 Lead Frame
1.2.4 Bonding Wires
1.2.5 Encapsulating Resin
1.2.6 Others
1.3 Market by Application
1.3.1 Global Chip Encapsulation Material Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automotive Electronics
1.3.4 IT and Communication Industry
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Encapsulation Material Market Perspective (2019-2030)
2.2 Global Chip Encapsulation Material Growth Trends by Region
2.2.1 Chip Encapsulation Material Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Encapsulation Material Historic Market Size by Region (2019-2024)
2.2.3 Chip Encapsulation Material Forecasted Market Size by Region (2025-2030)
2.3 Chip Encapsulation Material Market Dynamics
2.3.1 Chip Encapsulation Material Industry Trends
2.3.2 Chip Encapsulation Material Market Drivers
2.3.3 Chip Encapsulation Material Market Challenges
2.3.4 Chip Encapsulation Material Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Chip Encapsulation Material by Players
3.1.1 Global Chip Encapsulation Material Revenue by Players (2019-2024)
3.1.2 Global Chip Encapsulation Material Revenue Market Share by Players (2019-2024)
3.2 Global Chip Encapsulation Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Chip Encapsulation Material, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Chip Encapsulation Material Market Concentration Ratio
3.4.1 Global Chip Encapsulation Material Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Encapsulation Material Revenue in 2023
3.5 Global Key Players of Chip Encapsulation Material Head office and Area Served
3.6 Global Key Players of Chip Encapsulation Material, Product and Application
3.7 Global Key Players of Chip Encapsulation Material, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Encapsulation Material Breakdown Data by Type
4.1 Global Chip Encapsulation Material Historic Market Size by Type (2019-2024)
4.2 Global Chip Encapsulation Material Forecasted Market Size by Type (2025-2030)
5 Chip Encapsulation Material Breakdown Data by Application
5.1 Global Chip Encapsulation Material Historic Market Size by Application (2019-2024)
5.2 Global Chip Encapsulation Material Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Encapsulation Material Market Size (2019-2030)
6.2 North America Chip Encapsulation Material Market Size by Type
6.2.1 North America Chip Encapsulation Material Market Size by Type (2019-2024)
6.2.2 North America Chip Encapsulation Material Market Size by Type (2025-2030)
6.2.3 North America Chip Encapsulation Material Market Share by Type (2019-2030)
6.3 North America Chip Encapsulation Material Market Size by Application
6.3.1 North America Chip Encapsulation Material Market Size by Application (2019-2024)
6.3.2 North America Chip Encapsulation Material Market Size by Application (2025-2030)
6.3.3 North America Chip Encapsulation Material Market Share by Application (2019-2030)
6.4 North America Chip Encapsulation Material Market Size by Country
6.4.1 North America Chip Encapsulation Material Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Chip Encapsulation Material Market Size by Country (2019-2024)
6.4.3 North America Chip Encapsulation Material Market Size by Country (2025-2030)
6.4.4 United States
6.4.5 Canada
7 Europe
7.1 Europe Chip Encapsulation Material Market Size (2019-2030)
7.2 Europe Chip Encapsulation Material Market Size by Type
7.2.1 Europe Chip Encapsulation Material Market Size by Type (2019-2024)
7.2.2 Europe Chip Encapsulation Material Market Size by Type (2025-2030)
7.2.3 Europe Chip Encapsulation Material Market Share by Type (2019-2030)
7.3 Europe Chip Encapsulation Material Market Size by Application
7.3.1 Europe Chip Encapsulation Material Market Size by Application (2019-2024)
7.3.2 Europe Chip Encapsulation Material Market Size by Application (2025-2030)
7.3.3 Europe Chip Encapsulation Material Market Share by Application (2019-2030)
7.4 Europe Chip Encapsulation Material Market Size by Country
7.4.1 Europe Chip Encapsulation Material Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Chip Encapsulation Material Market Size by Country (2019-2024)
7.4.3 Europe Chip Encapsulation Material Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Chip Encapsulation Material Market Size (2019-2030)
8.2 China Chip Encapsulation Material Market Size by Type
8.2.1 China Chip Encapsulation Material Market Size by Type (2019-2024)
8.2.2 China Chip Encapsulation Material Market Size by Type (2025-2030)
8.2.3 China Chip Encapsulation Material Market Share by Type (2019-2030)
8.3 China Chip Encapsulation Material Market Size by Application
8.3.1 China Chip Encapsulation Material Market Size by Application (2019-2024)
8.3.2 China Chip Encapsulation Material Market Size by Application (2025-2030)
8.3.3 China Chip Encapsulation Material Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Chip Encapsulation Material Market Size (2019-2030)
9.2 Asia Chip Encapsulation Material Market Size by Type
9.2.1 Asia Chip Encapsulation Material Market Size by Type (2019-2024)
9.2.2 Asia Chip Encapsulation Material Market Size by Type (2025-2030)
9.2.3 Asia Chip Encapsulation Material Market Share by Type (2019-2030)
9.3 Asia Chip Encapsulation Material Market Size by Application
9.3.1 Asia Chip Encapsulation Material Market Size by Application (2019-2024)
9.3.2 Asia Chip Encapsulation Material Market Size by Application (2025-2030)
9.3.3 Asia Chip Encapsulation Material Market Share by Application (2019-2030)
9.4 Asia Chip Encapsulation Material Market Size by Region
9.4.1 Asia Chip Encapsulation Material Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Chip Encapsulation Material Market Size by Region (2019-2024)
9.4.3 Asia Chip Encapsulation Material Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Type
10.2.1 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Chip Encapsulation Material Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Application
10.3.1 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Chip Encapsulation Material Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Country
10.4.1 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Chip Encapsulation Material Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Shennan Circuit Company Limited
11.1.1 Shennan Circuit Company Limited Company Details
11.1.2 Shennan Circuit Company Limited Business Overview
11.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Introduction
11.1.4 Shennan Circuit Company Limited Revenue in Chip Encapsulation Material Business (2019-2024)
11.1.5 Shennan Circuit Company Limited Recent Developments
11.2 Xingsen Technology
11.2.1 Xingsen Technology Company Details
11.2.2 Xingsen Technology Business Overview
11.2.3 Xingsen Technology Chip Encapsulation Material Introduction
11.2.4 Xingsen Technology Revenue in Chip Encapsulation Material Business (2019-2024)
11.2.5 Xingsen Technology Recent Developments
11.3 Kangqiang Electronics
11.3.1 Kangqiang Electronics Company Details
11.3.2 Kangqiang Electronics Business Overview
11.3.3 Kangqiang Electronics Chip Encapsulation Material Introduction
11.3.4 Kangqiang Electronics Revenue in Chip Encapsulation Material Business (2019-2024)
11.3.5 Kangqiang Electronics Recent Developments
11.4 Kyocera
11.4.1 Kyocera Company Details
11.4.2 Kyocera Business Overview
11.4.3 Kyocera Chip Encapsulation Material Introduction
11.4.4 Kyocera Revenue in Chip Encapsulation Material Business (2019-2024)
11.4.5 Kyocera Recent Developments
11.5 Mitsui High-tec, Inc.
11.5.1 Mitsui High-tec, Inc. Company Details
11.5.2 Mitsui High-tec, Inc. Business Overview
11.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Introduction
11.5.4 Mitsui High-tec, Inc. Revenue in Chip Encapsulation Material Business (2019-2024)
11.5.5 Mitsui High-tec, Inc. Recent Developments
11.6 Chang Wah Technology
11.6.1 Chang Wah Technology Company Details
11.6.2 Chang Wah Technology Business Overview
11.6.3 Chang Wah Technology Chip Encapsulation Material Introduction
11.6.4 Chang Wah Technology Revenue in Chip Encapsulation Material Business (2019-2024)
11.6.5 Chang Wah Technology Recent Developments
11.7 Panasonic
11.7.1 Panasonic Company Details
11.7.2 Panasonic Business Overview
11.7.3 Panasonic Chip Encapsulation Material Introduction
11.7.4 Panasonic Revenue in Chip Encapsulation Material Business (2019-2024)
11.7.5 Panasonic Recent Developments
11.8 Henkel
11.8.1 Henkel Company Details
11.8.2 Henkel Business Overview
11.8.3 Henkel Chip Encapsulation Material Introduction
11.8.4 Henkel Revenue in Chip Encapsulation Material Business (2019-2024)
11.8.5 Henkel Recent Developments
11.9 Sumitomo Bakelite
11.9.1 Sumitomo Bakelite Company Details
11.9.2 Sumitomo Bakelite Business Overview
11.9.3 Sumitomo Bakelite Chip Encapsulation Material Introduction
11.9.4 Sumitomo Bakelite Revenue in Chip Encapsulation Material Business (2019-2024)
11.9.5 Sumitomo Bakelite Recent Developments
11.10 Heraeus
11.10.1 Heraeus Company Details
11.10.2 Heraeus Business Overview
11.10.3 Heraeus Chip Encapsulation Material Introduction
11.10.4 Heraeus Revenue in Chip Encapsulation Material Business (2019-2024)
11.10.5 Heraeus Recent Developments
11.11 Tanaka
11.11.1 Tanaka Company Details
11.11.2 Tanaka Business Overview
11.11.3 Tanaka Chip Encapsulation Material Introduction
11.11.4 Tanaka Revenue in Chip Encapsulation Material Business (2019-2024)
11.11.5 Tanaka Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka

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