Underfill is a material suitable for flip-chip circuits. It fills the gap between the IC chip and the organic substrate, and seals and protects the connection solder joints, reducing the thermal expansion coefficient mismatch between the silicon chip and the organic substrate. , protects the device from moisture, ionic contaminants, radiation, and harmful operating environments such as mechanical stretching, shearing, twisting, vibration, etc.
The global Chip Level Underfill market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Chip Level Underfill is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Chip Level Underfill is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Chip Level Underfill include LORD, Henkel, United Adhesives, Namics, Hitachi Chemical, WON CHEMICAL, SUNSTAR, Zymet and Shin-Etsu Chemical, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Chip Level Underfill, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Level Underfill.
The Chip Level Underfill market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Chip Level Underfill market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Level Underfill manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
LORD
Henkel
United Adhesives
Namics
Hitachi Chemical
WON CHEMICAL
SUNSTAR
Zymet
Shin-Etsu Chemical
FUJI
Master Bond
Darbond Technology
Dongguan Tiannuo New Material Technology
Hanstars
Segment by Type
Fluid Filler
Non Flowing Filler
Segment by Application
Consumer Electronics
Vehicle Electronics
Internet of Things
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Chip Level Underfill manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Chip Level Underfill by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Chip Level Underfill in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Chip Level Underfill Market Overview
1.1 Product Definition
1.2 Chip Level Underfill Segment by Type
1.2.1 Global Chip Level Underfill Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Fluid Filler
1.2.3 Non Flowing Filler
1.3 Chip Level Underfill Segment by Application
1.3.1 Global Chip Level Underfill Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Vehicle Electronics
1.3.4 Internet of Things
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Chip Level Underfill Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Chip Level Underfill Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Chip Level Underfill Production Estimates and Forecasts (2018-2029)
1.4.4 Global Chip Level Underfill Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Chip Level Underfill Production Market Share by Manufacturers (2018-2023)
2.2 Global Chip Level Underfill Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Chip Level Underfill, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Chip Level Underfill Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Chip Level Underfill Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Chip Level Underfill, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Chip Level Underfill, Product Offered and Application
2.8 Global Key Manufacturers of Chip Level Underfill, Date of Enter into This Industry
2.9 Chip Level Underfill Market Competitive Situation and Trends
2.9.1 Chip Level Underfill Market Concentration Rate
2.9.2 Global 5 and 10 Largest Chip Level Underfill Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Chip Level Underfill Production by Region
3.1 Global Chip Level Underfill Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Chip Level Underfill Production Value by Region (2018-2029)
3.2.1 Global Chip Level Underfill Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Chip Level Underfill by Region (2024-2029)
3.3 Global Chip Level Underfill Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Chip Level Underfill Production by Region (2018-2029)
3.4.1 Global Chip Level Underfill Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Chip Level Underfill by Region (2024-2029)
3.5 Global Chip Level Underfill Market Price Analysis by Region (2018-2023)
3.6 Global Chip Level Underfill Production and Value, Year-over-Year Growth
3.6.1 North America Chip Level Underfill Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Chip Level Underfill Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Chip Level Underfill Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Chip Level Underfill Production Value Estimates and Forecasts (2018-2029)
4 Chip Level Underfill Consumption by Region
4.1 Global Chip Level Underfill Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Chip Level Underfill Consumption by Region (2018-2029)
4.2.1 Global Chip Level Underfill Consumption by Region (2018-2023)
4.2.2 Global Chip Level Underfill Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Chip Level Underfill Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Chip Level Underfill Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Chip Level Underfill Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Chip Level Underfill Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Chip Level Underfill Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Chip Level Underfill Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Chip Level Underfill Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Chip Level Underfill Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Chip Level Underfill Production by Type (2018-2029)
5.1.1 Global Chip Level Underfill Production by Type (2018-2023)
5.1.2 Global Chip Level Underfill Production by Type (2024-2029)
5.1.3 Global Chip Level Underfill Production Market Share by Type (2018-2029)
5.2 Global Chip Level Underfill Production Value by Type (2018-2029)
5.2.1 Global Chip Level Underfill Production Value by Type (2018-2023)
5.2.2 Global Chip Level Underfill Production Value by Type (2024-2029)
5.2.3 Global Chip Level Underfill Production Value Market Share by Type (2018-2029)
5.3 Global Chip Level Underfill Price by Type (2018-2029)
6 Segment by Application
6.1 Global Chip Level Underfill Production by Application (2018-2029)
6.1.1 Global Chip Level Underfill Production by Application (2018-2023)
6.1.2 Global Chip Level Underfill Production by Application (2024-2029)
6.1.3 Global Chip Level Underfill Production Market Share by Application (2018-2029)
6.2 Global Chip Level Underfill Production Value by Application (2018-2029)
6.2.1 Global Chip Level Underfill Production Value by Application (2018-2023)
6.2.2 Global Chip Level Underfill Production Value by Application (2024-2029)
6.2.3 Global Chip Level Underfill Production Value Market Share by Application (2018-2029)
6.3 Global Chip Level Underfill Price by Application (2018-2029)
7 Key Companies Profiled
7.1 LORD
7.1.1 LORD Chip Level Underfill Corporation Information
7.1.2 LORD Chip Level Underfill Product Portfolio
7.1.3 LORD Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.1.4 LORD Main Business and Markets Served
7.1.5 LORD Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Chip Level Underfill Corporation Information
7.2.2 Henkel Chip Level Underfill Product Portfolio
7.2.3 Henkel Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Henkel Main Business and Markets Served
7.2.5 Henkel Recent Developments/Updates
7.3 United Adhesives
7.3.1 United Adhesives Chip Level Underfill Corporation Information
7.3.2 United Adhesives Chip Level Underfill Product Portfolio
7.3.3 United Adhesives Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.3.4 United Adhesives Main Business and Markets Served
7.3.5 United Adhesives Recent Developments/Updates
7.4 Namics
7.4.1 Namics Chip Level Underfill Corporation Information
7.4.2 Namics Chip Level Underfill Product Portfolio
7.4.3 Namics Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Namics Main Business and Markets Served
7.4.5 Namics Recent Developments/Updates
7.5 Hitachi Chemical
7.5.1 Hitachi Chemical Chip Level Underfill Corporation Information
7.5.2 Hitachi Chemical Chip Level Underfill Product Portfolio
7.5.3 Hitachi Chemical Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Hitachi Chemical Main Business and Markets Served
7.5.5 Hitachi Chemical Recent Developments/Updates
7.6 WON CHEMICAL
7.6.1 WON CHEMICAL Chip Level Underfill Corporation Information
7.6.2 WON CHEMICAL Chip Level Underfill Product Portfolio
7.6.3 WON CHEMICAL Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.6.4 WON CHEMICAL Main Business and Markets Served
7.6.5 WON CHEMICAL Recent Developments/Updates
7.7 SUNSTAR
7.7.1 SUNSTAR Chip Level Underfill Corporation Information
7.7.2 SUNSTAR Chip Level Underfill Product Portfolio
7.7.3 SUNSTAR Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.7.4 SUNSTAR Main Business and Markets Served
7.7.5 SUNSTAR Recent Developments/Updates
7.8 Zymet
7.8.1 Zymet Chip Level Underfill Corporation Information
7.8.2 Zymet Chip Level Underfill Product Portfolio
7.8.3 Zymet Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Zymet Main Business and Markets Served
7.7.5 Zymet Recent Developments/Updates
7.9 Shin-Etsu Chemical
7.9.1 Shin-Etsu Chemical Chip Level Underfill Corporation Information
7.9.2 Shin-Etsu Chemical Chip Level Underfill Product Portfolio
7.9.3 Shin-Etsu Chemical Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Shin-Etsu Chemical Main Business and Markets Served
7.9.5 Shin-Etsu Chemical Recent Developments/Updates
7.10 FUJI
7.10.1 FUJI Chip Level Underfill Corporation Information
7.10.2 FUJI Chip Level Underfill Product Portfolio
7.10.3 FUJI Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.10.4 FUJI Main Business and Markets Served
7.10.5 FUJI Recent Developments/Updates
7.11 Master Bond
7.11.1 Master Bond Chip Level Underfill Corporation Information
7.11.2 Master Bond Chip Level Underfill Product Portfolio
7.11.3 Master Bond Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Master Bond Main Business and Markets Served
7.11.5 Master Bond Recent Developments/Updates
7.12 Darbond Technology
7.12.1 Darbond Technology Chip Level Underfill Corporation Information
7.12.2 Darbond Technology Chip Level Underfill Product Portfolio
7.12.3 Darbond Technology Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Darbond Technology Main Business and Markets Served
7.12.5 Darbond Technology Recent Developments/Updates
7.13 Dongguan Tiannuo New Material Technology
7.13.1 Dongguan Tiannuo New Material Technology Chip Level Underfill Corporation Information
7.13.2 Dongguan Tiannuo New Material Technology Chip Level Underfill Product Portfolio
7.13.3 Dongguan Tiannuo New Material Technology Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Dongguan Tiannuo New Material Technology Main Business and Markets Served
7.13.5 Dongguan Tiannuo New Material Technology Recent Developments/Updates
7.14 Hanstars
7.14.1 Hanstars Chip Level Underfill Corporation Information
7.14.2 Hanstars Chip Level Underfill Product Portfolio
7.14.3 Hanstars Chip Level Underfill Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Hanstars Main Business and Markets Served
7.14.5 Hanstars Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Chip Level Underfill Industry Chain Analysis
8.2 Chip Level Underfill Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Chip Level Underfill Production Mode & Process
8.4 Chip Level Underfill Sales and Marketing
8.4.1 Chip Level Underfill Sales Channels
8.4.2 Chip Level Underfill Distributors
8.5 Chip Level Underfill Customers
9 Chip Level Underfill Market Dynamics
9.1 Chip Level Underfill Industry Trends
9.2 Chip Level Underfill Market Drivers
9.3 Chip Level Underfill Market Challenges
9.4 Chip Level Underfill Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
LORD
Henkel
United Adhesives
Namics
Hitachi Chemical
WON CHEMICAL
SUNSTAR
Zymet
Shin-Etsu Chemical
FUJI
Master Bond
Darbond Technology
Dongguan Tiannuo New Material Technology
Hanstars
听
听
*If Applicable.
