The global market for Chip Package Test Probes was valued at US$ 662 million in the year 2024 and is projected to reach a revised size of US$ 1029 million by 2031, growing at a CAGR of 6.6% during the forecast period.
Probes range from 0.30mm-2.00mm test pitches which apply on Memory Test, Logic Test, High-Frequency Test, LCD Test.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Chip Package Test Probes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Package Test Probes.
The Chip Package Test Probes market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Chip Package Test Probes market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Package Test Probes manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
LEENO
Cohu
QA Technology
Smiths Interconnect
Yokowo Co., Ltd.
INGUN
Feinmetall
Qualmax
PTR HARTMANN (Phoenix Mecano)
Seiken Co., Ltd.
TESPRO
AIKOSHA
CCP Contact Probes
Da-Chung
UIGreen
Centalic
WoodKing Intelligent Technology
Lanyi Electronic
Merryprobe Electronic
Tough Tech
Hua Rong
by Type
Elastic Probes
Cantilever Probes
Vertical Probes
Others
by Application
Chip Design Factory
IDM Enterprises
Wafer Foundry
Packaging and Testing Plant
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Chip Package Test Probes manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Chip Package Test Probes by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Chip Package Test Probes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Chip Package Test Probes Market Overview
1.1 Product Definition
1.2 Chip Package Test Probes by Type
1.2.1 Global Chip Package Test Probes Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Elastic Probes
1.2.3 Cantilever Probes
1.2.4 Vertical Probes
1.2.5 Others
1.3 Chip Package Test Probes by Application
1.3.1 Global Chip Package Test Probes Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Chip Design Factory
1.3.3 IDM Enterprises
1.3.4 Wafer Foundry
1.3.5 Packaging and Testing Plant
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Chip Package Test Probes Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Chip Package Test Probes Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Chip Package Test Probes Production Estimates and Forecasts (2020-2031)
1.4.4 Global Chip Package Test Probes Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Chip Package Test Probes Production Market Share by Manufacturers (2020-2025)
2.2 Global Chip Package Test Probes Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Chip Package Test Probes, Industry Ranking, 2023 VS 2024
2.4 Global Chip Package Test Probes Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Chip Package Test Probes Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Chip Package Test Probes, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Chip Package Test Probes, Product Offered and Application
2.8 Global Key Manufacturers of Chip Package Test Probes, Date of Enter into This Industry
2.9 Chip Package Test Probes Market Competitive Situation and Trends
2.9.1 Chip Package Test Probes Market Concentration Rate
2.9.2 Global 5 and 10 Largest Chip Package Test Probes Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Chip Package Test Probes Production by Region
3.1 Global Chip Package Test Probes Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Chip Package Test Probes Production Value by Region (2020-2031)
3.2.1 Global Chip Package Test Probes Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Chip Package Test Probes by Region (2026-2031)
3.3 Global Chip Package Test Probes Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Chip Package Test Probes Production Volume by Region (2020-2031)
3.4.1 Global Chip Package Test Probes Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Chip Package Test Probes by Region (2026-2031)
3.5 Global Chip Package Test Probes Market Price Analysis by Region (2020-2025)
3.6 Global Chip Package Test Probes Production and Value, Year-over-Year Growth
3.6.1 North America Chip Package Test Probes Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Chip Package Test Probes Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Chip Package Test Probes Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Chip Package Test Probes Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Chip Package Test Probes Production Value Estimates and Forecasts (2020-2031)
4 Chip Package Test Probes Consumption by Region
4.1 Global Chip Package Test Probes Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Chip Package Test Probes Consumption by Region (2020-2031)
4.2.1 Global Chip Package Test Probes Consumption by Region (2020-2025)
4.2.2 Global Chip Package Test Probes Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Chip Package Test Probes Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Chip Package Test Probes Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Chip Package Test Probes Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Chip Package Test Probes Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Chip Package Test Probes Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Chip Package Test Probes Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Chip Package Test Probes Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Chip Package Test Probes Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Chip Package Test Probes Production by Type (2020-2031)
5.1.1 Global Chip Package Test Probes Production by Type (2020-2025)
5.1.2 Global Chip Package Test Probes Production by Type (2026-2031)
5.1.3 Global Chip Package Test Probes Production Market Share by Type (2020-2031)
5.2 Global Chip Package Test Probes Production Value by Type (2020-2031)
5.2.1 Global Chip Package Test Probes Production Value by Type (2020-2025)
5.2.2 Global Chip Package Test Probes Production Value by Type (2026-2031)
5.2.3 Global Chip Package Test Probes Production Value Market Share by Type (2020-2031)
5.3 Global Chip Package Test Probes Price by Type (2020-2031)
6 Segment by Application
6.1 Global Chip Package Test Probes Production by Application (2020-2031)
6.1.1 Global Chip Package Test Probes Production by Application (2020-2025)
6.1.2 Global Chip Package Test Probes Production by Application (2026-2031)
6.1.3 Global Chip Package Test Probes Production Market Share by Application (2020-2031)
6.2 Global Chip Package Test Probes Production Value by Application (2020-2031)
6.2.1 Global Chip Package Test Probes Production Value by Application (2020-2025)
6.2.2 Global Chip Package Test Probes Production Value by Application (2026-2031)
6.2.3 Global Chip Package Test Probes Production Value Market Share by Application (2020-2031)
6.3 Global Chip Package Test Probes Price by Application (2020-2031)
7 Key Companies Profiled
7.1 LEENO
7.1.1 LEENO Chip Package Test Probes Company Information
7.1.2 LEENO Chip Package Test Probes Product Portfolio
7.1.3 LEENO Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.1.4 LEENO Main Business and Markets Served
7.1.5 LEENO Recent Developments/Updates
7.2 Cohu
7.2.1 Cohu Chip Package Test Probes Company Information
7.2.2 Cohu Chip Package Test Probes Product Portfolio
7.2.3 Cohu Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Cohu Main Business and Markets Served
7.2.5 Cohu Recent Developments/Updates
7.3 QA Technology
7.3.1 QA Technology Chip Package Test Probes Company Information
7.3.2 QA Technology Chip Package Test Probes Product Portfolio
7.3.3 QA Technology Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.3.4 QA Technology Main Business and Markets Served
7.3.5 QA Technology Recent Developments/Updates
7.4 Smiths Interconnect
7.4.1 Smiths Interconnect Chip Package Test Probes Company Information
7.4.2 Smiths Interconnect Chip Package Test Probes Product Portfolio
7.4.3 Smiths Interconnect Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Smiths Interconnect Main Business and Markets Served
7.4.5 Smiths Interconnect Recent Developments/Updates
7.5 Yokowo Co., Ltd.
7.5.1 Yokowo Co., Ltd. Chip Package Test Probes Company Information
7.5.2 Yokowo Co., Ltd. Chip Package Test Probes Product Portfolio
7.5.3 Yokowo Co., Ltd. Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Yokowo Co., Ltd. Main Business and Markets Served
7.5.5 Yokowo Co., Ltd. Recent Developments/Updates
7.6 INGUN
7.6.1 INGUN Chip Package Test Probes Company Information
7.6.2 INGUN Chip Package Test Probes Product Portfolio
7.6.3 INGUN Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.6.4 INGUN Main Business and Markets Served
7.6.5 INGUN Recent Developments/Updates
7.7 Feinmetall
7.7.1 Feinmetall Chip Package Test Probes Company Information
7.7.2 Feinmetall Chip Package Test Probes Product Portfolio
7.7.3 Feinmetall Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Feinmetall Main Business and Markets Served
7.7.5 Feinmetall Recent Developments/Updates
7.8 Qualmax
7.8.1 Qualmax Chip Package Test Probes Company Information
7.8.2 Qualmax Chip Package Test Probes Product Portfolio
7.8.3 Qualmax Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Qualmax Main Business and Markets Served
7.8.5 Qualmax Recent Developments/Updates
7.9 PTR HARTMANN (Phoenix Mecano)
7.9.1 PTR HARTMANN (Phoenix Mecano) Chip Package Test Probes Company Information
7.9.2 PTR HARTMANN (Phoenix Mecano) Chip Package Test Probes Product Portfolio
7.9.3 PTR HARTMANN (Phoenix Mecano) Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.9.4 PTR HARTMANN (Phoenix Mecano) Main Business and Markets Served
7.9.5 PTR HARTMANN (Phoenix Mecano) Recent Developments/Updates
7.10 Seiken Co., Ltd.
7.10.1 Seiken Co., Ltd. Chip Package Test Probes Company Information
7.10.2 Seiken Co., Ltd. Chip Package Test Probes Product Portfolio
7.10.3 Seiken Co., Ltd. Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Seiken Co., Ltd. Main Business and Markets Served
7.10.5 Seiken Co., Ltd. Recent Developments/Updates
7.11 TESPRO
7.11.1 TESPRO Chip Package Test Probes Company Information
7.11.2 TESPRO Chip Package Test Probes Product Portfolio
7.11.3 TESPRO Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.11.4 TESPRO Main Business and Markets Served
7.11.5 TESPRO Recent Developments/Updates
7.12 AIKOSHA
7.12.1 AIKOSHA Chip Package Test Probes Company Information
7.12.2 AIKOSHA Chip Package Test Probes Product Portfolio
7.12.3 AIKOSHA Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.12.4 AIKOSHA Main Business and Markets Served
7.12.5 AIKOSHA Recent Developments/Updates
7.13 CCP Contact Probes
7.13.1 CCP Contact Probes Chip Package Test Probes Company Information
7.13.2 CCP Contact Probes Chip Package Test Probes Product Portfolio
7.13.3 CCP Contact Probes Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.13.4 CCP Contact Probes Main Business and Markets Served
7.13.5 CCP Contact Probes Recent Developments/Updates
7.14 Da-Chung
7.14.1 Da-Chung Chip Package Test Probes Company Information
7.14.2 Da-Chung Chip Package Test Probes Product Portfolio
7.14.3 Da-Chung Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Da-Chung Main Business and Markets Served
7.14.5 Da-Chung Recent Developments/Updates
7.15 UIGreen
7.15.1 UIGreen Chip Package Test Probes Company Information
7.15.2 UIGreen Chip Package Test Probes Product Portfolio
7.15.3 UIGreen Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.15.4 UIGreen Main Business and Markets Served
7.15.5 UIGreen Recent Developments/Updates
7.16 Centalic
7.16.1 Centalic Chip Package Test Probes Company Information
7.16.2 Centalic Chip Package Test Probes Product Portfolio
7.16.3 Centalic Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Centalic Main Business and Markets Served
7.16.5 Centalic Recent Developments/Updates
7.17 WoodKing Intelligent Technology
7.17.1 WoodKing Intelligent Technology Chip Package Test Probes Company Information
7.17.2 WoodKing Intelligent Technology Chip Package Test Probes Product Portfolio
7.17.3 WoodKing Intelligent Technology Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.17.4 WoodKing Intelligent Technology Main Business and Markets Served
7.17.5 WoodKing Intelligent Technology Recent Developments/Updates
7.18 Lanyi Electronic
7.18.1 Lanyi Electronic Chip Package Test Probes Company Information
7.18.2 Lanyi Electronic Chip Package Test Probes Product Portfolio
7.18.3 Lanyi Electronic Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Lanyi Electronic Main Business and Markets Served
7.18.5 Lanyi Electronic Recent Developments/Updates
7.19 Merryprobe Electronic
7.19.1 Merryprobe Electronic Chip Package Test Probes Company Information
7.19.2 Merryprobe Electronic Chip Package Test Probes Product Portfolio
7.19.3 Merryprobe Electronic Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Merryprobe Electronic Main Business and Markets Served
7.19.5 Merryprobe Electronic Recent Developments/Updates
7.20 Tough Tech
7.20.1 Tough Tech Chip Package Test Probes Company Information
7.20.2 Tough Tech Chip Package Test Probes Product Portfolio
7.20.3 Tough Tech Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.20.4 Tough Tech Main Business and Markets Served
7.20.5 Tough Tech Recent Developments/Updates
7.21 Hua Rong
7.21.1 Hua Rong Chip Package Test Probes Company Information
7.21.2 Hua Rong Chip Package Test Probes Product Portfolio
7.21.3 Hua Rong Chip Package Test Probes Production, Value, Price and Gross Margin (2020-2025)
7.21.4 Hua Rong Main Business and Markets Served
7.21.5 Hua Rong Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Chip Package Test Probes Industry Chain Analysis
8.2 Chip Package Test Probes Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Chip Package Test Probes Production Mode & Process Analysis
8.4 Chip Package Test Probes Sales and Marketing
8.4.1 Chip Package Test Probes Sales Channels
8.4.2 Chip Package Test Probes Distributors
8.5 Chip Package Test Probes Customer Analysis
9 Chip Package Test Probes Market Dynamics
9.1 Chip Package Test Probes Industry Trends
9.2 Chip Package Test Probes Market Drivers
9.3 Chip Package Test Probes Market Challenges
9.4 Chip Package Test Probes Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
LEENO
Cohu
QA Technology
Smiths Interconnect
Yokowo Co., Ltd.
INGUN
Feinmetall
Qualmax
PTR HARTMANN (Phoenix Mecano)
Seiken Co., Ltd.
TESPRO
AIKOSHA
CCP Contact Probes
Da-Chung
UIGreen
Centalic
WoodKing Intelligent Technology
Lanyi Electronic
Merryprobe Electronic
Tough Tech
Hua Rong
听
听
*If Applicable.
