Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
Market Analysis and Insights: Global Chip Packaging Market
The global Chip Packaging market is projected to grow from US$ 33350 million in 2024 to US$ 48660 million by 2030, at a Compound Annual Growth Rate (CAGR) of 6.5% during the forecast period.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.
Report Covers:
This report presents an overview of global market for Chip Packaging market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Chip Packaging, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Chip Packaging, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Chip Packaging revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Chip Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Chip Packaging revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Chip Packaging in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Packaging companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Chip Packaging revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Packaging Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Traditional Packaging
1.2.3 Advanced Packaging
1.3 Market by Application
1.3.1 Global Chip Packaging Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Automotive and Traffic
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Packaging Market Perspective (2019-2030)
2.2 Global Chip Packaging Growth Trends by Region
2.2.1 Chip Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Packaging Historic Market Size by Region (2019-2024)
2.2.3 Chip Packaging Forecasted Market Size by Region (2025-2030)
2.3 Chip Packaging Market Dynamics
2.3.1 Chip Packaging Industry Trends
2.3.2 Chip Packaging Market Drivers
2.3.3 Chip Packaging Market Challenges
2.3.4 Chip Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Chip Packaging by Players
3.1.1 Global Chip Packaging Revenue by Players (2019-2024)
3.1.2 Global Chip Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Chip Packaging, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Chip Packaging Market Concentration Ratio
3.4.1 Global Chip Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Packaging Revenue in 2023
3.5 Global Key Players of Chip Packaging Head office and Area Served
3.6 Global Key Players of Chip Packaging, Product and Application
3.7 Global Key Players of Chip Packaging, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Packaging Breakdown Data by Type
4.1 Global Chip Packaging Historic Market Size by Type (2019-2024)
4.2 Global Chip Packaging Forecasted Market Size by Type (2025-2030)
5 Chip Packaging Breakdown Data by Application
5.1 Global Chip Packaging Historic Market Size by Application (2019-2024)
5.2 Global Chip Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Packaging Market Size (2019-2030)
6.2 North America Chip Packaging Market Size by Type
6.2.1 North America Chip Packaging Market Size by Type (2019-2024)
6.2.2 North America Chip Packaging Market Size by Type (2025-2030)
6.2.3 North America Chip Packaging Market Share by Type (2019-2030)
6.3 North America Chip Packaging Market Size by Application
6.3.1 North America Chip Packaging Market Size by Application (2019-2024)
6.3.2 North America Chip Packaging Market Size by Application (2025-2030)
6.3.3 North America Chip Packaging Market Share by Application (2019-2030)
6.4 North America Chip Packaging Market Size by Country
6.4.1 North America Chip Packaging Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Chip Packaging Market Size by Country (2019-2024)
6.4.3 North America Chip Packaging Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe Chip Packaging Market Size (2019-2030)
7.2 Europe Chip Packaging Market Size by Type
7.2.1 Europe Chip Packaging Market Size by Type (2019-2024)
7.2.2 Europe Chip Packaging Market Size by Type (2025-2030)
7.2.3 Europe Chip Packaging Market Share by Type (2019-2030)
7.3 Europe Chip Packaging Market Size by Application
7.3.1 Europe Chip Packaging Market Size by Application (2019-2024)
7.3.2 Europe Chip Packaging Market Size by Application (2025-2030)
7.3.3 Europe Chip Packaging Market Share by Application (2019-2030)
7.4 Europe Chip Packaging Market Size by Country
7.4.1 Europe Chip Packaging Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Chip Packaging Market Size by Country (2019-2024)
7.4.3 Europe Chip Packaging Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Chip Packaging Market Size (2019-2030)
8.2 China Chip Packaging Market Size by Type
8.2.1 China Chip Packaging Market Size by Type (2019-2024)
8.2.2 China Chip Packaging Market Size by Type (2025-2030)
8.2.3 China Chip Packaging Market Share by Type (2019-2030)
8.3 China Chip Packaging Market Size by Application
8.3.1 China Chip Packaging Market Size by Application (2019-2024)
8.3.2 China Chip Packaging Market Size by Application (2025-2030)
8.3.3 China Chip Packaging Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Chip Packaging Market Size (2019-2030)
9.2 Asia Chip Packaging Market Size by Type
9.2.1 Asia Chip Packaging Market Size by Type (2019-2024)
9.2.2 Asia Chip Packaging Market Size by Type (2025-2030)
9.2.3 Asia Chip Packaging Market Share by Type (2019-2030)
9.3 Asia Chip Packaging Market Size by Application
9.3.1 Asia Chip Packaging Market Size by Application (2019-2024)
9.3.2 Asia Chip Packaging Market Size by Application (2025-2030)
9.3.3 Asia Chip Packaging Market Share by Application (2019-2030)
9.4 Asia Chip Packaging Market Size by Region
9.4.1 Asia Chip Packaging Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Chip Packaging Market Size by Region (2019-2024)
9.4.3 Asia Chip Packaging Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Chip Packaging Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Chip Packaging Market Size by Type
10.2.1 Middle East, Africa, and Latin America Chip Packaging Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Chip Packaging Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Chip Packaging Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Chip Packaging Market Size by Application
10.3.1 Middle East, Africa, and Latin America Chip Packaging Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Chip Packaging Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Chip Packaging Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Chip Packaging Market Size by Country
10.4.1 Middle East, Africa, and Latin America Chip Packaging Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Chip Packaging Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Chip Packaging Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 ASE Group
11.1.1 ASE Group Company Details
11.1.2 ASE Group Business Overview
11.1.3 ASE Group Chip Packaging Introduction
11.1.4 ASE Group Revenue in Chip Packaging Business (2019-2024)
11.1.5 ASE Group Recent Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Details
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Chip Packaging Introduction
11.2.4 Amkor Technology Revenue in Chip Packaging Business (2019-2024)
11.2.5 Amkor Technology Recent Developments
11.3 JCET
11.3.1 JCET Company Details
11.3.2 JCET Business Overview
11.3.3 JCET Chip Packaging Introduction
11.3.4 JCET Revenue in Chip Packaging Business (2019-2024)
11.3.5 JCET Recent Developments
11.4 Siliconware Precision Industries
11.4.1 Siliconware Precision Industries Company Details
11.4.2 Siliconware Precision Industries Business Overview
11.4.3 Siliconware Precision Industries Chip Packaging Introduction
11.4.4 Siliconware Precision Industries Revenue in Chip Packaging Business (2019-2024)
11.4.5 Siliconware Precision Industries Recent Developments
11.5 Powertech Technology
11.5.1 Powertech Technology Company Details
11.5.2 Powertech Technology Business Overview
11.5.3 Powertech Technology Chip Packaging Introduction
11.5.4 Powertech Technology Revenue in Chip Packaging Business (2019-2024)
11.5.5 Powertech Technology Recent Developments
11.6 TongFu Microelectronics
11.6.1 TongFu Microelectronics Company Details
11.6.2 TongFu Microelectronics Business Overview
11.6.3 TongFu Microelectronics Chip Packaging Introduction
11.6.4 TongFu Microelectronics Revenue in Chip Packaging Business (2019-2024)
11.6.5 TongFu Microelectronics Recent Developments
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Details
11.7.2 Tianshui Huatian Technology Business Overview
11.7.3 Tianshui Huatian Technology Chip Packaging Introduction
11.7.4 Tianshui Huatian Technology Revenue in Chip Packaging Business (2019-2024)
11.7.5 Tianshui Huatian Technology Recent Developments
11.8 UTAC
11.8.1 UTAC Company Details
11.8.2 UTAC Business Overview
11.8.3 UTAC Chip Packaging Introduction
11.8.4 UTAC Revenue in Chip Packaging Business (2019-2024)
11.8.5 UTAC Recent Developments
11.9 Chipbond Technology
11.9.1 Chipbond Technology Company Details
11.9.2 Chipbond Technology Business Overview
11.9.3 Chipbond Technology Chip Packaging Introduction
11.9.4 Chipbond Technology Revenue in Chip Packaging Business (2019-2024)
11.9.5 Chipbond Technology Recent Developments
11.10 Hana Micron
11.10.1 Hana Micron Company Details
11.10.2 Hana Micron Business Overview
11.10.3 Hana Micron Chip Packaging Introduction
11.10.4 Hana Micron Revenue in Chip Packaging Business (2019-2024)
11.10.5 Hana Micron Recent Developments
11.11 OSE
11.11.1 OSE Company Details
11.11.2 OSE Business Overview
11.11.3 OSE Chip Packaging Introduction
11.11.4 OSE Revenue in Chip Packaging Business (2019-2024)
11.11.5 OSE Recent Developments
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Details
11.12.2 Walton Advanced Engineering Business Overview
11.12.3 Walton Advanced Engineering Chip Packaging Introduction
11.12.4 Walton Advanced Engineering Revenue in Chip Packaging Business (2019-2024)
11.12.5 Walton Advanced Engineering Recent Developments
11.13 NEPES
11.13.1 NEPES Company Details
11.13.2 NEPES Business Overview
11.13.3 NEPES Chip Packaging Introduction
11.13.4 NEPES Revenue in Chip Packaging Business (2019-2024)
11.13.5 NEPES Recent Developments
11.14 Unisem
11.14.1 Unisem Company Details
11.14.2 Unisem Business Overview
11.14.3 Unisem Chip Packaging Introduction
11.14.4 Unisem Revenue in Chip Packaging Business (2019-2024)
11.14.5 Unisem Recent Developments
11.15 ChipMOS
11.15.1 ChipMOS Company Details
11.15.2 ChipMOS Business Overview
11.15.3 ChipMOS Chip Packaging Introduction
11.15.4 ChipMOS Revenue in Chip Packaging Business (2019-2024)
11.15.5 ChipMOS Recent Developments
11.16 Signetics
11.16.1 Signetics Company Details
11.16.2 Signetics Business Overview
11.16.3 Signetics Chip Packaging Introduction
11.16.4 Signetics Revenue in Chip Packaging Business (2019-2024)
11.16.5 Signetics Recent Developments
11.17 Carsem
11.17.1 Carsem Company Details
11.17.2 Carsem Business Overview
11.17.3 Carsem Chip Packaging Introduction
11.17.4 Carsem Revenue in Chip Packaging Business (2019-2024)
11.17.5 Carsem Recent Developments
11.18 King Yuan ELECTRONICS
11.18.1 King Yuan ELECTRONICS Company Details
11.18.2 King Yuan ELECTRONICS Business Overview
11.18.3 King Yuan ELECTRONICS Chip Packaging Introduction
11.18.4 King Yuan ELECTRONICS Revenue in Chip Packaging Business (2019-2024)
11.18.5 King Yuan ELECTRONICS Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
听
听
*If Applicable.
