The global Chip Packaging & Testing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Chip Packaging & Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging & Testing.
Report Scope
The Chip Packaging & Testing market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Packaging & Testing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Packaging & Testing companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Technology Holding
Amkor Technology
JCET Group
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
King Yuan ELECTRONICS
ChipMOS TECHNOLOGIES
Chipbond Technology
Sino Ic Technology
Leadyo IC Testing
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
UTAC
Hana Micron
OSE
NEPES
Unisem
Signetics
Carsem
Teradyne
Segment by Type
Packaging
Testing
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Packaging & Testing companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Packaging & Testing Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Packaging
1.2.3 Testing
1.3 Market by Application
1.3.1 Global Chip Packaging & Testing Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Packaging & Testing Market Perspective (2019-2030)
2.2 Chip Packaging & Testing Growth Trends by Region
2.2.1 Global Chip Packaging & Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Packaging & Testing Historic Market Size by Region (2019-2024)
2.2.3 Chip Packaging & Testing Forecasted Market Size by Region (2025-2030)
2.3 Chip Packaging & Testing Market Dynamics
2.3.1 Chip Packaging & Testing Industry Trends
2.3.2 Chip Packaging & Testing Market Drivers
2.3.3 Chip Packaging & Testing Market Challenges
2.3.4 Chip Packaging & Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Packaging & Testing Players by Revenue
3.1.1 Global Top Chip Packaging & Testing Players by Revenue (2019-2024)
3.1.2 Global Chip Packaging & Testing Revenue Market Share by Players (2019-2024)
3.2 Global Chip Packaging & Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Packaging & Testing Revenue
3.4 Global Chip Packaging & Testing Market Concentration Ratio
3.4.1 Global Chip Packaging & Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Packaging & Testing Revenue in 2023
3.5 Chip Packaging & Testing Key Players Head office and Area Served
3.6 Key Players Chip Packaging & Testing Product Solution and Service
3.7 Date of Enter into Chip Packaging & Testing Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Packaging & Testing Breakdown Data by Type
4.1 Global Chip Packaging & Testing Historic Market Size by Type (2019-2024)
4.2 Global Chip Packaging & Testing Forecasted Market Size by Type (2025-2030)
5 Chip Packaging & Testing Breakdown Data by Application
5.1 Global Chip Packaging & Testing Historic Market Size by Application (2019-2024)
5.2 Global Chip Packaging & Testing Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Packaging & Testing Market Size (2019-2030)
6.2 North America Chip Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip Packaging & Testing Market Size by Country (2019-2024)
6.4 North America Chip Packaging & Testing Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Packaging & Testing Market Size (2019-2030)
7.2 Europe Chip Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip Packaging & Testing Market Size by Country (2019-2024)
7.4 Europe Chip Packaging & Testing Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Packaging & Testing Market Size (2019-2030)
8.2 Asia-Pacific Chip Packaging & Testing Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip Packaging & Testing Market Size by Region (2019-2024)
8.4 Asia-Pacific Chip Packaging & Testing Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Packaging & Testing Market Size (2019-2030)
9.2 Latin America Chip Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip Packaging & Testing Market Size by Country (2019-2024)
9.4 Latin America Chip Packaging & Testing Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Packaging & Testing Market Size (2019-2030)
10.2 Middle East & Africa Chip Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip Packaging & Testing Market Size by Country (2019-2024)
10.4 Middle East & Africa Chip Packaging & Testing Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Technology Holding
11.1.1 ASE Technology Holding Company Detail
11.1.2 ASE Technology Holding Business Overview
11.1.3 ASE Technology Holding Chip Packaging & Testing Introduction
11.1.4 ASE Technology Holding Revenue in Chip Packaging & Testing Business (2019-2024)
11.1.5 ASE Technology Holding Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Chip Packaging & Testing Introduction
11.2.4 Amkor Technology Revenue in Chip Packaging & Testing Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 JCET Group
11.3.1 JCET Group Company Detail
11.3.2 JCET Group Business Overview
11.3.3 JCET Group Chip Packaging & Testing Introduction
11.3.4 JCET Group Revenue in Chip Packaging & Testing Business (2019-2024)
11.3.5 JCET Group Recent Development
11.4 Siliconware Precision Industries
11.4.1 Siliconware Precision Industries Company Detail
11.4.2 Siliconware Precision Industries Business Overview
11.4.3 Siliconware Precision Industries Chip Packaging & Testing Introduction
11.4.4 Siliconware Precision Industries Revenue in Chip Packaging & Testing Business (2019-2024)
11.4.5 Siliconware Precision Industries Recent Development
11.5 Powertech Technology
11.5.1 Powertech Technology Company Detail
11.5.2 Powertech Technology Business Overview
11.5.3 Powertech Technology Chip Packaging & Testing Introduction
11.5.4 Powertech Technology Revenue in Chip Packaging & Testing Business (2019-2024)
11.5.5 Powertech Technology Recent Development
11.6 Tongfu Microelectronics
11.6.1 Tongfu Microelectronics Company Detail
11.6.2 Tongfu Microelectronics Business Overview
11.6.3 Tongfu Microelectronics Chip Packaging & Testing Introduction
11.6.4 Tongfu Microelectronics Revenue in Chip Packaging & Testing Business (2019-2024)
11.6.5 Tongfu Microelectronics Recent Development
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Detail
11.7.2 Tianshui Huatian Technology Business Overview
11.7.3 Tianshui Huatian Technology Chip Packaging & Testing Introduction
11.7.4 Tianshui Huatian Technology Revenue in Chip Packaging & Testing Business (2019-2024)
11.7.5 Tianshui Huatian Technology Recent Development
11.8 King Yuan ELECTRONICS
11.8.1 King Yuan ELECTRONICS Company Detail
11.8.2 King Yuan ELECTRONICS Business Overview
11.8.3 King Yuan ELECTRONICS Chip Packaging & Testing Introduction
11.8.4 King Yuan ELECTRONICS Revenue in Chip Packaging & Testing Business (2019-2024)
11.8.5 King Yuan ELECTRONICS Recent Development
11.9 ChipMOS TECHNOLOGIES
11.9.1 ChipMOS TECHNOLOGIES Company Detail
11.9.2 ChipMOS TECHNOLOGIES Business Overview
11.9.3 ChipMOS TECHNOLOGIES Chip Packaging & Testing Introduction
11.9.4 ChipMOS TECHNOLOGIES Revenue in Chip Packaging & Testing Business (2019-2024)
11.9.5 ChipMOS TECHNOLOGIES Recent Development
11.10 Chipbond Technology
11.10.1 Chipbond Technology Company Detail
11.10.2 Chipbond Technology Business Overview
11.10.3 Chipbond Technology Chip Packaging & Testing Introduction
11.10.4 Chipbond Technology Revenue in Chip Packaging & Testing Business (2019-2024)
11.10.5 Chipbond Technology Recent Development
11.11 Sino Ic Technology
11.11.1 Sino Ic Technology Company Detail
11.11.2 Sino Ic Technology Business Overview
11.11.3 Sino Ic Technology Chip Packaging & Testing Introduction
11.11.4 Sino Ic Technology Revenue in Chip Packaging & Testing Business (2019-2024)
11.11.5 Sino Ic Technology Recent Development
11.12 Leadyo IC Testing
11.12.1 Leadyo IC Testing Company Detail
11.12.2 Leadyo IC Testing Business Overview
11.12.3 Leadyo IC Testing Chip Packaging & Testing Introduction
11.12.4 Leadyo IC Testing Revenue in Chip Packaging & Testing Business (2019-2024)
11.12.5 Leadyo IC Testing Recent Development
11.13 Applied Materials
11.13.1 Applied Materials Company Detail
11.13.2 Applied Materials Business Overview
11.13.3 Applied Materials Chip Packaging & Testing Introduction
11.13.4 Applied Materials Revenue in Chip Packaging & Testing Business (2019-2024)
11.13.5 Applied Materials Recent Development
11.14 ASM Pacific Technology
11.14.1 ASM Pacific Technology Company Detail
11.14.2 ASM Pacific Technology Business Overview
11.14.3 ASM Pacific Technology Chip Packaging & Testing Introduction
11.14.4 ASM Pacific Technology Revenue in Chip Packaging & Testing Business (2019-2024)
11.14.5 ASM Pacific Technology Recent Development
11.15 Kulicke & Soffa Industries
11.15.1 Kulicke & Soffa Industries Company Detail
11.15.2 Kulicke & Soffa Industries Business Overview
11.15.3 Kulicke & Soffa Industries Chip Packaging & Testing Introduction
11.15.4 Kulicke & Soffa Industries Revenue in Chip Packaging & Testing Business (2019-2024)
11.15.5 Kulicke & Soffa Industries Recent Development
11.16 TEL
11.16.1 TEL Company Detail
11.16.2 TEL Business Overview
11.16.3 TEL Chip Packaging & Testing Introduction
11.16.4 TEL Revenue in Chip Packaging & Testing Business (2019-2024)
11.16.5 TEL Recent Development
11.17 Tokyo Seimitsu
11.17.1 Tokyo Seimitsu Company Detail
11.17.2 Tokyo Seimitsu Business Overview
11.17.3 Tokyo Seimitsu Chip Packaging & Testing Introduction
11.17.4 Tokyo Seimitsu Revenue in Chip Packaging & Testing Business (2019-2024)
11.17.5 Tokyo Seimitsu Recent Development
11.18 UTAC
11.18.1 UTAC Company Detail
11.18.2 UTAC Business Overview
11.18.3 UTAC Chip Packaging & Testing Introduction
11.18.4 UTAC Revenue in Chip Packaging & Testing Business (2019-2024)
11.18.5 UTAC Recent Development
11.19 Hana Micron
11.19.1 Hana Micron Company Detail
11.19.2 Hana Micron Business Overview
11.19.3 Hana Micron Chip Packaging & Testing Introduction
11.19.4 Hana Micron Revenue in Chip Packaging & Testing Business (2019-2024)
11.19.5 Hana Micron Recent Development
11.20 OSE
11.20.1 OSE Company Detail
11.20.2 OSE Business Overview
11.20.3 OSE Chip Packaging & Testing Introduction
11.20.4 OSE Revenue in Chip Packaging & Testing Business (2019-2024)
11.20.5 OSE Recent Development
11.21 NEPES
11.21.1 NEPES Company Detail
11.21.2 NEPES Business Overview
11.21.3 NEPES Chip Packaging & Testing Introduction
11.21.4 NEPES Revenue in Chip Packaging & Testing Business (2019-2024)
11.21.5 NEPES Recent Development
11.22 Unisem
11.22.1 Unisem Company Detail
11.22.2 Unisem Business Overview
11.22.3 Unisem Chip Packaging & Testing Introduction
11.22.4 Unisem Revenue in Chip Packaging & Testing Business (2019-2024)
11.22.5 Unisem Recent Development
11.23 Signetics
11.23.1 Signetics Company Detail
11.23.2 Signetics Business Overview
11.23.3 Signetics Chip Packaging & Testing Introduction
11.23.4 Signetics Revenue in Chip Packaging & Testing Business (2019-2024)
11.23.5 Signetics Recent Development
11.24 Carsem
11.24.1 Carsem Company Detail
11.24.2 Carsem Business Overview
11.24.3 Carsem Chip Packaging & Testing Introduction
11.24.4 Carsem Revenue in Chip Packaging & Testing Business (2019-2024)
11.24.5 Carsem Recent Development
11.25 Teradyne
11.25.1 Teradyne Company Detail
11.25.2 Teradyne Business Overview
11.25.3 Teradyne Chip Packaging & Testing Introduction
11.25.4 Teradyne Revenue in Chip Packaging & Testing Business (2019-2024)
11.25.5 Teradyne Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
ASE Technology Holding
Amkor Technology
JCET Group
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
King Yuan ELECTRONICS
ChipMOS TECHNOLOGIES
Chipbond Technology
Sino Ic Technology
Leadyo IC Testing
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
UTAC
Hana Micron
OSE
NEPES
Unisem
Signetics
Carsem
Teradyne
听
听
*If Applicable.
