Global Chip Scale Package (CSP) Market Research Report 2024

Publication ID:

PB503244359

Publication Date:

March 12, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The global Chip Scale Package (CSP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Chip Scale Package (CSP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Scale Package (CSP).
Report Scope
The Chip Scale Package (CSP) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Scale Package (CSP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Scale Package (CSP) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Scale Package (CSP) companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Scale Package (CSP) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Traditional Packaging
1.2.3 Advanced Packaging
1.3 Market by Application
1.3.1 Global Chip Scale Package (CSP) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive and Traffic
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Scale Package (CSP) Market Perspective (2019-2030)
2.2 Chip Scale Package (CSP) Growth Trends by Region
2.2.1 Global Chip Scale Package (CSP) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Scale Package (CSP) Historic Market Size by Region (2019-2024)
2.2.3 Chip Scale Package (CSP) Forecasted Market Size by Region (2025-2030)
2.3 Chip Scale Package (CSP) Market Dynamics
2.3.1 Chip Scale Package (CSP) Industry Trends
2.3.2 Chip Scale Package (CSP) Market Drivers
2.3.3 Chip Scale Package (CSP) Market Challenges
2.3.4 Chip Scale Package (CSP) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Scale Package (CSP) Players by Revenue
3.1.1 Global Top Chip Scale Package (CSP) Players by Revenue (2019-2024)
3.1.2 Global Chip Scale Package (CSP) Revenue Market Share by Players (2019-2024)
3.2 Global Chip Scale Package (CSP) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Scale Package (CSP) Revenue
3.4 Global Chip Scale Package (CSP) Market Concentration Ratio
3.4.1 Global Chip Scale Package (CSP) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Scale Package (CSP) Revenue in 2023
3.5 Chip Scale Package (CSP) Key Players Head office and Area Served
3.6 Key Players Chip Scale Package (CSP) Product Solution and Service
3.7 Date of Enter into Chip Scale Package (CSP) Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Scale Package (CSP) Breakdown Data by Type
4.1 Global Chip Scale Package (CSP) Historic Market Size by Type (2019-2024)
4.2 Global Chip Scale Package (CSP) Forecasted Market Size by Type (2025-2030)
5 Chip Scale Package (CSP) Breakdown Data by Application
5.1 Global Chip Scale Package (CSP) Historic Market Size by Application (2019-2024)
5.2 Global Chip Scale Package (CSP) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Scale Package (CSP) Market Size (2019-2030)
6.2 North America Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip Scale Package (CSP) Market Size by Country (2019-2024)
6.4 North America Chip Scale Package (CSP) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Scale Package (CSP) Market Size (2019-2030)
7.2 Europe Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip Scale Package (CSP) Market Size by Country (2019-2024)
7.4 Europe Chip Scale Package (CSP) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Scale Package (CSP) Market Size (2019-2030)
8.2 Asia-Pacific Chip Scale Package (CSP) Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip Scale Package (CSP) Market Size by Region (2019-2024)
8.4 Asia-Pacific Chip Scale Package (CSP) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Scale Package (CSP) Market Size (2019-2030)
9.2 Latin America Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip Scale Package (CSP) Market Size by Country (2019-2024)
9.4 Latin America Chip Scale Package (CSP) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Scale Package (CSP) Market Size (2019-2030)
10.2 Middle East & Africa Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip Scale Package (CSP) Market Size by Country (2019-2024)
10.4 Middle East & Africa Chip Scale Package (CSP) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Group
11.1.1 ASE Group Company Detail
11.1.2 ASE Group Business Overview
11.1.3 ASE Group Chip Scale Package (CSP) Introduction
11.1.4 ASE Group Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.1.5 ASE Group Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Chip Scale Package (CSP) Introduction
11.2.4 Amkor Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 JCET
11.3.1 JCET Company Detail
11.3.2 JCET Business Overview
11.3.3 JCET Chip Scale Package (CSP) Introduction
11.3.4 JCET Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.3.5 JCET Recent Development
11.4 Powertech Technology
11.4.1 Powertech Technology Company Detail
11.4.2 Powertech Technology Business Overview
11.4.3 Powertech Technology Chip Scale Package (CSP) Introduction
11.4.4 Powertech Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.4.5 Powertech Technology Recent Development
11.5 TongFu Microelectronics
11.5.1 TongFu Microelectronics Company Detail
11.5.2 TongFu Microelectronics Business Overview
11.5.3 TongFu Microelectronics Chip Scale Package (CSP) Introduction
11.5.4 TongFu Microelectronics Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.5.5 TongFu Microelectronics Recent Development
11.6 Tianshui Huatian Technology
11.6.1 Tianshui Huatian Technology Company Detail
11.6.2 Tianshui Huatian Technology Business Overview
11.6.3 Tianshui Huatian Technology Chip Scale Package (CSP) Introduction
11.6.4 Tianshui Huatian Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.6.5 Tianshui Huatian Technology Recent Development
11.7 UTAC
11.7.1 UTAC Company Detail
11.7.2 UTAC Business Overview
11.7.3 UTAC Chip Scale Package (CSP) Introduction
11.7.4 UTAC Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.7.5 UTAC Recent Development
11.8 Chipbond Technology
11.8.1 Chipbond Technology Company Detail
11.8.2 Chipbond Technology Business Overview
11.8.3 Chipbond Technology Chip Scale Package (CSP) Introduction
11.8.4 Chipbond Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.8.5 Chipbond Technology Recent Development
11.9 Hana Micron
11.9.1 Hana Micron Company Detail
11.9.2 Hana Micron Business Overview
11.9.3 Hana Micron Chip Scale Package (CSP) Introduction
11.9.4 Hana Micron Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.9.5 Hana Micron Recent Development
11.10 OSE
11.10.1 OSE Company Detail
11.10.2 OSE Business Overview
11.10.3 OSE Chip Scale Package (CSP) Introduction
11.10.4 OSE Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.10.5 OSE Recent Development
11.11 Walton Advanced Engineering
11.11.1 Walton Advanced Engineering Company Detail
11.11.2 Walton Advanced Engineering Business Overview
11.11.3 Walton Advanced Engineering Chip Scale Package (CSP) Introduction
11.11.4 Walton Advanced Engineering Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.11.5 Walton Advanced Engineering Recent Development
11.12 NEPES
11.12.1 NEPES Company Detail
11.12.2 NEPES Business Overview
11.12.3 NEPES Chip Scale Package (CSP) Introduction
11.12.4 NEPES Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.12.5 NEPES Recent Development
11.13 Unisem
11.13.1 Unisem Company Detail
11.13.2 Unisem Business Overview
11.13.3 Unisem Chip Scale Package (CSP) Introduction
11.13.4 Unisem Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.13.5 Unisem Recent Development
11.14 ChipMOS
11.14.1 ChipMOS Company Detail
11.14.2 ChipMOS Business Overview
11.14.3 ChipMOS Chip Scale Package (CSP) Introduction
11.14.4 ChipMOS Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.14.5 ChipMOS Recent Development
11.15 Signetics
11.15.1 Signetics Company Detail
11.15.2 Signetics Business Overview
11.15.3 Signetics Chip Scale Package (CSP) Introduction
11.15.4 Signetics Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.15.5 Signetics Recent Development
11.16 Carsem
11.16.1 Carsem Company Detail
11.16.2 Carsem Business Overview
11.16.3 Carsem Chip Scale Package (CSP) Introduction
11.16.4 Carsem Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.16.5 Carsem Recent Development
11.17 King Yuan ELECTRONICS
11.17.1 King Yuan ELECTRONICS Company Detail
11.17.2 King Yuan ELECTRONICS Business Overview
11.17.3 King Yuan ELECTRONICS Chip Scale Package (CSP) Introduction
11.17.4 King Yuan ELECTRONICS Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.17.5 King Yuan ELECTRONICS Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS

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