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Home > Global Copper Clad Laminate (CCL) For IC Substrates Market Size, Competition and Demand Analysis Report #Insights

Global Copper Clad Laminate (CCL) For IC Substrates Market Size, Competition and Demand Analysis Report #Insights

Publication ID: 
MRRPB5#86
Publication Date: 
April 5, 2023
Pages: 
101
Publisher: 
MRRPB5
Countries: 
Global [1]
USD 2,900.00

Please choose the suitable license type from above. More details are given under tab "Report License Types" below.

Adhesives & Sealants [2]
Computing & Electronics [3]
Semiconductors [4]
Description: 

Copper-clad laminate (CCL) for IC substrates are packaging carriers using copper foil as the base substrate for printed circuit boards.

Highlights

  • The global Copper Clad Laminate (CCL) for IC Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
  • North American market for Copper Clad Laminate (CCL) for IC Substrates is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
  • Asia-Pacific market for Copper Clad Laminate (CCL) for IC Substrates is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
  • The key global companies of Copper Clad Laminate (CCL) for IC Substrates include Panasonic, Showa Denko Materials Co., Ltd., Hitachi Chemical, Toppan Printing, Kinsus Interconnect Technology, Simmtech, Nanya PLASTICS, Kyocera and LG Innotek, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Copper Clad Laminate (CCL) for IC Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Clad Laminate (CCL) for IC Substrates.

The Copper Clad Laminate (CCL) for IC Substrates market size, estimations, and forecasts are provided in terms of output/shipments (M Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report comprehensively segments the global Copper Clad Laminate (CCL) for IC Substrates market. Regional market sizes concerning products by type, by application and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Copper Clad Laminate (CCL) for IC Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.

By Company

  1. Panasonic
  2. Showa Denko Materials Co., Ltd.
  3. Hitachi Chemical
  4. Toppan Printing
  5. Kinsus Interconnect Technology
  6. Simmtech
  7. Nanya PLASTICS
  8. Kyocera
  9. LG Innotek
  10. Zhen Ding Technology
  11. SYTECH
  12. ITEQ Corporation
  13. Isola Group
  14. Doosan Corporation Electro-Materials
  15. Chaohua

Segment by Type

  • WB CSP
  • FC BGA
  • FC CSP
  • PBGA
  • SiP
  • BOC
  • Other

Segment by Application

  • Smart Phones
  • PC (Tablet, Laptop)
  • Wearable Devices
  • Others

Production by Region

North America

Europe

China

Japan

Consumption by Region

North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

India

Australia

China Taiwan

Southeast Asia

Latin America

Mexico

Brazil

Argentina

Core Chapters

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Copper Clad Laminate (CCL) for IC Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Copper Clad Laminate (CCL) for IC Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Copper Clad Laminate (CCL) for IC Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.
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Table Of Contents: 

1 Copper Clad Laminate (CCL) for IC Substrates Market Overview

1.1 Product Definition

1.2 Copper Clad Laminate (CCL) for IC Substrates Segment by Type

1.2.1 Global Copper Clad Laminate (CCL) for IC Substrates Market Value Growth Rate Analysis by Type 2022 VS 2029

1.2.2 WB CSP

1.2.3 FC BGA

1.2.4 FC CSP

1.2.5 PBGA

1.2.6 SiP

1.2.7 BOC

1.2.8 Other

1.3 Copper Clad Laminate (CCL) for IC Substrates Segment by Application

1.3.1 Global Copper Clad Laminate (CCL) for IC Substrates Market Value Growth Rate Analysis by Application: 2022 VS 2029

1.3.2 Smart Phones

1.3.3 PC (Tablet, Laptop)

1.3.4 Wearable Devices

1.3.5 Others

1.4 Global Market Growth Prospects

1.4.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Value Estimates and Forecasts (2018-2029)

1.4.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Capacity Estimates and Forecasts (2018-2029)

1.4.3 Global Copper Clad Laminate (CCL) for IC Substrates Production Estimates and Forecasts (2018-2029)

1.4.4 Global Copper Clad Laminate (CCL) for IC Substrates Market Average Price Estimates and Forecasts (2018-2029)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Market Share by Manufacturers (2018-2023)

2.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Value Market Share by Manufacturers (2018-2023)

2.3 Global Key Players of Copper Clad Laminate (CCL) for IC Substrates, Industry Ranking, 2021 VS 2022 VS 2023

2.4 Global Copper Clad Laminate (CCL) for IC Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)

2.5 Global Copper Clad Laminate (CCL) for IC Substrates Average Price by Manufacturers (2018-2023)

2.6 Global Key Manufacturers of Copper Clad Laminate (CCL) for IC Substrates, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Copper Clad Laminate (CCL) for IC Substrates, Product Offered and Application

2.8 Global Key Manufacturers of Copper Clad Laminate (CCL) for IC Substrates, Date of Enter into This Industry

2.9 Copper Clad Laminate (CCL) for IC Substrates Market Competitive Situation and Trends

2.9.1 Copper Clad Laminate (CCL) for IC Substrates Market Concentration Rate

2.9.2 Global 5 and 10 Largest Copper Clad Laminate (CCL) for IC Substrates Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Copper Clad Laminate (CCL) for IC Substrates Production by Region

3.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029

3.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Region (2018-2029)

3.2.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Value Market Share by Region (2018-2023)

3.2.2 Global Forecasted Production Value of Copper Clad Laminate (CCL) for IC Substrates by Region (2024-2029)

3.3 Global Copper Clad Laminate (CCL) for IC Substrates Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029

3.4 Global Copper Clad Laminate (CCL) for IC Substrates Production by Region (2018-2029)

3.4.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Market Share by Region (2018-2023)

3.4.2 Global Forecasted Production of Copper Clad Laminate (CCL) for IC Substrates by Region (2024-2029)

3.5 Global Copper Clad Laminate (CCL) for IC Substrates Market Price Analysis by Region (2018-2023)

3.6 Global Copper Clad Laminate (CCL) for IC Substrates Production and Value, Year-over-Year Growth

3.6.1 North America Copper Clad Laminate (CCL) for IC Substrates Production Value Estimates and Forecasts (2018-2029)

3.6.2 Europe Copper Clad Laminate (CCL) for IC Substrates Production Value Estimates and Forecasts (2018-2029)

3.6.3 China Copper Clad Laminate (CCL) for IC Substrates Production Value Estimates and Forecasts (2018-2029)

3.6.4 Japan Copper Clad Laminate (CCL) for IC Substrates Production Value Estimates and Forecasts (2018-2029)

4 Copper Clad Laminate (CCL) for IC Substrates Consumption by Region

4.1 Global Copper Clad Laminate (CCL) for IC Substrates Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029

4.2 Global Copper Clad Laminate (CCL) for IC Substrates Consumption by Region (2018-2029)

4.2.1 Global Copper Clad Laminate (CCL) for IC Substrates Consumption by Region (2018-2023)

4.2.2 Global Copper Clad Laminate (CCL) for IC Substrates Forecasted Consumption by Region (2024-2029)

4.3 North America

4.3.1 North America Copper Clad Laminate (CCL) for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029

4.3.2 North America Copper Clad Laminate (CCL) for IC Substrates Consumption by Country (2018-2029)

4.3.3 United States

4.3.4 Canada

4.4 Europe

4.4.1 Europe Copper Clad Laminate (CCL) for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029

4.4.2 Europe Copper Clad Laminate (CCL) for IC Substrates Consumption by Country (2018-2029)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Russia

4.5 Asia Pacific

4.5.1 Asia Pacific Copper Clad Laminate (CCL) for IC Substrates Consumption Growth Rate by Region: 2018 VS 2022 VS 2029

4.5.2 Asia Pacific Copper Clad Laminate (CCL) for IC Substrates Consumption by Region (2018-2029)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Copper Clad Laminate (CCL) for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029

4.6.2 Latin America, Middle East & Africa Copper Clad Laminate (CCL) for IC Substrates Consumption by Country (2018-2029)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

5 Segment by Type

5.1 Global Copper Clad Laminate (CCL) for IC Substrates Production by Type (2018-2029)

5.1.1 Global Copper Clad Laminate (CCL) for IC Substrates Production by Type (2018-2023)

5.1.2 Global Copper Clad Laminate (CCL) for IC Substrates Production by Type (2024-2029)

5.1.3 Global Copper Clad Laminate (CCL) for IC Substrates Production Market Share by Type (2018-2029)

5.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Type (2018-2029)

5.2.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Type (2018-2023)

5.2.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Type (2024-2029)

5.2.3 Global Copper Clad Laminate (CCL) for IC Substrates Production Value Market Share by Type (2018-2029)

5.3 Global Copper Clad Laminate (CCL) for IC Substrates Price by Type (2018-2029)

6 Segment by Application

6.1 Global Copper Clad Laminate (CCL) for IC Substrates Production by Application (2018-2029)

6.1.1 Global Copper Clad Laminate (CCL) for IC Substrates Production by Application (2018-2023)

6.1.2 Global Copper Clad Laminate (CCL) for IC Substrates Production by Application (2024-2029)

6.1.3 Global Copper Clad Laminate (CCL) for IC Substrates Production Market Share by Application (2018-2029)

6.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Application (2018-2029)

6.2.1 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Application (2018-2023)

6.2.2 Global Copper Clad Laminate (CCL) for IC Substrates Production Value by Application (2024-2029)

6.2.3 Global Copper Clad Laminate (CCL) for IC Substrates Production Value Market Share by Application (2018-2029)

6.3 Global Copper Clad Laminate (CCL) for IC Substrates Price by Application (2018-2029)

7 Key Companies Profiled

7.1 Panasonic

7.1.1 Panasonic Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.1.2 Panasonic Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.1.3 Panasonic Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.1.4 Panasonic Main Business and Markets Served

7.1.5 Panasonic Recent Developments/Updates

7.2 Showa Denko Materials Co., Ltd.

7.2.1 Showa Denko Materials Co., Ltd. Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.2.2 Showa Denko Materials Co., Ltd. Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.2.3 Showa Denko Materials Co., Ltd. Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.2.4 Showa Denko Materials Co., Ltd. Main Business and Markets Served

7.2.5 Showa Denko Materials Co., Ltd. Recent Developments/Updates

7.3 Hitachi Chemical

7.3.1 Hitachi Chemical Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.3.2 Hitachi Chemical Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.3.3 Hitachi Chemical Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.3.4 Hitachi Chemical Main Business and Markets Served

7.3.5 Hitachi Chemical Recent Developments/Updates

7.4 Toppan Printing

7.4.1 Toppan Printing Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.4.2 Toppan Printing Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.4.3 Toppan Printing Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.4.4 Toppan Printing Main Business and Markets Served

7.4.5 Toppan Printing Recent Developments/Updates

7.5 Kinsus Interconnect Technology

7.5.1 Kinsus Interconnect Technology Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.5.2 Kinsus Interconnect Technology Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.5.3 Kinsus Interconnect Technology Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.5.4 Kinsus Interconnect Technology Main Business and Markets Served

7.5.5 Kinsus Interconnect Technology Recent Developments/Updates

7.6 Simmtech

7.6.1 Simmtech Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.6.2 Simmtech Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.6.3 Simmtech Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.6.4 Simmtech Main Business and Markets Served

7.6.5 Simmtech Recent Developments/Updates

7.7 Nanya PLASTICS

7.7.1 Nanya PLASTICS Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.7.2 Nanya PLASTICS Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.7.3 Nanya PLASTICS Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.7.4 Nanya PLASTICS Main Business and Markets Served

7.7.5 Nanya PLASTICS Recent Developments/Updates

7.8 Kyocera

7.8.1 Kyocera Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.8.2 Kyocera Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.8.3 Kyocera Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.8.4 Kyocera Main Business and Markets Served

7.7.5 Kyocera Recent Developments/Updates

7.9 LG Innotek

7.9.1 LG Innotek Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.9.2 LG Innotek Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.9.3 LG Innotek Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.9.4 LG Innotek Main Business and Markets Served

7.9.5 LG Innotek Recent Developments/Updates

7.10 Zhen Ding Technology

7.10.1 Zhen Ding Technology Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.10.2 Zhen Ding Technology Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.10.3 Zhen Ding Technology Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.10.4 Zhen Ding Technology Main Business and Markets Served

7.10.5 Zhen Ding Technology Recent Developments/Updates

7.11 SYTECH

7.11.1 SYTECH Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.11.2 SYTECH Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.11.3 SYTECH Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.11.4 SYTECH Main Business and Markets Served

7.11.5 SYTECH Recent Developments/Updates

7.12 ITEQ Corporation

7.12.1 ITEQ Corporation Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.12.2 ITEQ Corporation Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.12.3 ITEQ Corporation Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.12.4 ITEQ Corporation Main Business and Markets Served

7.12.5 ITEQ Corporation Recent Developments/Updates

7.13 Isola Group

7.13.1 Isola Group Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.13.2 Isola Group Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.13.3 Isola Group Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.13.4 Isola Group Main Business and Markets Served

7.13.5 Isola Group Recent Developments/Updates

7.14 Doosan Corporation Electro-Materials

7.14.1 Doosan Corporation Electro-Materials Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.14.2 Doosan Corporation Electro-Materials Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.14.3 Doosan Corporation Electro-Materials Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.14.4 Doosan Corporation Electro-Materials Main Business and Markets Served

7.14.5 Doosan Corporation Electro-Materials Recent Developments/Updates

7.15 Chaohua

7.15.1 Chaohua Copper Clad Laminate (CCL) for IC Substrates Corporation Information

7.15.2 Chaohua Copper Clad Laminate (CCL) for IC Substrates Product Portfolio

7.15.3 Chaohua Copper Clad Laminate (CCL) for IC Substrates Production, Value, Price and Gross Margin (2018-2023)

7.15.4 Chaohua Main Business and Markets Served

7.15.5 Chaohua Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Copper Clad Laminate (CCL) for IC Substrates Industry Chain Analysis

8.2 Copper Clad Laminate (CCL) for IC Substrates Key Raw Materials

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Copper Clad Laminate (CCL) for IC Substrates Production Mode & Process

8.4 Copper Clad Laminate (CCL) for IC Substrates Sales and Marketing

8.4.1 Copper Clad Laminate (CCL) for IC Substrates Sales Channels

8.4.2 Copper Clad Laminate (CCL) for IC Substrates Distributors

8.5 Copper Clad Laminate (CCL) for IC Substrates Customers

9 Copper Clad Laminate (CCL) for IC Substrates Market Dynamics

9.1 Copper Clad Laminate (CCL) for IC Substrates Industry Trends

9.2 Copper Clad Laminate (CCL) for IC Substrates Market Drivers

9.3 Copper Clad Laminate (CCL) for IC Substrates Market Challenges

9.4 Copper Clad Laminate (CCL) for IC Substrates Market Restraints

10 Research Finding and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

Companies Mentioned: 
  1. Panasonic
  2. Showa Denko Materials Co., Ltd.
  3. Hitachi Chemical
  4. Toppan Printing
  5. Kinsus Interconnect Technology
  6. Simmtech
  7. Nanya PLASTICS
  8. Kyocera
  9. LG Innotek
  10. Zhen Ding Technology
  11. SYTECH
  12. ITEQ Corporation
  13. Isola Group
  14. Doosan Corporation Electro-Materials
  15. Chaohua
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