The global market for Coreless Packaging Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Coreless Packaging Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Coreless Packaging Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Coreless Packaging Substrate include SHINKO ELECTRIC INDUSTRIES CO., LTD., Samsung, Panasonic Group, Sony, HITACHI CHEMICAL COMPANY, LTD., TCI, Korea Circuit, Founder, Unimicron, National Center for Advanced Packaging Co., Ltd.(NCAP China), etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Coreless Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Coreless Packaging Substrate.
The Coreless Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Coreless Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Coreless Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
SHINKO ELECTRIC INDUSTRIES CO., LTD.
Samsung
Panasonic Group
Sony
HITACHI CHEMICAL COMPANY, LTD.
TCI
Korea Circuit
Founder
Unimicron
National Center for Advanced Packaging Co., Ltd.(NCAP China)
Zhuhai ACCESS
AKM Meadville
Xpeedic
ASE Group
Simmtech Holdings
TTM
by Type
20 - 100 碌m
100 - 225 碌m
Other
by Application
Communication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
Other
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Coreless Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Coreless Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Coreless Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Coreless Packaging Substrate Market Overview
1.1 Product Definition
1.2 Coreless Packaging Substrate by Type
1.2.1 Global Coreless Packaging Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 20 - 100 碌m
1.2.3 100 - 225 碌m
1.2.4 Other
1.3 Coreless Packaging Substrate by Application
1.3.1 Global Coreless Packaging Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Communication
1.3.3 Automotive Electronics
1.3.4 Industrial
1.3.5 Consumer Electronics
1.3.6 Computing and Networking
1.3.7 Other
1.4 Global Market Growth Prospects
1.4.1 Global Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Coreless Packaging Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Coreless Packaging Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global Coreless Packaging Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Coreless Packaging Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global Coreless Packaging Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Coreless Packaging Substrate, Industry Ranking, 2023 VS 2024
2.4 Global Coreless Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Coreless Packaging Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Coreless Packaging Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Coreless Packaging Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Coreless Packaging Substrate, Date of Enter into This Industry
2.9 Coreless Packaging Substrate Market Competitive Situation and Trends
2.9.1 Coreless Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Coreless Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Coreless Packaging Substrate Production by Region
3.1 Global Coreless Packaging Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Coreless Packaging Substrate Production Value by Region (2020-2031)
3.2.1 Global Coreless Packaging Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Coreless Packaging Substrate by Region (2026-2031)
3.3 Global Coreless Packaging Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Coreless Packaging Substrate Production Volume by Region (2020-2031)
3.4.1 Global Coreless Packaging Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Coreless Packaging Substrate by Region (2026-2031)
3.5 Global Coreless Packaging Substrate Market Price Analysis by Region (2020-2025)
3.6 Global Coreless Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
4 Coreless Packaging Substrate Consumption by Region
4.1 Global Coreless Packaging Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Coreless Packaging Substrate Consumption by Region (2020-2031)
4.2.1 Global Coreless Packaging Substrate Consumption by Region (2020-2025)
4.2.2 Global Coreless Packaging Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Coreless Packaging Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Coreless Packaging Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Coreless Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Coreless Packaging Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Coreless Packaging Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Coreless Packaging Substrate Production by Type (2020-2031)
5.1.1 Global Coreless Packaging Substrate Production by Type (2020-2025)
5.1.2 Global Coreless Packaging Substrate Production by Type (2026-2031)
5.1.3 Global Coreless Packaging Substrate Production Market Share by Type (2020-2031)
5.2 Global Coreless Packaging Substrate Production Value by Type (2020-2031)
5.2.1 Global Coreless Packaging Substrate Production Value by Type (2020-2025)
5.2.2 Global Coreless Packaging Substrate Production Value by Type (2026-2031)
5.2.3 Global Coreless Packaging Substrate Production Value Market Share by Type (2020-2031)
5.3 Global Coreless Packaging Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global Coreless Packaging Substrate Production by Application (2020-2031)
6.1.1 Global Coreless Packaging Substrate Production by Application (2020-2025)
6.1.2 Global Coreless Packaging Substrate Production by Application (2026-2031)
6.1.3 Global Coreless Packaging Substrate Production Market Share by Application (2020-2031)
6.2 Global Coreless Packaging Substrate Production Value by Application (2020-2031)
6.2.1 Global Coreless Packaging Substrate Production Value by Application (2020-2025)
6.2.2 Global Coreless Packaging Substrate Production Value by Application (2026-2031)
6.2.3 Global Coreless Packaging Substrate Production Value Market Share by Application (2020-2031)
6.3 Global Coreless Packaging Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 SHINKO ELECTRIC INDUSTRIES CO., LTD.
7.1.1 SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Company Information
7.1.2 SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Product Portfolio
7.1.3 SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 SHINKO ELECTRIC INDUSTRIES CO., LTD. Main Business and Markets Served
7.1.5 SHINKO ELECTRIC INDUSTRIES CO., LTD. Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Coreless Packaging Substrate Company Information
7.2.2 Samsung Coreless Packaging Substrate Product Portfolio
7.2.3 Samsung Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 Panasonic Group
7.3.1 Panasonic Group Coreless Packaging Substrate Company Information
7.3.2 Panasonic Group Coreless Packaging Substrate Product Portfolio
7.3.3 Panasonic Group Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Panasonic Group Main Business and Markets Served
7.3.5 Panasonic Group Recent Developments/Updates
7.4 Sony
7.4.1 Sony Coreless Packaging Substrate Company Information
7.4.2 Sony Coreless Packaging Substrate Product Portfolio
7.4.3 Sony Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Sony Main Business and Markets Served
7.4.5 Sony Recent Developments/Updates
7.5 HITACHI CHEMICAL COMPANY, LTD.
7.5.1 HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Company Information
7.5.2 HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Product Portfolio
7.5.3 HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 HITACHI CHEMICAL COMPANY, LTD. Main Business and Markets Served
7.5.5 HITACHI CHEMICAL COMPANY, LTD. Recent Developments/Updates
7.6 TCI
7.6.1 TCI Coreless Packaging Substrate Company Information
7.6.2 TCI Coreless Packaging Substrate Product Portfolio
7.6.3 TCI Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 TCI Main Business and Markets Served
7.6.5 TCI Recent Developments/Updates
7.7 Korea Circuit
7.7.1 Korea Circuit Coreless Packaging Substrate Company Information
7.7.2 Korea Circuit Coreless Packaging Substrate Product Portfolio
7.7.3 Korea Circuit Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Korea Circuit Main Business and Markets Served
7.7.5 Korea Circuit Recent Developments/Updates
7.8 Founder
7.8.1 Founder Coreless Packaging Substrate Company Information
7.8.2 Founder Coreless Packaging Substrate Product Portfolio
7.8.3 Founder Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Founder Main Business and Markets Served
7.8.5 Founder Recent Developments/Updates
7.9 Unimicron
7.9.1 Unimicron Coreless Packaging Substrate Company Information
7.9.2 Unimicron Coreless Packaging Substrate Product Portfolio
7.9.3 Unimicron Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Unimicron Main Business and Markets Served
7.9.5 Unimicron Recent Developments/Updates
7.10 National Center for Advanced Packaging Co., Ltd.(NCAP China)
7.10.1 National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Company Information
7.10.2 National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Product Portfolio
7.10.3 National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 National Center for Advanced Packaging Co., Ltd.(NCAP China) Main Business and Markets Served
7.10.5 National Center for Advanced Packaging Co., Ltd.(NCAP China) Recent Developments/Updates
7.11 Zhuhai ACCESS
7.11.1 Zhuhai ACCESS Coreless Packaging Substrate Company Information
7.11.2 Zhuhai ACCESS Coreless Packaging Substrate Product Portfolio
7.11.3 Zhuhai ACCESS Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Zhuhai ACCESS Main Business and Markets Served
7.11.5 Zhuhai ACCESS Recent Developments/Updates
7.12 AKM Meadville
7.12.1 AKM Meadville Coreless Packaging Substrate Company Information
7.12.2 AKM Meadville Coreless Packaging Substrate Product Portfolio
7.12.3 AKM Meadville Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 AKM Meadville Main Business and Markets Served
7.12.5 AKM Meadville Recent Developments/Updates
7.13 Xpeedic
7.13.1 Xpeedic Coreless Packaging Substrate Company Information
7.13.2 Xpeedic Coreless Packaging Substrate Product Portfolio
7.13.3 Xpeedic Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Xpeedic Main Business and Markets Served
7.13.5 Xpeedic Recent Developments/Updates
7.14 ASE Group
7.14.1 ASE Group Coreless Packaging Substrate Company Information
7.14.2 ASE Group Coreless Packaging Substrate Product Portfolio
7.14.3 ASE Group Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 ASE Group Main Business and Markets Served
7.14.5 ASE Group Recent Developments/Updates
7.15 Simmtech Holdings
7.15.1 Simmtech Holdings Coreless Packaging Substrate Company Information
7.15.2 Simmtech Holdings Coreless Packaging Substrate Product Portfolio
7.15.3 Simmtech Holdings Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Simmtech Holdings Main Business and Markets Served
7.15.5 Simmtech Holdings Recent Developments/Updates
7.16 TTM
7.16.1 TTM Coreless Packaging Substrate Company Information
7.16.2 TTM Coreless Packaging Substrate Product Portfolio
7.16.3 TTM Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 TTM Main Business and Markets Served
7.16.5 TTM Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Coreless Packaging Substrate Industry Chain Analysis
8.2 Coreless Packaging Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Coreless Packaging Substrate Production Mode & Process Analysis
8.4 Coreless Packaging Substrate Sales and Marketing
8.4.1 Coreless Packaging Substrate Sales Channels
8.4.2 Coreless Packaging Substrate Distributors
8.5 Coreless Packaging Substrate Customer Analysis
9 Coreless Packaging Substrate Market Dynamics
9.1 Coreless Packaging Substrate Industry Trends
9.2 Coreless Packaging Substrate Market Drivers
9.3 Coreless Packaging Substrate Market Challenges
9.4 Coreless Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
SHINKO ELECTRIC INDUSTRIES CO., LTD.
Samsung
Panasonic Group
Sony
HITACHI CHEMICAL COMPANY, LTD.
TCI
Korea Circuit
Founder
Unimicron
National Center for Advanced Packaging Co., Ltd.(NCAP China)
Zhuhai ACCESS
AKM Meadville
Xpeedic
ASE Group
Simmtech Holdings
TTM
听
听
*If Applicable.
