Global Discrete Device Die Bonder Market Research Report 2024

Publication ID:

PB511240237

Publication Date:

November 20, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global Discrete Device Die Bonder market was valued at US$ 312 million in 2023 and is anticipated to reach US$ 486 million by 2030, witnessing a CAGR of 6.3% during the forecast period 2024-2030.
The die bonder is the core equipment of the die attach process in the packaging and testing process, and plays a vital role. It is responsible for accurately grabbing the chip on the cut wafer and placing it securely on the corresponding die flag position of the substrate, and achieving a firm bond between the chip and the substrate through silver glue (Epoxy). The die bonder, with its high-speed and high-precision performance, completes a series of key steps such as positioning, alignment, flip-chip and continuous mounting during the component placement process.
The main types of die bonders are IC die bonders, discrete device die bonders, and LED die bonders. Discrete device die bonders are equipment specifically used for IGBT modules and silicon carbide power devices.
North American market for Discrete Device Die Bonder is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Discrete Device Die Bonder is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Discrete Device Die Bonder include ASMPT, BESI, Canon Machinery, Quick Intelligent Equipment, Shenzhen Liande Automatic Equipment, Notting Intelligent Technology, Shenzhen Xinyichang Technology, Shenzhen S-king Intelligent Equipment, Shenzhen Microview, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Discrete Device Die Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Discrete Device Die Bonder.
The Discrete Device Die Bonder market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Discrete Device Die Bonder market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Discrete Device Die Bonder manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASMPT
BESI
Canon Machinery
Quick Intelligent Equipment
Shenzhen Liande Automatic Equipment
Notting Intelligent Technology
Shenzhen Xinyichang Technology
Shenzhen S-king Intelligent Equipment
Shenzhen Microview
by Type
Fully-automatic
Semi-automatic
by Application
IGBT Module
SiC Power Device
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Discrete Device Die Bonder manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Discrete Device Die Bonder by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Discrete Device Die Bonder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Discrete Device Die Bonder Market Overview
1.1 Product Definition
1.2 Discrete Device Die Bonder by Type
1.2.1 Global Discrete Device Die Bonder Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Fully-automatic
1.2.3 Semi-automatic
1.3 Discrete Device Die Bonder by Application
1.3.1 Global Discrete Device Die Bonder Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IGBT Module
1.3.3 SiC Power Device
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Discrete Device Die Bonder Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Discrete Device Die Bonder Production Estimates and Forecasts (2019-2030)
1.4.4 Global Discrete Device Die Bonder Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Discrete Device Die Bonder Production Market Share by Manufacturers (2019-2024)
2.2 Global Discrete Device Die Bonder Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Discrete Device Die Bonder, Industry Ranking, 2022 VS 2023
2.4 Global Discrete Device Die Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Discrete Device Die Bonder Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Discrete Device Die Bonder, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Discrete Device Die Bonder, Product Type & Application
2.8 Global Key Manufacturers of Discrete Device Die Bonder, Date of Enter into This Industry
2.9 Global Discrete Device Die Bonder Market Competitive Situation and Trends
2.9.1 Global Discrete Device Die Bonder Market Concentration Rate
2.9.2 Global 5 and 10 Largest Discrete Device Die Bonder Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Discrete Device Die Bonder Production by Region
3.1 Global Discrete Device Die Bonder Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Discrete Device Die Bonder Production Value by Region (2019-2030)
3.2.1 Global Discrete Device Die Bonder Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Discrete Device Die Bonder by Region (2025-2030)
3.3 Global Discrete Device Die Bonder Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Discrete Device Die Bonder Production by Region (2019-2030)
3.4.1 Global Discrete Device Die Bonder Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Discrete Device Die Bonder by Region (2025-2030)
3.5 Global Discrete Device Die Bonder Market Price Analysis by Region (2019-2024)
3.6 Global Discrete Device Die Bonder Production and Value, Year-over-Year Growth
3.6.1 North America Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)
4 Discrete Device Die Bonder Consumption by Region
4.1 Global Discrete Device Die Bonder Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Discrete Device Die Bonder Consumption by Region (2019-2030)
4.2.1 Global Discrete Device Die Bonder Consumption by Region (2019-2030)
4.2.2 Global Discrete Device Die Bonder Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Discrete Device Die Bonder Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Discrete Device Die Bonder Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Discrete Device Die Bonder Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Discrete Device Die Bonder Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Discrete Device Die Bonder Production by Type (2019-2030)
5.1.1 Global Discrete Device Die Bonder Production by Type (2019-2024)
5.1.2 Global Discrete Device Die Bonder Production by Type (2025-2030)
5.1.3 Global Discrete Device Die Bonder Production Market Share by Type (2019-2030)
5.2 Global Discrete Device Die Bonder Production Value by Type (2019-2030)
5.2.1 Global Discrete Device Die Bonder Production Value by Type (2019-2024)
5.2.2 Global Discrete Device Die Bonder Production Value by Type (2025-2030)
5.2.3 Global Discrete Device Die Bonder Production Value Market Share by Type (2019-2030)
5.3 Global Discrete Device Die Bonder Price by Type (2019-2030)
6 Segment by Application
6.1 Global Discrete Device Die Bonder Production by Application (2019-2030)
6.1.1 Global Discrete Device Die Bonder Production by Application (2019-2024)
6.1.2 Global Discrete Device Die Bonder Production by Application (2025-2030)
6.1.3 Global Discrete Device Die Bonder Production Market Share by Application (2019-2030)
6.2 Global Discrete Device Die Bonder Production Value by Application (2019-2030)
6.2.1 Global Discrete Device Die Bonder Production Value by Application (2019-2024)
6.2.2 Global Discrete Device Die Bonder Production Value by Application (2025-2030)
6.2.3 Global Discrete Device Die Bonder Production Value Market Share by Application (2019-2030)
6.3 Global Discrete Device Die Bonder Price by Application (2019-2030)
7 Key Companies Profiled
7.1 ASMPT
7.1.1 ASMPT Discrete Device Die Bonder Company Information
7.1.2 ASMPT Discrete Device Die Bonder Product Portfolio
7.1.3 ASMPT Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.1.4 ASMPT Main Business and Markets Served
7.1.5 ASMPT Recent Developments/Updates
7.2 BESI
7.2.1 BESI Discrete Device Die Bonder Company Information
7.2.2 BESI Discrete Device Die Bonder Product Portfolio
7.2.3 BESI Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.2.4 BESI Main Business and Markets Served
7.2.5 BESI Recent Developments/Updates
7.3 Canon Machinery
7.3.1 Canon Machinery Discrete Device Die Bonder Company Information
7.3.2 Canon Machinery Discrete Device Die Bonder Product Portfolio
7.3.3 Canon Machinery Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Canon Machinery Main Business and Markets Served
7.3.5 Canon Machinery Recent Developments/Updates
7.4 Quick Intelligent Equipment
7.4.1 Quick Intelligent Equipment Discrete Device Die Bonder Company Information
7.4.2 Quick Intelligent Equipment Discrete Device Die Bonder Product Portfolio
7.4.3 Quick Intelligent Equipment Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Quick Intelligent Equipment Main Business and Markets Served
7.4.5 Quick Intelligent Equipment Recent Developments/Updates
7.5 Shenzhen Liande Automatic Equipment
7.5.1 Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Company Information
7.5.2 Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Product Portfolio
7.5.3 Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Shenzhen Liande Automatic Equipment Main Business and Markets Served
7.5.5 Shenzhen Liande Automatic Equipment Recent Developments/Updates
7.6 Notting Intelligent Technology
7.6.1 Notting Intelligent Technology Discrete Device Die Bonder Company Information
7.6.2 Notting Intelligent Technology Discrete Device Die Bonder Product Portfolio
7.6.3 Notting Intelligent Technology Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Notting Intelligent Technology Main Business and Markets Served
7.6.5 Notting Intelligent Technology Recent Developments/Updates
7.7 Shenzhen Xinyichang Technology
7.7.1 Shenzhen Xinyichang Technology Discrete Device Die Bonder Company Information
7.7.2 Shenzhen Xinyichang Technology Discrete Device Die Bonder Product Portfolio
7.7.3 Shenzhen Xinyichang Technology Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Shenzhen Xinyichang Technology Main Business and Markets Served
7.7.5 Shenzhen Xinyichang Technology Recent Developments/Updates
7.8 Shenzhen S-king Intelligent Equipment
7.8.1 Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Company Information
7.8.2 Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Product Portfolio
7.8.3 Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Shenzhen S-king Intelligent Equipment Main Business and Markets Served
7.8.5 Shenzhen S-king Intelligent Equipment Recent Developments/Updates
7.9 Shenzhen Microview
7.9.1 Shenzhen Microview Discrete Device Die Bonder Company Information
7.9.2 Shenzhen Microview Discrete Device Die Bonder Product Portfolio
7.9.3 Shenzhen Microview Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shenzhen Microview Main Business and Markets Served
7.9.5 Shenzhen Microview Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Discrete Device Die Bonder Industry Chain Analysis
8.2 Discrete Device Die Bonder Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Discrete Device Die Bonder Production Mode & Process
8.4 Discrete Device Die Bonder Sales and Marketing
8.4.1 Discrete Device Die Bonder Sales Channels
8.4.2 Discrete Device Die Bonder Distributors
8.5 Discrete Device Die Bonder Customers
9 Discrete Device Die Bonder Market Dynamics
9.1 Discrete Device Die Bonder Industry Trends
9.2 Discrete Device Die Bonder Market Drivers
9.3 Discrete Device Die Bonder Market Challenges
9.4 Discrete Device Die Bonder Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

ASMPT
BESI
Canon Machinery
Quick Intelligent Equipment
Shenzhen Liande Automatic Equipment
Notting Intelligent Technology
Shenzhen Xinyichang Technology
Shenzhen S-king Intelligent Equipment
Shenzhen Microview

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