The semiconductor industry chain can be divided into three major links from top to bottom: design, manufacturing, and packaging and testing. Among them, packaging and testing is the last process in the manufacture of integrated circuit products. The process of packaging and testing wafers to obtain independent chips. Packaging and testing mainly includes two links of packaging and testing. Due to the relatively low added value of packaging and testing, high labor intensity, and relatively low entry barriers, the degree of localization of packaging and testing is relatively high. This report mainly studies the packaging and testing of display driver chips.
Market Analysis and Insights: Global Display Driver Chip Packaging and Testing Market
The global Display Driver Chip Packaging and Testing market is projected to grow from US$ 3321 million in 2024 to US$ 4928.3 million by 2030, at a Compound Annual Growth Rate (CAGR) of 6.8% during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Covers:
This report presents an overview of global market for Display Driver Chip Packaging and Testing market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Display Driver Chip Packaging and Testing, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Display Driver Chip Packaging and Testing, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Display Driver Chip Packaging and Testing revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Display Driver Chip Packaging and Testing market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Display Driver Chip Packaging and Testing revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
Segment by Type
Chip Packaging
Chip Testing
Segment by Application
Communication
Consumer Electronics
Vehicle Electronics
Aerospace
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Display Driver Chip Packaging and Testing in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Display Driver Chip Packaging and Testing companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Display Driver Chip Packaging and Testing revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Display Driver Chip Packaging and Testing Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Chip Packaging
1.2.3 Chip Testing
1.3 Market by Application
1.3.1 Global Display Driver Chip Packaging and Testing Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Communication
1.3.3 Consumer Electronics
1.3.4 Vehicle Electronics
1.3.5 Aerospace
1.3.6 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Display Driver Chip Packaging and Testing Market Perspective (2019-2030)
2.2 Global Display Driver Chip Packaging and Testing Growth Trends by Region
2.2.1 Display Driver Chip Packaging and Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Display Driver Chip Packaging and Testing Historic Market Size by Region (2019-2024)
2.2.3 Display Driver Chip Packaging and Testing Forecasted Market Size by Region (2025-2030)
2.3 Display Driver Chip Packaging and Testing Market Dynamics
2.3.1 Display Driver Chip Packaging and Testing Industry Trends
2.3.2 Display Driver Chip Packaging and Testing Market Drivers
2.3.3 Display Driver Chip Packaging and Testing Market Challenges
2.3.4 Display Driver Chip Packaging and Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Display Driver Chip Packaging and Testing by Players
3.1.1 Global Display Driver Chip Packaging and Testing Revenue by Players (2019-2024)
3.1.2 Global Display Driver Chip Packaging and Testing Revenue Market Share by Players (2019-2024)
3.2 Global Display Driver Chip Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Display Driver Chip Packaging and Testing, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Display Driver Chip Packaging and Testing Market Concentration Ratio
3.4.1 Global Display Driver Chip Packaging and Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Display Driver Chip Packaging and Testing Revenue in 2023
3.5 Global Key Players of Display Driver Chip Packaging and Testing Head office and Area Served
3.6 Global Key Players of Display Driver Chip Packaging and Testing, Product and Application
3.7 Global Key Players of Display Driver Chip Packaging and Testing, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Display Driver Chip Packaging and Testing Breakdown Data by Type
4.1 Global Display Driver Chip Packaging and Testing Historic Market Size by Type (2019-2024)
4.2 Global Display Driver Chip Packaging and Testing Forecasted Market Size by Type (2025-2030)
5 Display Driver Chip Packaging and Testing Breakdown Data by Application
5.1 Global Display Driver Chip Packaging and Testing Historic Market Size by Application (2019-2024)
5.2 Global Display Driver Chip Packaging and Testing Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Display Driver Chip Packaging and Testing Market Size (2019-2030)
6.2 North America Display Driver Chip Packaging and Testing Market Size by Type
6.2.1 North America Display Driver Chip Packaging and Testing Market Size by Type (2019-2024)
6.2.2 North America Display Driver Chip Packaging and Testing Market Size by Type (2025-2030)
6.2.3 North America Display Driver Chip Packaging and Testing Market Share by Type (2019-2030)
6.3 North America Display Driver Chip Packaging and Testing Market Size by Application
6.3.1 North America Display Driver Chip Packaging and Testing Market Size by Application (2019-2024)
6.3.2 North America Display Driver Chip Packaging and Testing Market Size by Application (2025-2030)
6.3.3 North America Display Driver Chip Packaging and Testing Market Share by Application (2019-2030)
6.4 North America Display Driver Chip Packaging and Testing Market Size by Country
6.4.1 North America Display Driver Chip Packaging and Testing Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Display Driver Chip Packaging and Testing Market Size by Country (2019-2024)
6.4.3 North America Display Driver Chip Packaging and Testing Market Size by Country (2025-2030)
6.4.4 United States
6.4.5 Canada
7 Europe
7.1 Europe Display Driver Chip Packaging and Testing Market Size (2019-2030)
7.2 Europe Display Driver Chip Packaging and Testing Market Size by Type
7.2.1 Europe Display Driver Chip Packaging and Testing Market Size by Type (2019-2024)
7.2.2 Europe Display Driver Chip Packaging and Testing Market Size by Type (2025-2030)
7.2.3 Europe Display Driver Chip Packaging and Testing Market Share by Type (2019-2030)
7.3 Europe Display Driver Chip Packaging and Testing Market Size by Application
7.3.1 Europe Display Driver Chip Packaging and Testing Market Size by Application (2019-2024)
7.3.2 Europe Display Driver Chip Packaging and Testing Market Size by Application (2025-2030)
7.3.3 Europe Display Driver Chip Packaging and Testing Market Share by Application (2019-2030)
7.4 Europe Display Driver Chip Packaging and Testing Market Size by Country
7.4.1 Europe Display Driver Chip Packaging and Testing Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Display Driver Chip Packaging and Testing Market Size by Country (2019-2024)
7.4.3 Europe Display Driver Chip Packaging and Testing Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Display Driver Chip Packaging and Testing Market Size (2019-2030)
8.2 China Display Driver Chip Packaging and Testing Market Size by Type
8.2.1 China Display Driver Chip Packaging and Testing Market Size by Type (2019-2024)
8.2.2 China Display Driver Chip Packaging and Testing Market Size by Type (2025-2030)
8.2.3 China Display Driver Chip Packaging and Testing Market Share by Type (2019-2030)
8.3 China Display Driver Chip Packaging and Testing Market Size by Application
8.3.1 China Display Driver Chip Packaging and Testing Market Size by Application (2019-2024)
8.3.2 China Display Driver Chip Packaging and Testing Market Size by Application (2025-2030)
8.3.3 China Display Driver Chip Packaging and Testing Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Display Driver Chip Packaging and Testing Market Size (2019-2030)
9.2 Asia Display Driver Chip Packaging and Testing Market Size by Type
9.2.1 Asia Display Driver Chip Packaging and Testing Market Size by Type (2019-2024)
9.2.2 Asia Display Driver Chip Packaging and Testing Market Size by Type (2025-2030)
9.2.3 Asia Display Driver Chip Packaging and Testing Market Share by Type (2019-2030)
9.3 Asia Display Driver Chip Packaging and Testing Market Size by Application
9.3.1 Asia Display Driver Chip Packaging and Testing Market Size by Application (2019-2024)
9.3.2 Asia Display Driver Chip Packaging and Testing Market Size by Application (2025-2030)
9.3.3 Asia Display Driver Chip Packaging and Testing Market Share by Application (2019-2030)
9.4 Asia Display Driver Chip Packaging and Testing Market Size by Region
9.4.1 Asia Display Driver Chip Packaging and Testing Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Display Driver Chip Packaging and Testing Market Size by Region (2019-2024)
9.4.3 Asia Display Driver Chip Packaging and Testing Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Type
10.2.1 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Application
10.3.1 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Country
10.4.1 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Display Driver Chip Packaging and Testing Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Steco(LG)
11.1.1 Steco(LG) Company Details
11.1.2 Steco(LG) Business Overview
11.1.3 Steco(LG) Display Driver Chip Packaging and Testing Introduction
11.1.4 Steco(LG) Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.1.5 Steco(LG) Recent Developments
11.2 LB-Lusem(Samsung)
11.2.1 LB-Lusem(Samsung) Company Details
11.2.2 LB-Lusem(Samsung) Business Overview
11.2.3 LB-Lusem(Samsung) Display Driver Chip Packaging and Testing Introduction
11.2.4 LB-Lusem(Samsung) Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.2.5 LB-Lusem(Samsung) Recent Developments
11.3 Chipbond Technology Corporation
11.3.1 Chipbond Technology Corporation Company Details
11.3.2 Chipbond Technology Corporation Business Overview
11.3.3 Chipbond Technology Corporation Display Driver Chip Packaging and Testing Introduction
11.3.4 Chipbond Technology Corporation Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.3.5 Chipbond Technology Corporation Recent Developments
11.4 IMOS-ChipMOS TECHNOLOGIES INC.
11.4.1 IMOS-ChipMOS TECHNOLOGIES INC. Company Details
11.4.2 IMOS-ChipMOS TECHNOLOGIES INC. Business Overview
11.4.3 IMOS-ChipMOS TECHNOLOGIES INC. Display Driver Chip Packaging and Testing Introduction
11.4.4 IMOS-ChipMOS TECHNOLOGIES INC. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.4.5 IMOS-ChipMOS TECHNOLOGIES INC. Recent Developments
11.5 Hefei Chipmore Technology Co.,Ltd.
11.5.1 Hefei Chipmore Technology Co.,Ltd. Company Details
11.5.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
11.5.3 Hefei Chipmore Technology Co.,Ltd. Display Driver Chip Packaging and Testing Introduction
11.5.4 Hefei Chipmore Technology Co.,Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.5.5 Hefei Chipmore Technology Co.,Ltd. Recent Developments
11.6 Union Semiconductor (Hefei) Co., Ltd.
11.6.1 Union Semiconductor (Hefei) Co., Ltd. Company Details
11.6.2 Union Semiconductor (Hefei) Co., Ltd. Business Overview
11.6.3 Union Semiconductor (Hefei) Co., Ltd. Display Driver Chip Packaging and Testing Introduction
11.6.4 Union Semiconductor (Hefei) Co., Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.6.5 Union Semiconductor (Hefei) Co., Ltd. Recent Developments
11.7 Jiangsu Napace Semiconductor Co., Ltd.
11.7.1 Jiangsu Napace Semiconductor Co., Ltd. Company Details
11.7.2 Jiangsu Napace Semiconductor Co., Ltd. Business Overview
11.7.3 Jiangsu Napace Semiconductor Co., Ltd. Display Driver Chip Packaging and Testing Introduction
11.7.4 Jiangsu Napace Semiconductor Co., Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.7.5 Jiangsu Napace Semiconductor Co., Ltd. Recent Developments
11.8 Tongfu Microelectronics Co.,ltd.
11.8.1 Tongfu Microelectronics Co.,ltd. Company Details
11.8.2 Tongfu Microelectronics Co.,ltd. Business Overview
11.8.3 Tongfu Microelectronics Co.,ltd. Display Driver Chip Packaging and Testing Introduction
11.8.4 Tongfu Microelectronics Co.,ltd. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.8.5 Tongfu Microelectronics Co.,ltd. Recent Developments
11.9 JCET Group Co.,Ltd.
11.9.1 JCET Group Co.,Ltd. Company Details
11.9.2 JCET Group Co.,Ltd. Business Overview
11.9.3 JCET Group Co.,Ltd. Display Driver Chip Packaging and Testing Introduction
11.9.4 JCET Group Co.,Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.9.5 JCET Group Co.,Ltd. Recent Developments
11.10 ADVANCED SEMICONDUCTOR ENGINEERING, INC.
11.10.1 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Company Details
11.10.2 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Business Overview
11.10.3 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Display Driver Chip Packaging and Testing Introduction
11.10.4 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.10.5 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Recent Developments
11.11 Hitech Semiconductor (Wuxi) Co., Ltd.
11.11.1 Hitech Semiconductor (Wuxi) Co., Ltd. Company Details
11.11.2 Hitech Semiconductor (Wuxi) Co., Ltd. Business Overview
11.11.3 Hitech Semiconductor (Wuxi) Co., Ltd. Display Driver Chip Packaging and Testing Introduction
11.11.4 Hitech Semiconductor (Wuxi) Co., Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.11.5 Hitech Semiconductor (Wuxi) Co., Ltd. Recent Developments
11.12 Hefei Chipmore Technology
11.12.1 Hefei Chipmore Technology Company Details
11.12.2 Hefei Chipmore Technology Business Overview
11.12.3 Hefei Chipmore Technology Display Driver Chip Packaging and Testing Introduction
11.12.4 Hefei Chipmore Technology Revenue in Display Driver Chip Packaging and Testing Business (2019-2024)
11.12.5 Hefei Chipmore Technology Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
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*If Applicable.
