Global Dual in-Line Package (DIP) Socket Market Research Report 2023

Publication ID:

PB510234054

Publication Date:

October 24, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Electricity [2]

Energy & Utilities [3]

Description:

A DIP socket is an electronic accessory used to mount dual in-line package (DIP) components on printed circuit boards (PCBs). These sockets are either square or rectangular in shape and feature two rows of pins on the underside of the socket connected to corresponding push-in mountings on the upper side. The pins are placed through holes in the PCB and soldered onto the tracks etched into the board surface. The component is then pushed into the socket mounting points, securing a good electrical connection between it and the board circuit. The DIP socket is typically used to facilitate easy, non-destructive replacement of DIP components, and are available in single unit form or in strips, which can be cut to size as required.
The global Dual in-Line Package (DIP) Socket market is projected to reach US$ 1489.5 million in 2029, increasing from US$ 924 million in 2022, with the CAGR of 7.1% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Dual in-Line Package (DIP) Socket 91制片厂.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Dual in-Line Package (DIP) Socket market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
TE Connectivity
3M
Aries Electronics
Preci-dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics
Segment by Type
Open-Frame Styles
Closed-Frame Styles
Segment by Application
Consumer Electronics
Automotive
Defense
Medical
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Dual in-Line Package (DIP) Socket report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers鈥� Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers鈥� Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Dual in-Line Package (DIP) Socket Market Overview
1.1 Product Definition
1.2 Dual in-Line Package (DIP) Socket Segment by Type
1.2.1 Global Dual in-Line Package (DIP) Socket Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Open-Frame Styles
1.2.3 Closed-Frame Styles
1.3 Dual in-Line Package (DIP) Socket Segment by Application
1.3.1 Global Dual in-Line Package (DIP) Socket Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Defense
1.3.5 Medical
1.3.6 Other
1.4 Global Market Growth Prospects
1.4.1 Global Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Dual in-Line Package (DIP) Socket Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Dual in-Line Package (DIP) Socket Production Estimates and Forecasts (2018-2029)
1.4.4 Global Dual in-Line Package (DIP) Socket Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Dual in-Line Package (DIP) Socket Production Market Share by Manufacturers (2018-2023)
2.2 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Dual in-Line Package (DIP) Socket, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Dual in-Line Package (DIP) Socket Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Dual in-Line Package (DIP) Socket Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Product Offered and Application
2.8 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Date of Enter into This Industry
2.9 Dual in-Line Package (DIP) Socket Market Competitive Situation and Trends
2.9.1 Dual in-Line Package (DIP) Socket Market Concentration Rate
2.9.2 Global 5 and 10 Largest Dual in-Line Package (DIP) Socket Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Dual in-Line Package (DIP) Socket Production by Region
3.1 Global Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Dual in-Line Package (DIP) Socket Production Value by Region (2018-2029)
3.2.1 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Dual in-Line Package (DIP) Socket by Region (2024-2029)
3.3 Global Dual in-Line Package (DIP) Socket Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Dual in-Line Package (DIP) Socket Production by Region (2018-2029)
3.4.1 Global Dual in-Line Package (DIP) Socket Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Dual in-Line Package (DIP) Socket by Region (2024-2029)
3.5 Global Dual in-Line Package (DIP) Socket Market Price Analysis by Region (2018-2023)
3.6 Global Dual in-Line Package (DIP) Socket Production and Value, Year-over-Year Growth
3.6.1 North America Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2018-2029)
4 Dual in-Line Package (DIP) Socket Consumption by Region
4.1 Global Dual in-Line Package (DIP) Socket Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Dual in-Line Package (DIP) Socket Consumption by Region (2018-2029)
4.2.1 Global Dual in-Line Package (DIP) Socket Consumption by Region (2018-2023)
4.2.2 Global Dual in-Line Package (DIP) Socket Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Dual in-Line Package (DIP) Socket Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Dual in-Line Package (DIP) Socket Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Dual in-Line Package (DIP) Socket Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Dual in-Line Package (DIP) Socket Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Dual in-Line Package (DIP) Socket Production by Type (2018-2029)
5.1.1 Global Dual in-Line Package (DIP) Socket Production by Type (2018-2023)
5.1.2 Global Dual in-Line Package (DIP) Socket Production by Type (2024-2029)
5.1.3 Global Dual in-Line Package (DIP) Socket Production Market Share by Type (2018-2029)
5.2 Global Dual in-Line Package (DIP) Socket Production Value by Type (2018-2029)
5.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Type (2018-2023)
5.2.2 Global Dual in-Line Package (DIP) Socket Production Value by Type (2024-2029)
5.2.3 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Type (2018-2029)
5.3 Global Dual in-Line Package (DIP) Socket Price by Type (2018-2029)
6 Segment by Application
6.1 Global Dual in-Line Package (DIP) Socket Production by Application (2018-2029)
6.1.1 Global Dual in-Line Package (DIP) Socket Production by Application (2018-2023)
6.1.2 Global Dual in-Line Package (DIP) Socket Production by Application (2024-2029)
6.1.3 Global Dual in-Line Package (DIP) Socket Production Market Share by Application (2018-2029)
6.2 Global Dual in-Line Package (DIP) Socket Production Value by Application (2018-2029)
6.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Application (2018-2023)
6.2.2 Global Dual in-Line Package (DIP) Socket Production Value by Application (2024-2029)
6.2.3 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Application (2018-2029)
6.3 Global Dual in-Line Package (DIP) Socket Price by Application (2018-2029)
7 Key Companies Profiled
7.1 TE Connectivity
7.1.1 TE Connectivity Dual in-Line Package (DIP) Socket Corporation Information
7.1.2 TE Connectivity Dual in-Line Package (DIP) Socket Product Portfolio
7.1.3 TE Connectivity Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.1.4 TE Connectivity Main Business and Markets Served
7.1.5 TE Connectivity Recent Developments/Updates
7.2 3M
7.2.1 3M Dual in-Line Package (DIP) Socket Corporation Information
7.2.2 3M Dual in-Line Package (DIP) Socket Product Portfolio
7.2.3 3M Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.2.4 3M Main Business and Markets Served
7.2.5 3M Recent Developments/Updates
7.3 Aries Electronics
7.3.1 Aries Electronics Dual in-Line Package (DIP) Socket Corporation Information
7.3.2 Aries Electronics Dual in-Line Package (DIP) Socket Product Portfolio
7.3.3 Aries Electronics Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Aries Electronics Main Business and Markets Served
7.3.5 Aries Electronics Recent Developments/Updates
7.4 Preci-dip
7.4.1 Preci-dip Dual in-Line Package (DIP) Socket Corporation Information
7.4.2 Preci-dip Dual in-Line Package (DIP) Socket Product Portfolio
7.4.3 Preci-dip Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Preci-dip Main Business and Markets Served
7.4.5 Preci-dip Recent Developments/Updates
7.5 Mill-Max
7.5.1 Mill-Max Dual in-Line Package (DIP) Socket Corporation Information
7.5.2 Mill-Max Dual in-Line Package (DIP) Socket Product Portfolio
7.5.3 Mill-Max Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Mill-Max Main Business and Markets Served
7.5.5 Mill-Max Recent Developments/Updates
7.6 Amphenol
7.6.1 Amphenol Dual in-Line Package (DIP) Socket Corporation Information
7.6.2 Amphenol Dual in-Line Package (DIP) Socket Product Portfolio
7.6.3 Amphenol Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Amphenol Main Business and Markets Served
7.6.5 Amphenol Recent Developments/Updates
7.7 Harwin
7.7.1 Harwin Dual in-Line Package (DIP) Socket Corporation Information
7.7.2 Harwin Dual in-Line Package (DIP) Socket Product Portfolio
7.7.3 Harwin Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Harwin Main Business and Markets Served
7.7.5 Harwin Recent Developments/Updates
7.8 Molex
7.8.1 Molex Dual in-Line Package (DIP) Socket Corporation Information
7.8.2 Molex Dual in-Line Package (DIP) Socket Product Portfolio
7.8.3 Molex Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Molex Main Business and Markets Served
7.7.5 Molex Recent Developments/Updates
7.9 Samtec
7.9.1 Samtec Dual in-Line Package (DIP) Socket Corporation Information
7.9.2 Samtec Dual in-Line Package (DIP) Socket Product Portfolio
7.9.3 Samtec Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Samtec Main Business and Markets Served
7.9.5 Samtec Recent Developments/Updates
7.10 Omron
7.10.1 Omron Dual in-Line Package (DIP) Socket Corporation Information
7.10.2 Omron Dual in-Line Package (DIP) Socket Product Portfolio
7.10.3 Omron Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Omron Main Business and Markets Served
7.10.5 Omron Recent Developments/Updates
7.11 Yamaichi Electronics
7.11.1 Yamaichi Electronics Dual in-Line Package (DIP) Socket Corporation Information
7.11.2 Yamaichi Electronics Dual in-Line Package (DIP) Socket Product Portfolio
7.11.3 Yamaichi Electronics Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Yamaichi Electronics Main Business and Markets Served
7.11.5 Yamaichi Electronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Dual in-Line Package (DIP) Socket Industry Chain Analysis
8.2 Dual in-Line Package (DIP) Socket Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Dual in-Line Package (DIP) Socket Production Mode & Process
8.4 Dual in-Line Package (DIP) Socket Sales and Marketing
8.4.1 Dual in-Line Package (DIP) Socket Sales Channels
8.4.2 Dual in-Line Package (DIP) Socket Distributors
8.5 Dual in-Line Package (DIP) Socket Customers
9 Dual in-Line Package (DIP) Socket Market Dynamics
9.1 Dual in-Line Package (DIP) Socket Industry Trends
9.2 Dual in-Line Package (DIP) Socket Market Drivers
9.3 Dual in-Line Package (DIP) Socket Market Challenges
9.4 Dual in-Line Package (DIP) Socket Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

TE Connectivity
3M
Aries Electronics
Preci-dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics

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