The global market for Dual in-Line Package (DIP) Socket was valued at US$ 1050 million in the year 2024 and is projected to reach a revised size of US$ 1686 million by 2031, growing at a CAGR of 7.1% during the forecast period.
A DIP socket is an electronic accessory used to mount dual in-line package (DIP) components on printed circuit boards (PCBs). These sockets are either square or rectangular in shape and feature two rows of pins on the underside of the socket connected to corresponding push-in mountings on the upper side. The pins are placed through holes in the PCB and soldered onto the tracks etched into the board surface. The component is then pushed into the socket mounting points, securing a good electrical connection between it and the board circuit. The DIP socket is typically used to facilitate easy, non-destructive replacement of DIP components, and are available in single unit form or in strips, which can be cut to size as required.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Dual in-Line Package (DIP) Socket, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Dual in-Line Package (DIP) Socket.
The Dual in-Line Package (DIP) Socket market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Dual in-Line Package (DIP) Socket market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Dual in-Line Package (DIP) Socket manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TE Connectivity
3M
Aries Electronics
Preci-dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics
by Type
Open-Frame Styles
Closed-Frame Styles
by Application
Consumer Electronics
Automotive
Defense
Medical
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Dual in-Line Package (DIP) Socket manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Dual in-Line Package (DIP) Socket by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Dual in-Line Package (DIP) Socket in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Dual in-Line Package (DIP) Socket Market Overview
1.1 Product Definition
1.2 Dual in-Line Package (DIP) Socket by Type
1.2.1 Global Dual in-Line Package (DIP) Socket Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Open-Frame Styles
1.2.3 Closed-Frame Styles
1.3 Dual in-Line Package (DIP) Socket by Application
1.3.1 Global Dual in-Line Package (DIP) Socket Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Defense
1.3.5 Medical
1.3.6 Other
1.4 Global Market Growth Prospects
1.4.1 Global Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Dual in-Line Package (DIP) Socket Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Dual in-Line Package (DIP) Socket Production Estimates and Forecasts (2020-2031)
1.4.4 Global Dual in-Line Package (DIP) Socket Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Dual in-Line Package (DIP) Socket Production Market Share by Manufacturers (2020-2025)
2.2 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Dual in-Line Package (DIP) Socket, Industry Ranking, 2023 VS 2024
2.4 Global Dual in-Line Package (DIP) Socket Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Dual in-Line Package (DIP) Socket Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Product Offered and Application
2.8 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Date of Enter into This Industry
2.9 Dual in-Line Package (DIP) Socket Market Competitive Situation and Trends
2.9.1 Dual in-Line Package (DIP) Socket Market Concentration Rate
2.9.2 Global 5 and 10 Largest Dual in-Line Package (DIP) Socket Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Dual in-Line Package (DIP) Socket Production by Region
3.1 Global Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Dual in-Line Package (DIP) Socket Production Value by Region (2020-2031)
3.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Dual in-Line Package (DIP) Socket by Region (2026-2031)
3.3 Global Dual in-Line Package (DIP) Socket Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Dual in-Line Package (DIP) Socket Production Volume by Region (2020-2031)
3.4.1 Global Dual in-Line Package (DIP) Socket Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Dual in-Line Package (DIP) Socket by Region (2026-2031)
3.5 Global Dual in-Line Package (DIP) Socket Market Price Analysis by Region (2020-2025)
3.6 Global Dual in-Line Package (DIP) Socket Production and Value, Year-over-Year Growth
3.6.1 North America Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
4 Dual in-Line Package (DIP) Socket Consumption by Region
4.1 Global Dual in-Line Package (DIP) Socket Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Dual in-Line Package (DIP) Socket Consumption by Region (2020-2031)
4.2.1 Global Dual in-Line Package (DIP) Socket Consumption by Region (2020-2025)
4.2.2 Global Dual in-Line Package (DIP) Socket Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Dual in-Line Package (DIP) Socket Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Dual in-Line Package (DIP) Socket Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Dual in-Line Package (DIP) Socket Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Dual in-Line Package (DIP) Socket Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Dual in-Line Package (DIP) Socket Production by Type (2020-2031)
5.1.1 Global Dual in-Line Package (DIP) Socket Production by Type (2020-2025)
5.1.2 Global Dual in-Line Package (DIP) Socket Production by Type (2026-2031)
5.1.3 Global Dual in-Line Package (DIP) Socket Production Market Share by Type (2020-2031)
5.2 Global Dual in-Line Package (DIP) Socket Production Value by Type (2020-2031)
5.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Type (2020-2025)
5.2.2 Global Dual in-Line Package (DIP) Socket Production Value by Type (2026-2031)
5.2.3 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Type (2020-2031)
5.3 Global Dual in-Line Package (DIP) Socket Price by Type (2020-2031)
6 Segment by Application
6.1 Global Dual in-Line Package (DIP) Socket Production by Application (2020-2031)
6.1.1 Global Dual in-Line Package (DIP) Socket Production by Application (2020-2025)
6.1.2 Global Dual in-Line Package (DIP) Socket Production by Application (2026-2031)
6.1.3 Global Dual in-Line Package (DIP) Socket Production Market Share by Application (2020-2031)
6.2 Global Dual in-Line Package (DIP) Socket Production Value by Application (2020-2031)
6.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Application (2020-2025)
6.2.2 Global Dual in-Line Package (DIP) Socket Production Value by Application (2026-2031)
6.2.3 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Application (2020-2031)
6.3 Global Dual in-Line Package (DIP) Socket Price by Application (2020-2031)
7 Key Companies Profiled
7.1 TE Connectivity
7.1.1 TE Connectivity Dual in-Line Package (DIP) Socket Company Information
7.1.2 TE Connectivity Dual in-Line Package (DIP) Socket Product Portfolio
7.1.3 TE Connectivity Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.1.4 TE Connectivity Main Business and Markets Served
7.1.5 TE Connectivity Recent Developments/Updates
7.2 3M
7.2.1 3M Dual in-Line Package (DIP) Socket Company Information
7.2.2 3M Dual in-Line Package (DIP) Socket Product Portfolio
7.2.3 3M Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.2.4 3M Main Business and Markets Served
7.2.5 3M Recent Developments/Updates
7.3 Aries Electronics
7.3.1 Aries Electronics Dual in-Line Package (DIP) Socket Company Information
7.3.2 Aries Electronics Dual in-Line Package (DIP) Socket Product Portfolio
7.3.3 Aries Electronics Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Aries Electronics Main Business and Markets Served
7.3.5 Aries Electronics Recent Developments/Updates
7.4 Preci-dip
7.4.1 Preci-dip Dual in-Line Package (DIP) Socket Company Information
7.4.2 Preci-dip Dual in-Line Package (DIP) Socket Product Portfolio
7.4.3 Preci-dip Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Preci-dip Main Business and Markets Served
7.4.5 Preci-dip Recent Developments/Updates
7.5 Mill-Max
7.5.1 Mill-Max Dual in-Line Package (DIP) Socket Company Information
7.5.2 Mill-Max Dual in-Line Package (DIP) Socket Product Portfolio
7.5.3 Mill-Max Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Mill-Max Main Business and Markets Served
7.5.5 Mill-Max Recent Developments/Updates
7.6 Amphenol
7.6.1 Amphenol Dual in-Line Package (DIP) Socket Company Information
7.6.2 Amphenol Dual in-Line Package (DIP) Socket Product Portfolio
7.6.3 Amphenol Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Amphenol Main Business and Markets Served
7.6.5 Amphenol Recent Developments/Updates
7.7 Harwin
7.7.1 Harwin Dual in-Line Package (DIP) Socket Company Information
7.7.2 Harwin Dual in-Line Package (DIP) Socket Product Portfolio
7.7.3 Harwin Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Harwin Main Business and Markets Served
7.7.5 Harwin Recent Developments/Updates
7.8 Molex
7.8.1 Molex Dual in-Line Package (DIP) Socket Company Information
7.8.2 Molex Dual in-Line Package (DIP) Socket Product Portfolio
7.8.3 Molex Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Molex Main Business and Markets Served
7.8.5 Molex Recent Developments/Updates
7.9 Samtec
7.9.1 Samtec Dual in-Line Package (DIP) Socket Company Information
7.9.2 Samtec Dual in-Line Package (DIP) Socket Product Portfolio
7.9.3 Samtec Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Samtec Main Business and Markets Served
7.9.5 Samtec Recent Developments/Updates
7.10 Omron
7.10.1 Omron Dual in-Line Package (DIP) Socket Company Information
7.10.2 Omron Dual in-Line Package (DIP) Socket Product Portfolio
7.10.3 Omron Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Omron Main Business and Markets Served
7.10.5 Omron Recent Developments/Updates
7.11 Yamaichi Electronics
7.11.1 Yamaichi Electronics Dual in-Line Package (DIP) Socket Company Information
7.11.2 Yamaichi Electronics Dual in-Line Package (DIP) Socket Product Portfolio
7.11.3 Yamaichi Electronics Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Yamaichi Electronics Main Business and Markets Served
7.11.5 Yamaichi Electronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Dual in-Line Package (DIP) Socket Industry Chain Analysis
8.2 Dual in-Line Package (DIP) Socket Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Dual in-Line Package (DIP) Socket Production Mode & Process Analysis
8.4 Dual in-Line Package (DIP) Socket Sales and Marketing
8.4.1 Dual in-Line Package (DIP) Socket Sales Channels
8.4.2 Dual in-Line Package (DIP) Socket Distributors
8.5 Dual in-Line Package (DIP) Socket Customer Analysis
9 Dual in-Line Package (DIP) Socket Market Dynamics
9.1 Dual in-Line Package (DIP) Socket Industry Trends
9.2 Dual in-Line Package (DIP) Socket Market Drivers
9.3 Dual in-Line Package (DIP) Socket Market Challenges
9.4 Dual in-Line Package (DIP) Socket Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
TE Connectivity
3M
Aries Electronics
Preci-dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics
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听
*If Applicable.