Global Electroless Plating Solutions for Package Substrate Market Research Report 2024

Publication ID:

PB504240012

Publication Date:

April 25, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global Electroless Plating Solutions for Package Substrate market was valued at US$ 183 million in 2023 and is anticipated to reach US$ 311 million by 2030, witnessing a CAGR of 7.8% during the forecast period 2024-2030.
Chemical plating solutions for packaging substrates mainly include electroless nickel plating solutions, chemical palladium plating solutions, chemical gold plating solutions, chemical copper plating solutions, chemical tin plating solutions, degreasing, activation, etc. Among them, the ENEPIG solution can form a nickel-palladium-gold three-layer structure on the lead frame and the pad of the packaging substrate to improve the welding reliability under lead-free solder and prevent failure caused by sulfides.
In the field of IC packaging substrates, the chemical plating solution market is mainly monopolized by the top 1/2 companies. The main reason is that in the field of chemical surface treatment solutions, they are basically designated suppliers. Globally, the TOP5 companies are Uemura, Atotech, Dow Electronic Materials (DuPont), Tanaka, and YMT, with a market share of over 82%.
This report aims to provide a comprehensive presentation of the global market for Electroless Plating Solutions for Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electroless Plating Solutions for Package Substrate.
The Electroless Plating Solutions for Package Substrate market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electroless Plating Solutions for Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electroless Plating Solutions for Package Substrate companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
C. Uyemura & Co
Atotech (MKS)
DOW Electronic Materials (Dupont)
TANAKA
YMT
MK Chem & Tech Co., Ltd
Shenzhen Yicheng Electronic
KPM Tech Vina
OKUNO Chemical Industries
Segment by Type
ENEPIG
ENIG
Others
Segment by Application
FC Package Substrate
WB Package Substrate
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Electroless Plating Solutions for Package Substrate company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

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Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 ENEPIG
1.2.3 ENIG
1.2.4 Others
1.3 Market by Application
1.3.1 Global Electroless Plating Solutions for Package Substrate Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 FC Package Substrate
1.3.3 WB Package Substrate
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Electroless Plating Solutions for Package Substrate Market Perspective (2019-2030)
2.2 Global Electroless Plating Solutions for Package Substrate Growth Trends by Region
2.2.1 Global Electroless Plating Solutions for Package Substrate Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Electroless Plating Solutions for Package Substrate Historic Market Size by Region (2019-2024)
2.2.3 Electroless Plating Solutions for Package Substrate Forecasted Market Size by Region (2025-2030)
2.3 Electroless Plating Solutions for Package Substrate Market Dynamics
2.3.1 Electroless Plating Solutions for Package Substrate Industry Trends
2.3.2 Electroless Plating Solutions for Package Substrate Market Drivers
2.3.3 Electroless Plating Solutions for Package Substrate Market Challenges
2.3.4 Electroless Plating Solutions for Package Substrate Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Electroless Plating Solutions for Package Substrate Players by Revenue
3.1.1 Global Top Electroless Plating Solutions for Package Substrate Players by Revenue (2019-2024)
3.1.2 Global Electroless Plating Solutions for Package Substrate Revenue Market Share by Players (2019-2024)
3.2 Global Electroless Plating Solutions for Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Electroless Plating Solutions for Package Substrate Revenue
3.4 Global Electroless Plating Solutions for Package Substrate Market Concentration Ratio
3.4.1 Global Electroless Plating Solutions for Package Substrate Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Electroless Plating Solutions for Package Substrate Revenue in 2023
3.5 Global Key Players of Electroless Plating Solutions for Package Substrate Head office and Area Served
3.6 Global Key Players of Electroless Plating Solutions for Package Substrate, Product and Application
3.7 Global Key Players of Electroless Plating Solutions for Package Substrate, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Electroless Plating Solutions for Package Substrate Breakdown Data by Type
4.1 Global Electroless Plating Solutions for Package Substrate Historic Market Size by Type (2019-2024)
4.2 Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Type (2025-2030)
5 Electroless Plating Solutions for Package Substrate Breakdown Data by Application
5.1 Global Electroless Plating Solutions for Package Substrate Historic Market Size by Application (2019-2024)
5.2 Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Electroless Plating Solutions for Package Substrate Market Size (2019-2030)
6.2 North America Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Electroless Plating Solutions for Package Substrate Market Size by Country (2019-2024)
6.4 North America Electroless Plating Solutions for Package Substrate Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Electroless Plating Solutions for Package Substrate Market Size (2019-2030)
7.2 Europe Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Electroless Plating Solutions for Package Substrate Market Size by Country (2019-2024)
7.4 Europe Electroless Plating Solutions for Package Substrate Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size (2019-2030)
8.2 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size by Region (2019-2024)
8.4 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Electroless Plating Solutions for Package Substrate Market Size (2019-2030)
9.2 Latin America Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Electroless Plating Solutions for Package Substrate Market Size by Country (2019-2024)
9.4 Latin America Electroless Plating Solutions for Package Substrate Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size (2019-2030)
10.2 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size by Country (2019-2024)
10.4 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 C. Uyemura & Co
11.1.1 C. Uyemura & Co Company Details
11.1.2 C. Uyemura & Co Business Overview
11.1.3 C. Uyemura & Co Electroless Plating Solutions for Package Substrate Introduction
11.1.4 C. Uyemura & Co Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.1.5 C. Uyemura & Co Recent Development
11.2 Atotech (MKS)
11.2.1 Atotech (MKS) Company Details
11.2.2 Atotech (MKS) Business Overview
11.2.3 Atotech (MKS) Electroless Plating Solutions for Package Substrate Introduction
11.2.4 Atotech (MKS) Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.2.5 Atotech (MKS) Recent Development
11.3 DOW Electronic Materials (Dupont)
11.3.1 DOW Electronic Materials (Dupont) Company Details
11.3.2 DOW Electronic Materials (Dupont) Business Overview
11.3.3 DOW Electronic Materials (Dupont) Electroless Plating Solutions for Package Substrate Introduction
11.3.4 DOW Electronic Materials (Dupont) Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.3.5 DOW Electronic Materials (Dupont) Recent Development
11.4 TANAKA
11.4.1 TANAKA Company Details
11.4.2 TANAKA Business Overview
11.4.3 TANAKA Electroless Plating Solutions for Package Substrate Introduction
11.4.4 TANAKA Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.4.5 TANAKA Recent Development
11.5 YMT
11.5.1 YMT Company Details
11.5.2 YMT Business Overview
11.5.3 YMT Electroless Plating Solutions for Package Substrate Introduction
11.5.4 YMT Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.5.5 YMT Recent Development
11.6 MK Chem & Tech Co., Ltd
11.6.1 MK Chem & Tech Co., Ltd Company Details
11.6.2 MK Chem & Tech Co., Ltd Business Overview
11.6.3 MK Chem & Tech Co., Ltd Electroless Plating Solutions for Package Substrate Introduction
11.6.4 MK Chem & Tech Co., Ltd Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.6.5 MK Chem & Tech Co., Ltd Recent Development
11.7 Shenzhen Yicheng Electronic
11.7.1 Shenzhen Yicheng Electronic Company Details
11.7.2 Shenzhen Yicheng Electronic Business Overview
11.7.3 Shenzhen Yicheng Electronic Electroless Plating Solutions for Package Substrate Introduction
11.7.4 Shenzhen Yicheng Electronic Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.7.5 Shenzhen Yicheng Electronic Recent Development
11.8 KPM Tech Vina
11.8.1 KPM Tech Vina Company Details
11.8.2 KPM Tech Vina Business Overview
11.8.3 KPM Tech Vina Electroless Plating Solutions for Package Substrate Introduction
11.8.4 KPM Tech Vina Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.8.5 KPM Tech Vina Recent Development
11.9 OKUNO Chemical Industries
11.9.1 OKUNO Chemical Industries Company Details
11.9.2 OKUNO Chemical Industries Business Overview
11.9.3 OKUNO Chemical Industries Electroless Plating Solutions for Package Substrate Introduction
11.9.4 OKUNO Chemical Industries Revenue in Electroless Plating Solutions for Package Substrate Business (2019-2024)
11.9.5 OKUNO Chemical Industries Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer

Companies Mentioned:

C. Uyemura & Co
Atotech (MKS)
DOW Electronic Materials (Dupont)
TANAKA
YMT
MK Chem & Tech Co., Ltd
Shenzhen Yicheng Electronic
KPM Tech Vina
OKUNO Chemical Industries

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