
The global market for Electronic Encapsulation Material was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Electronic Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Encapsulation Material.
The Electronic Encapsulation Material market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Electronic Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Encapsulation Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Epoxy
Nitto
Sumitomo Bakelite
Meiwa Plastic Industries
by Type
Epoxy Based Materials
Non- epoxy Based Materials
by Application
Automobile Industry
Aerospace
Consumer Electronics Products
Industry
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Encapsulation Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Encapsulation Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Encapsulation Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Electronic Encapsulation Material Market Overview
1.1 Product Definition
1.2 Electronic Encapsulation Material by Type
1.2.1 Global Electronic Encapsulation Material Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Epoxy Based Materials
1.2.3 Non- epoxy Based Materials
1.3 Electronic Encapsulation Material by Application
1.3.1 Global Electronic Encapsulation Material Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Automobile Industry
1.3.3 Aerospace
1.3.4 Consumer Electronics Products
1.3.5 Industry
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Electronic Encapsulation Material Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Electronic Encapsulation Material Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Electronic Encapsulation Material Production Estimates and Forecasts (2020-2031)
1.4.4 Global Electronic Encapsulation Material Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electronic Encapsulation Material Production Market Share by Manufacturers (2020-2025)
2.2 Global Electronic Encapsulation Material Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Electronic Encapsulation Material, Industry Ranking, 2023 VS 2024
2.4 Global Electronic Encapsulation Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Electronic Encapsulation Material Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Electronic Encapsulation Material, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electronic Encapsulation Material, Product Offered and Application
2.8 Global Key Manufacturers of Electronic Encapsulation Material, Date of Enter into This Industry
2.9 Electronic Encapsulation Material Market Competitive Situation and Trends
2.9.1 Electronic Encapsulation Material Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electronic Encapsulation Material Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electronic Encapsulation Material Production by Region
3.1 Global Electronic Encapsulation Material Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Electronic Encapsulation Material Production Value by Region (2020-2031)
3.2.1 Global Electronic Encapsulation Material Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Electronic Encapsulation Material by Region (2026-2031)
3.3 Global Electronic Encapsulation Material Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Electronic Encapsulation Material Production Volume by Region (2020-2031)
3.4.1 Global Electronic Encapsulation Material Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Electronic Encapsulation Material by Region (2026-2031)
3.5 Global Electronic Encapsulation Material Market Price Analysis by Region (2020-2025)
3.6 Global Electronic Encapsulation Material Production and Value, Year-over-Year Growth
3.6.1 North America Electronic Encapsulation Material Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Electronic Encapsulation Material Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Electronic Encapsulation Material Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Electronic Encapsulation Material Production Value Estimates and Forecasts (2020-2031)
4 Electronic Encapsulation Material Consumption by Region
4.1 Global Electronic Encapsulation Material Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Electronic Encapsulation Material Consumption by Region (2020-2031)
4.2.1 Global Electronic Encapsulation Material Consumption by Region (2020-2025)
4.2.2 Global Electronic Encapsulation Material Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Electronic Encapsulation Material Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Electronic Encapsulation Material Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electronic Encapsulation Material Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Electronic Encapsulation Material Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electronic Encapsulation Material Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Electronic Encapsulation Material Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electronic Encapsulation Material Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Electronic Encapsulation Material Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Electronic Encapsulation Material Production by Type (2020-2031)
5.1.1 Global Electronic Encapsulation Material Production by Type (2020-2025)
5.1.2 Global Electronic Encapsulation Material Production by Type (2026-2031)
5.1.3 Global Electronic Encapsulation Material Production Market Share by Type (2020-2031)
5.2 Global Electronic Encapsulation Material Production Value by Type (2020-2031)
5.2.1 Global Electronic Encapsulation Material Production Value by Type (2020-2025)
5.2.2 Global Electronic Encapsulation Material Production Value by Type (2026-2031)
5.2.3 Global Electronic Encapsulation Material Production Value Market Share by Type (2020-2031)
5.3 Global Electronic Encapsulation Material Price by Type (2020-2031)
6 Segment by Application
6.1 Global Electronic Encapsulation Material Production by Application (2020-2031)
6.1.1 Global Electronic Encapsulation Material Production by Application (2020-2025)
6.1.2 Global Electronic Encapsulation Material Production by Application (2026-2031)
6.1.3 Global Electronic Encapsulation Material Production Market Share by Application (2020-2031)
6.2 Global Electronic Encapsulation Material Production Value by Application (2020-2031)
6.2.1 Global Electronic Encapsulation Material Production Value by Application (2020-2025)
6.2.2 Global Electronic Encapsulation Material Production Value by Application (2026-2031)
6.2.3 Global Electronic Encapsulation Material Production Value Market Share by Application (2020-2031)
6.3 Global Electronic Encapsulation Material Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Panasonic
7.1.1 Panasonic Electronic Encapsulation Material Company Information
7.1.2 Panasonic Electronic Encapsulation Material Product Portfolio
7.1.3 Panasonic Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Panasonic Main Business and Markets Served
7.1.5 Panasonic Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Electronic Encapsulation Material Company Information
7.2.2 Henkel Electronic Encapsulation Material Product Portfolio
7.2.3 Henkel Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Henkel Main Business and Markets Served
7.2.5 Henkel Recent Developments/Updates
7.3 Shin-Etsu MicroSi
7.3.1 Shin-Etsu MicroSi Electronic Encapsulation Material Company Information
7.3.2 Shin-Etsu MicroSi Electronic Encapsulation Material Product Portfolio
7.3.3 Shin-Etsu MicroSi Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Shin-Etsu MicroSi Main Business and Markets Served
7.3.5 Shin-Etsu MicroSi Recent Developments/Updates
7.4 Lord
7.4.1 Lord Electronic Encapsulation Material Company Information
7.4.2 Lord Electronic Encapsulation Material Product Portfolio
7.4.3 Lord Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Lord Main Business and Markets Served
7.4.5 Lord Recent Developments/Updates
7.5 Epoxy
7.5.1 Epoxy Electronic Encapsulation Material Company Information
7.5.2 Epoxy Electronic Encapsulation Material Product Portfolio
7.5.3 Epoxy Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Epoxy Main Business and Markets Served
7.5.5 Epoxy Recent Developments/Updates
7.6 Nitto
7.6.1 Nitto Electronic Encapsulation Material Company Information
7.6.2 Nitto Electronic Encapsulation Material Product Portfolio
7.6.3 Nitto Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Nitto Main Business and Markets Served
7.6.5 Nitto Recent Developments/Updates
7.7 Sumitomo Bakelite
7.7.1 Sumitomo Bakelite Electronic Encapsulation Material Company Information
7.7.2 Sumitomo Bakelite Electronic Encapsulation Material Product Portfolio
7.7.3 Sumitomo Bakelite Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Sumitomo Bakelite Main Business and Markets Served
7.7.5 Sumitomo Bakelite Recent Developments/Updates
7.8 Meiwa Plastic Industries
7.8.1 Meiwa Plastic Industries Electronic Encapsulation Material Company Information
7.8.2 Meiwa Plastic Industries Electronic Encapsulation Material Product Portfolio
7.8.3 Meiwa Plastic Industries Electronic Encapsulation Material Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Meiwa Plastic Industries Main Business and Markets Served
7.8.5 Meiwa Plastic Industries Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electronic Encapsulation Material Industry Chain Analysis
8.2 Electronic Encapsulation Material Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electronic Encapsulation Material Production Mode & Process Analysis
8.4 Electronic Encapsulation Material Sales and Marketing
8.4.1 Electronic Encapsulation Material Sales Channels
8.4.2 Electronic Encapsulation Material Distributors
8.5 Electronic Encapsulation Material Customer Analysis
9 Electronic Encapsulation Material Market Dynamics
9.1 Electronic Encapsulation Material Industry Trends
9.2 Electronic Encapsulation Material Market Drivers
9.3 Electronic Encapsulation Material Market Challenges
9.4 Electronic Encapsulation Material Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Epoxy
Nitto
Sumitomo Bakelite
Meiwa Plastic Industries
Ìý
Ìý
*If Applicable.
