Global Embedded Chip Packaging Market Research Report 2025

Publication ID:

PB502260232

Publication Date:

February 11, 2025

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global market for Embedded Chip Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Embedding components into substrates using a multi-step manufacturing process.Single-chip, multi-chip, MEMS or passive components can be embedded in an organic laminate substrate in a side-by-side manner. These components are connected by copper-plated vias.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Embedded Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Embedded Chip Packaging.
The Embedded Chip Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Embedded Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Embedded Chip Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE
ATS
GE
Shinko
Taiyo Yuden
TDK
W眉rth Elektronik
Texas Instruments
Siemens
Infineon
ST
Analog Devices
NXP
ATMEL
Samsung
MTK
Allwinner
Rockchip
Segment by Type
Single Chip
Multichip
MEMS
Passive Components
Segment by Application
Tiny package
System-in-Boards
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Embedded Chip Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Embedded Chip Packaging Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Single Chip
1.2.3 Multichip
1.2.4 MEMS
1.2.5 Passive Components
1.3 Market by Application
1.3.1 Global Embedded Chip Packaging Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Tiny package
1.3.3 System-in-Boards
1.3.4 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Embedded Chip Packaging Market Perspective (2020-2031)
2.2 Global Embedded Chip Packaging Growth Trends by Region
2.2.1 Global Embedded Chip Packaging Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 Embedded Chip Packaging Historic Market Size by Region (2020-2025)
2.2.3 Embedded Chip Packaging Forecasted Market Size by Region (2026-2031)
2.3 Embedded Chip Packaging Market Dynamics
2.3.1 Embedded Chip Packaging Industry Trends
2.3.2 Embedded Chip Packaging Market Drivers
2.3.3 Embedded Chip Packaging Market Challenges
2.3.4 Embedded Chip Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Embedded Chip Packaging Players by Revenue
3.1.1 Global Top Embedded Chip Packaging Players by Revenue (2020-2025)
3.1.2 Global Embedded Chip Packaging Revenue Market Share by Players (2020-2025)
3.2 Global Embedded Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Embedded Chip Packaging Revenue
3.4 Global Embedded Chip Packaging Market Concentration Ratio
3.4.1 Global Embedded Chip Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Embedded Chip Packaging Revenue in 2024
3.5 Global Key Players of Embedded Chip Packaging Head office and Area Served
3.6 Global Key Players of Embedded Chip Packaging, Product and Application
3.7 Global Key Players of Embedded Chip Packaging, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Embedded Chip Packaging Breakdown Data by Type
4.1 Global Embedded Chip Packaging Historic Market Size by Type (2020-2025)
4.2 Global Embedded Chip Packaging Forecasted Market Size by Type (2026-2031)
5 Embedded Chip Packaging Breakdown Data by Application
5.1 Global Embedded Chip Packaging Historic Market Size by Application (2020-2025)
5.2 Global Embedded Chip Packaging Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America Embedded Chip Packaging Market Size (2020-2031)
6.2 North America Embedded Chip Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America Embedded Chip Packaging Market Size by Country (2020-2025)
6.4 North America Embedded Chip Packaging Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Embedded Chip Packaging Market Size (2020-2031)
7.2 Europe Embedded Chip Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe Embedded Chip Packaging Market Size by Country (2020-2025)
7.4 Europe Embedded Chip Packaging Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Embedded Chip Packaging Market Size (2020-2031)
8.2 Asia-Pacific Embedded Chip Packaging Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific Embedded Chip Packaging Market Size by Region (2020-2025)
8.4 Asia-Pacific Embedded Chip Packaging Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Embedded Chip Packaging Market Size (2020-2031)
9.2 Latin America Embedded Chip Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America Embedded Chip Packaging Market Size by Country (2020-2025)
9.4 Latin America Embedded Chip Packaging Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Embedded Chip Packaging Market Size (2020-2031)
10.2 Middle East & Africa Embedded Chip Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa Embedded Chip Packaging Market Size by Country (2020-2025)
10.4 Middle East & Africa Embedded Chip Packaging Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Details
11.1.2 ASE Business Overview
11.1.3 ASE Embedded Chip Packaging Introduction
11.1.4 ASE Revenue in Embedded Chip Packaging Business (2020-2025)
11.1.5 ASE Recent Development
11.2 ATS
11.2.1 ATS Company Details
11.2.2 ATS Business Overview
11.2.3 ATS Embedded Chip Packaging Introduction
11.2.4 ATS Revenue in Embedded Chip Packaging Business (2020-2025)
11.2.5 ATS Recent Development
11.3 GE
11.3.1 GE Company Details
11.3.2 GE Business Overview
11.3.3 GE Embedded Chip Packaging Introduction
11.3.4 GE Revenue in Embedded Chip Packaging Business (2020-2025)
11.3.5 GE Recent Development
11.4 Shinko
11.4.1 Shinko Company Details
11.4.2 Shinko Business Overview
11.4.3 Shinko Embedded Chip Packaging Introduction
11.4.4 Shinko Revenue in Embedded Chip Packaging Business (2020-2025)
11.4.5 Shinko Recent Development
11.5 Taiyo Yuden
11.5.1 Taiyo Yuden Company Details
11.5.2 Taiyo Yuden Business Overview
11.5.3 Taiyo Yuden Embedded Chip Packaging Introduction
11.5.4 Taiyo Yuden Revenue in Embedded Chip Packaging Business (2020-2025)
11.5.5 Taiyo Yuden Recent Development
11.6 TDK
11.6.1 TDK Company Details
11.6.2 TDK Business Overview
11.6.3 TDK Embedded Chip Packaging Introduction
11.6.4 TDK Revenue in Embedded Chip Packaging Business (2020-2025)
11.6.5 TDK Recent Development
11.7 W眉rth Elektronik
11.7.1 W眉rth Elektronik Company Details
11.7.2 W眉rth Elektronik Business Overview
11.7.3 W眉rth Elektronik Embedded Chip Packaging Introduction
11.7.4 W眉rth Elektronik Revenue in Embedded Chip Packaging Business (2020-2025)
11.7.5 W眉rth Elektronik Recent Development
11.8 Texas Instruments
11.8.1 Texas Instruments Company Details
11.8.2 Texas Instruments Business Overview
11.8.3 Texas Instruments Embedded Chip Packaging Introduction
11.8.4 Texas Instruments Revenue in Embedded Chip Packaging Business (2020-2025)
11.8.5 Texas Instruments Recent Development
11.9 Siemens
11.9.1 Siemens Company Details
11.9.2 Siemens Business Overview
11.9.3 Siemens Embedded Chip Packaging Introduction
11.9.4 Siemens Revenue in Embedded Chip Packaging Business (2020-2025)
11.9.5 Siemens Recent Development
11.10 Infineon
11.10.1 Infineon Company Details
11.10.2 Infineon Business Overview
11.10.3 Infineon Embedded Chip Packaging Introduction
11.10.4 Infineon Revenue in Embedded Chip Packaging Business (2020-2025)
11.10.5 Infineon Recent Development
11.11 ST
11.11.1 ST Company Details
11.11.2 ST Business Overview
11.11.3 ST Embedded Chip Packaging Introduction
11.11.4 ST Revenue in Embedded Chip Packaging Business (2020-2025)
11.11.5 ST Recent Development
11.12 Analog Devices
11.12.1 Analog Devices Company Details
11.12.2 Analog Devices Business Overview
11.12.3 Analog Devices Embedded Chip Packaging Introduction
11.12.4 Analog Devices Revenue in Embedded Chip Packaging Business (2020-2025)
11.12.5 Analog Devices Recent Development
11.13 NXP
11.13.1 NXP Company Details
11.13.2 NXP Business Overview
11.13.3 NXP Embedded Chip Packaging Introduction
11.13.4 NXP Revenue in Embedded Chip Packaging Business (2020-2025)
11.13.5 NXP Recent Development
11.14 ATMEL
11.14.1 ATMEL Company Details
11.14.2 ATMEL Business Overview
11.14.3 ATMEL Embedded Chip Packaging Introduction
11.14.4 ATMEL Revenue in Embedded Chip Packaging Business (2020-2025)
11.14.5 ATMEL Recent Development
11.15 Samsung
11.15.1 Samsung Company Details
11.15.2 Samsung Business Overview
11.15.3 Samsung Embedded Chip Packaging Introduction
11.15.4 Samsung Revenue in Embedded Chip Packaging Business (2020-2025)
11.15.5 Samsung Recent Development
11.16 MTK
11.16.1 MTK Company Details
11.16.2 MTK Business Overview
11.16.3 MTK Embedded Chip Packaging Introduction
11.16.4 MTK Revenue in Embedded Chip Packaging Business (2020-2025)
11.16.5 MTK Recent Development
11.17 Allwinner
11.17.1 Allwinner Company Details
11.17.2 Allwinner Business Overview
11.17.3 Allwinner Embedded Chip Packaging Introduction
11.17.4 Allwinner Revenue in Embedded Chip Packaging Business (2020-2025)
11.17.5 Allwinner Recent Development
11.18 Rockchip
11.18.1 Rockchip Company Details
11.18.2 Rockchip Business Overview
11.18.3 Rockchip Embedded Chip Packaging Introduction
11.18.4 Rockchip Revenue in Embedded Chip Packaging Business (2020-2025)
11.18.5 Rockchip Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer

Companies Mentioned:

ASE
ATS
GE
Shinko
Taiyo Yuden
TDK
W眉rth Elektronik
Texas Instruments
Siemens
Infineon
ST
Analog Devices
NXP
ATMEL
Samsung
MTK
Allwinner
Rockchip

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