Global Embedded Chip Packaging Technology Market Research Report 2024

Publication ID:

PB508245563

Publication Date:

August 7, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global Embedded Chip Packaging Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Embedded Chip Packaging Technology is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Embedded Chip Packaging Technology is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Embedded Chip Packaging Technology in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Embedded Chip Packaging Technology include General Electric, TDK, Microsemi, Amkor Technology, ASE Group, Fujikura, Infineon Technologies, Schweizer Electronic and Intel, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Embedded Chip Packaging Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Embedded Chip Packaging Technology.
Report Scope
The Embedded Chip Packaging Technology market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Embedded Chip Packaging Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Embedded Chip Packaging Technology companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
General Electric
TDK
Microsemi
Amkor Technology
ASE Group
Fujikura
Infineon Technologies
Schweizer Electronic
Intel
Samsung Electro-Mechanics
Taiwan Semiconductor Manufacturing Company
Segment by Type
Embedded Chips in IC Package Substrates
Embedded Chips in Rigid Boards
Embedded Chips in Flexible Boards
Segment by Application
Consumer Electronics
Telecommunications
Automotive
Healthcare
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Embedded Chip Packaging Technology companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Embedded Chip Packaging Technology Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Embedded Chips in IC Package Substrates
1.2.3 Embedded Chips in Rigid Boards
1.2.4 Embedded Chips in Flexible Boards
1.3 Market by Application
1.3.1 Global Embedded Chip Packaging Technology Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Telecommunications
1.3.4 Automotive
1.3.5 Healthcare
1.3.6 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Embedded Chip Packaging Technology Market Perspective (2019-2030)
2.2 Embedded Chip Packaging Technology Growth Trends by Region
2.2.1 Global Embedded Chip Packaging Technology Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Embedded Chip Packaging Technology Historic Market Size by Region (2019-2024)
2.2.3 Embedded Chip Packaging Technology Forecasted Market Size by Region (2025-2030)
2.3 Embedded Chip Packaging Technology Market Dynamics
2.3.1 Embedded Chip Packaging Technology Industry Trends
2.3.2 Embedded Chip Packaging Technology Market Drivers
2.3.3 Embedded Chip Packaging Technology Market Challenges
2.3.4 Embedded Chip Packaging Technology Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Embedded Chip Packaging Technology Players by Revenue
3.1.1 Global Top Embedded Chip Packaging Technology Players by Revenue (2019-2024)
3.1.2 Global Embedded Chip Packaging Technology Revenue Market Share by Players (2019-2024)
3.2 Global Embedded Chip Packaging Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Embedded Chip Packaging Technology Revenue
3.4 Global Embedded Chip Packaging Technology Market Concentration Ratio
3.4.1 Global Embedded Chip Packaging Technology Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Embedded Chip Packaging Technology Revenue in 2023
3.5 Embedded Chip Packaging Technology Key Players Head office and Area Served
3.6 Key Players Embedded Chip Packaging Technology Product Solution and Service
3.7 Date of Enter into Embedded Chip Packaging Technology Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Embedded Chip Packaging Technology Breakdown Data by Type
4.1 Global Embedded Chip Packaging Technology Historic Market Size by Type (2019-2024)
4.2 Global Embedded Chip Packaging Technology Forecasted Market Size by Type (2025-2030)
5 Embedded Chip Packaging Technology Breakdown Data by Application
5.1 Global Embedded Chip Packaging Technology Historic Market Size by Application (2019-2024)
5.2 Global Embedded Chip Packaging Technology Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Embedded Chip Packaging Technology Market Size (2019-2030)
6.2 North America Embedded Chip Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Embedded Chip Packaging Technology Market Size by Country (2019-2024)
6.4 North America Embedded Chip Packaging Technology Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Embedded Chip Packaging Technology Market Size (2019-2030)
7.2 Europe Embedded Chip Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Embedded Chip Packaging Technology Market Size by Country (2019-2024)
7.4 Europe Embedded Chip Packaging Technology Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Embedded Chip Packaging Technology Market Size (2019-2030)
8.2 Asia-Pacific Embedded Chip Packaging Technology Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Embedded Chip Packaging Technology Market Size by Region (2019-2024)
8.4 Asia-Pacific Embedded Chip Packaging Technology Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Embedded Chip Packaging Technology Market Size (2019-2030)
9.2 Latin America Embedded Chip Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Embedded Chip Packaging Technology Market Size by Country (2019-2024)
9.4 Latin America Embedded Chip Packaging Technology Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Embedded Chip Packaging Technology Market Size (2019-2030)
10.2 Middle East & Africa Embedded Chip Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Embedded Chip Packaging Technology Market Size by Country (2019-2024)
10.4 Middle East & Africa Embedded Chip Packaging Technology Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 General Electric
11.1.1 General Electric Company Detail
11.1.2 General Electric Business Overview
11.1.3 General Electric Embedded Chip Packaging Technology Introduction
11.1.4 General Electric Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.1.5 General Electric Recent Development
11.2 TDK
11.2.1 TDK Company Detail
11.2.2 TDK Business Overview
11.2.3 TDK Embedded Chip Packaging Technology Introduction
11.2.4 TDK Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.2.5 TDK Recent Development
11.3 Microsemi
11.3.1 Microsemi Company Detail
11.3.2 Microsemi Business Overview
11.3.3 Microsemi Embedded Chip Packaging Technology Introduction
11.3.4 Microsemi Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.3.5 Microsemi Recent Development
11.4 Amkor Technology
11.4.1 Amkor Technology Company Detail
11.4.2 Amkor Technology Business Overview
11.4.3 Amkor Technology Embedded Chip Packaging Technology Introduction
11.4.4 Amkor Technology Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.4.5 Amkor Technology Recent Development
11.5 ASE Group
11.5.1 ASE Group Company Detail
11.5.2 ASE Group Business Overview
11.5.3 ASE Group Embedded Chip Packaging Technology Introduction
11.5.4 ASE Group Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.5.5 ASE Group Recent Development
11.6 Fujikura
11.6.1 Fujikura Company Detail
11.6.2 Fujikura Business Overview
11.6.3 Fujikura Embedded Chip Packaging Technology Introduction
11.6.4 Fujikura Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.6.5 Fujikura Recent Development
11.7 Infineon Technologies
11.7.1 Infineon Technologies Company Detail
11.7.2 Infineon Technologies Business Overview
11.7.3 Infineon Technologies Embedded Chip Packaging Technology Introduction
11.7.4 Infineon Technologies Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.7.5 Infineon Technologies Recent Development
11.8 Schweizer Electronic
11.8.1 Schweizer Electronic Company Detail
11.8.2 Schweizer Electronic Business Overview
11.8.3 Schweizer Electronic Embedded Chip Packaging Technology Introduction
11.8.4 Schweizer Electronic Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.8.5 Schweizer Electronic Recent Development
11.9 Intel
11.9.1 Intel Company Detail
11.9.2 Intel Business Overview
11.9.3 Intel Embedded Chip Packaging Technology Introduction
11.9.4 Intel Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.9.5 Intel Recent Development
11.10 Samsung Electro-Mechanics
11.10.1 Samsung Electro-Mechanics Company Detail
11.10.2 Samsung Electro-Mechanics Business Overview
11.10.3 Samsung Electro-Mechanics Embedded Chip Packaging Technology Introduction
11.10.4 Samsung Electro-Mechanics Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.10.5 Samsung Electro-Mechanics Recent Development
11.11 Taiwan Semiconductor Manufacturing Company
11.11.1 Taiwan Semiconductor Manufacturing Company Company Detail
11.11.2 Taiwan Semiconductor Manufacturing Company Business Overview
11.11.3 Taiwan Semiconductor Manufacturing Company Embedded Chip Packaging Technology Introduction
11.11.4 Taiwan Semiconductor Manufacturing Company Revenue in Embedded Chip Packaging Technology Business (2019-2024)
11.11.5 Taiwan Semiconductor Manufacturing Company Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

General Electric
TDK
Microsemi
Amkor Technology
ASE Group
Fujikura
Infineon Technologies
Schweizer Electronic
Intel
Samsung Electro-Mechanics
Taiwan Semiconductor Manufacturing Company

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