Epoxy molding compounds (EMCs) are critical in semiconductor packaging for protecting delicate integrated circuits (ICs) and other electronic components. These compounds encapsulate the semiconductor devices, providing mechanical support, environmental protection, and electrical insulation.
The global Epoxy Molding Compound in Semiconductor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound in Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound in Semiconductor Packaging.
The Epoxy Molding Compound in Semiconductor Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Ton) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Epoxy Molding Compound in Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound in Semiconductor Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Sumitomo Bakelite
Nitto Denko
Resonac
Shin-Etsu Chemical
KCC
NEPES
CHANG CHUN SB(CHANGSHU)
Hysol Huawei Electronics
Jiangsu Huahai Chengkexin Material
PhiChem Corporation
Duresco
by Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
by Application
Advanced Packaging
Traditional Packaging
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound in Semiconductor Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound in Semiconductor Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound in Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Epoxy Molding Compound in Semiconductor Packaging Market Overview
1.1 Product Definition
1.2 Epoxy Molding Compound in Semiconductor Packaging by Type
1.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Normal Epoxy Molding Compound
1.2.3 Green Epoxy Molding Compound
1.3 Epoxy Molding Compound in Semiconductor Packaging by Application
1.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Advanced Packaging
1.3.3 Traditional Packaging
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Epoxy Molding Compound in Semiconductor Packaging, Industry Ranking, 2022 VS 2023
2.4 Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Epoxy Molding Compound in Semiconductor Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Date of Enter into This Industry
2.9 Epoxy Molding Compound in Semiconductor Packaging Market Competitive Situation and Trends
2.9.1 Epoxy Molding Compound in Semiconductor Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Molding Compound in Semiconductor Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Epoxy Molding Compound in Semiconductor Packaging Production by Region
3.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region (2019-2030)
3.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Epoxy Molding Compound in Semiconductor Packaging by Region (2025-2030)
3.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Epoxy Molding Compound in Semiconductor Packaging Production by Region (2019-2030)
3.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Epoxy Molding Compound in Semiconductor Packaging by Region (2025-2030)
3.5 Global Epoxy Molding Compound in Semiconductor Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Epoxy Molding Compound in Semiconductor Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
4 Epoxy Molding Compound in Semiconductor Packaging Consumption by Region
4.1 Global Epoxy Molding Compound in Semiconductor Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2030)
4.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2030)
4.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2019-2030)
5.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2019-2024)
5.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2025-2030)
5.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2019-2030)
5.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2019-2030)
5.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2019-2024)
5.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2025-2030)
5.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2019-2030)
6.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2019-2024)
6.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2025-2030)
6.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2019-2030)
6.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2019-2030)
6.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2019-2024)
6.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2025-2030)
6.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Sumitomo Bakelite
7.1.1 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Company Information
7.1.2 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.1.3 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Sumitomo Bakelite Main Business and Markets Served
7.1.5 Sumitomo Bakelite Recent Developments/Updates
7.2 Nitto Denko
7.2.1 Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Company Information
7.2.2 Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.2.3 Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nitto Denko Main Business and Markets Served
7.2.5 Nitto Denko Recent Developments/Updates
7.3 Resonac
7.3.1 Resonac Epoxy Molding Compound in Semiconductor Packaging Company Information
7.3.2 Resonac Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.3.3 Resonac Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Resonac Main Business and Markets Served
7.3.5 Resonac Recent Developments/Updates
7.4 Shin-Etsu Chemical
7.4.1 Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Company Information
7.4.2 Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.4.3 Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Shin-Etsu Chemical Main Business and Markets Served
7.4.5 Shin-Etsu Chemical Recent Developments/Updates
7.5 KCC
7.5.1 KCC Epoxy Molding Compound in Semiconductor Packaging Company Information
7.5.2 KCC Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.5.3 KCC Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 KCC Main Business and Markets Served
7.5.5 KCC Recent Developments/Updates
7.6 NEPES
7.6.1 NEPES Epoxy Molding Compound in Semiconductor Packaging Company Information
7.6.2 NEPES Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.6.3 NEPES Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 NEPES Main Business and Markets Served
7.6.5 NEPES Recent Developments/Updates
7.7 CHANG CHUN SB(CHANGSHU)
7.7.1 CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Company Information
7.7.2 CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.7.3 CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 CHANG CHUN SB(CHANGSHU) Main Business and Markets Served
7.7.5 CHANG CHUN SB(CHANGSHU) Recent Developments/Updates
7.8 Hysol Huawei Electronics
7.8.1 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Company Information
7.8.2 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.8.3 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Hysol Huawei Electronics Main Business and Markets Served
7.8.5 Hysol Huawei Electronics Recent Developments/Updates
7.9 Jiangsu Huahai Chengkexin Material
7.9.1 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Company Information
7.9.2 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.9.3 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Jiangsu Huahai Chengkexin Material Main Business and Markets Served
7.9.5 Jiangsu Huahai Chengkexin Material Recent Developments/Updates
7.10 PhiChem Corporation
7.10.1 PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Company Information
7.10.2 PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.10.3 PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 PhiChem Corporation Main Business and Markets Served
7.10.5 PhiChem Corporation Recent Developments/Updates
7.11 Duresco
7.11.1 Duresco Epoxy Molding Compound in Semiconductor Packaging Company Information
7.11.2 Duresco Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.11.3 Duresco Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Duresco Main Business and Markets Served
7.11.5 Duresco Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Molding Compound in Semiconductor Packaging Industry Chain Analysis
8.2 Epoxy Molding Compound in Semiconductor Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Molding Compound in Semiconductor Packaging Production Mode & Process
8.4 Epoxy Molding Compound in Semiconductor Packaging Sales and Marketing
8.4.1 Epoxy Molding Compound in Semiconductor Packaging Sales Channels
8.4.2 Epoxy Molding Compound in Semiconductor Packaging Distributors
8.5 Epoxy Molding Compound in Semiconductor Packaging Customers
9 Epoxy Molding Compound in Semiconductor Packaging Market Dynamics
9.1 Epoxy Molding Compound in Semiconductor Packaging Industry Trends
9.2 Epoxy Molding Compound in Semiconductor Packaging Market Drivers
9.3 Epoxy Molding Compound in Semiconductor Packaging Market Challenges
9.4 Epoxy Molding Compound in Semiconductor Packaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Sumitomo Bakelite
Nitto Denko
Resonac
Shin-Etsu Chemical
KCC
NEPES
CHANG CHUN SB(CHANGSHU)
Hysol Huawei Electronics
Jiangsu Huahai Chengkexin Material
PhiChem Corporation
Duresco
听
听
*If Applicable.