Global Epoxy Plastic Compound for Electronic Packaging Market Research Report 2024

Publication ID:

PB503248678

Publication Date:

March 27, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

The global Epoxy Plastic Compound for Electronic Packaging market was valued at US$ 2448 million in 2023 and is anticipated to reach US$ 3632.6 million by 2030, witnessing a CAGR of 5.8% during the forecast period 2024-2030.
Epoxy plastic compound for electronic packaging is an important electronic material used to encapsulate and protect various electronic components and devices to improve their stability, durability and performance. These materials are typically a type of epoxy resin that offers excellent mechanical properties, chemical resistance, heat resistance, and electrical properties. With the continuous development of electronic products and the expansion of application fields, the performance requirements for electronic packaging materials are getting higher and higher. The future development trend is to continuously improve the performance of epoxy plastic sealants, such as improving its heat resistance, mechanical strength, chemical stability, etc., to meet the needs of various special applications. The future development trend of epoxy plastic sealants for electronic packaging will pay more attention to high performance, miniaturization, green environmental protection and intelligence to meet the changing packaging needs of electronic products and promote the sustainable development of the electronics industry.
This report aims to provide a comprehensive presentation of the global market for Epoxy Plastic Compound for Electronic Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Plastic Compound for Electronic Packaging.
Report Scope
The Epoxy Plastic Compound for Electronic Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Epoxy Plastic Compound for Electronic Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Plastic Compound for Electronic Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Dow
Henkel
Sumitomo Chemical
Momentive Performance Materials
Shin-Etsu Chemical
Huntsman
Segment by Type
Epoxy Resin Encapsulation Material
Epoxy Glue Encapsulation Material
Others
Segment by Application
Semiconductor
Vehicle Electronics
Aerospace Electronics
Optoelectronic Devices
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Plastic Compound for Electronic Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Plastic Compound for Electronic Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Plastic Compound for Electronic Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Epoxy Plastic Compound for Electronic Packaging Market Overview
1.1 Product Definition
1.2 Epoxy Plastic Compound for Electronic Packaging Segment by Type
1.2.1 Global Epoxy Plastic Compound for Electronic Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Epoxy Resin Encapsulation Material
1.2.3 Epoxy Glue Encapsulation Material
1.2.4 Others
1.3 Epoxy Plastic Compound for Electronic Packaging Segment by Application
1.3.1 Global Epoxy Plastic Compound for Electronic Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Semiconductor
1.3.3 Vehicle Electronics
1.3.4 Aerospace Electronics
1.3.5 Optoelectronic Devices
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Plastic Compound for Electronic Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Epoxy Plastic Compound for Electronic Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Epoxy Plastic Compound for Electronic Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Epoxy Plastic Compound for Electronic Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Epoxy Plastic Compound for Electronic Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Epoxy Plastic Compound for Electronic Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Epoxy Plastic Compound for Electronic Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Epoxy Plastic Compound for Electronic Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Epoxy Plastic Compound for Electronic Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Epoxy Plastic Compound for Electronic Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Plastic Compound for Electronic Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Plastic Compound for Electronic Packaging, Date of Enter into This Industry
2.9 Epoxy Plastic Compound for Electronic Packaging Market Competitive Situation and Trends
2.9.1 Epoxy Plastic Compound for Electronic Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Plastic Compound for Electronic Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Epoxy Plastic Compound for Electronic Packaging Production by Region
3.1 Global Epoxy Plastic Compound for Electronic Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Region (2019-2030)
3.2.1 Global Epoxy Plastic Compound for Electronic Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Epoxy Plastic Compound for Electronic Packaging by Region (2025-2030)
3.3 Global Epoxy Plastic Compound for Electronic Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Epoxy Plastic Compound for Electronic Packaging Production by Region (2019-2030)
3.4.1 Global Epoxy Plastic Compound for Electronic Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Epoxy Plastic Compound for Electronic Packaging by Region (2025-2030)
3.5 Global Epoxy Plastic Compound for Electronic Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Epoxy Plastic Compound for Electronic Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Plastic Compound for Electronic Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Epoxy Plastic Compound for Electronic Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Epoxy Plastic Compound for Electronic Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Epoxy Plastic Compound for Electronic Packaging Production Value Estimates and Forecasts (2019-2030)
4 Epoxy Plastic Compound for Electronic Packaging Consumption by Region
4.1 Global Epoxy Plastic Compound for Electronic Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Epoxy Plastic Compound for Electronic Packaging Consumption by Region (2019-2030)
4.2.1 Global Epoxy Plastic Compound for Electronic Packaging Consumption by Region (2019-2024)
4.2.2 Global Epoxy Plastic Compound for Electronic Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Epoxy Plastic Compound for Electronic Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Epoxy Plastic Compound for Electronic Packaging Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Plastic Compound for Electronic Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Epoxy Plastic Compound for Electronic Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Plastic Compound for Electronic Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Epoxy Plastic Compound for Electronic Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Plastic Compound for Electronic Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Epoxy Plastic Compound for Electronic Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Epoxy Plastic Compound for Electronic Packaging Production by Type (2019-2030)
5.1.1 Global Epoxy Plastic Compound for Electronic Packaging Production by Type (2019-2024)
5.1.2 Global Epoxy Plastic Compound for Electronic Packaging Production by Type (2025-2030)
5.1.3 Global Epoxy Plastic Compound for Electronic Packaging Production Market Share by Type (2019-2030)
5.2 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Type (2019-2030)
5.2.1 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Type (2019-2024)
5.2.2 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Type (2025-2030)
5.2.3 Global Epoxy Plastic Compound for Electronic Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Epoxy Plastic Compound for Electronic Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Epoxy Plastic Compound for Electronic Packaging Production by Application (2019-2030)
6.1.1 Global Epoxy Plastic Compound for Electronic Packaging Production by Application (2019-2024)
6.1.2 Global Epoxy Plastic Compound for Electronic Packaging Production by Application (2025-2030)
6.1.3 Global Epoxy Plastic Compound for Electronic Packaging Production Market Share by Application (2019-2030)
6.2 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Application (2019-2030)
6.2.1 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Application (2019-2024)
6.2.2 Global Epoxy Plastic Compound for Electronic Packaging Production Value by Application (2025-2030)
6.2.3 Global Epoxy Plastic Compound for Electronic Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Epoxy Plastic Compound for Electronic Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Dow
7.1.1 Dow Epoxy Plastic Compound for Electronic Packaging Corporation Information
7.1.2 Dow Epoxy Plastic Compound for Electronic Packaging Product Portfolio
7.1.3 Dow Epoxy Plastic Compound for Electronic Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Dow Main Business and Markets Served
7.1.5 Dow Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Epoxy Plastic Compound for Electronic Packaging Corporation Information
7.2.2 Henkel Epoxy Plastic Compound for Electronic Packaging Product Portfolio
7.2.3 Henkel Epoxy Plastic Compound for Electronic Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Henkel Main Business and Markets Served
7.2.5 Henkel Recent Developments/Updates
7.3 Sumitomo Chemical
7.3.1 Sumitomo Chemical Epoxy Plastic Compound for Electronic Packaging Corporation Information
7.3.2 Sumitomo Chemical Epoxy Plastic Compound for Electronic Packaging Product Portfolio
7.3.3 Sumitomo Chemical Epoxy Plastic Compound for Electronic Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Sumitomo Chemical Main Business and Markets Served
7.3.5 Sumitomo Chemical Recent Developments/Updates
7.4 Momentive Performance Materials
7.4.1 Momentive Performance Materials Epoxy Plastic Compound for Electronic Packaging Corporation Information
7.4.2 Momentive Performance Materials Epoxy Plastic Compound for Electronic Packaging Product Portfolio
7.4.3 Momentive Performance Materials Epoxy Plastic Compound for Electronic Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Momentive Performance Materials Main Business and Markets Served
7.4.5 Momentive Performance Materials Recent Developments/Updates
7.5 Shin-Etsu Chemical
7.5.1 Shin-Etsu Chemical Epoxy Plastic Compound for Electronic Packaging Corporation Information
7.5.2 Shin-Etsu Chemical Epoxy Plastic Compound for Electronic Packaging Product Portfolio
7.5.3 Shin-Etsu Chemical Epoxy Plastic Compound for Electronic Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Shin-Etsu Chemical Main Business and Markets Served
7.5.5 Shin-Etsu Chemical Recent Developments/Updates
7.6 Huntsman
7.6.1 Huntsman Epoxy Plastic Compound for Electronic Packaging Corporation Information
7.6.2 Huntsman Epoxy Plastic Compound for Electronic Packaging Product Portfolio
7.6.3 Huntsman Epoxy Plastic Compound for Electronic Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Huntsman Main Business and Markets Served
7.6.5 Huntsman Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Plastic Compound for Electronic Packaging Industry Chain Analysis
8.2 Epoxy Plastic Compound for Electronic Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Plastic Compound for Electronic Packaging Production Mode & Process
8.4 Epoxy Plastic Compound for Electronic Packaging Sales and Marketing
8.4.1 Epoxy Plastic Compound for Electronic Packaging Sales Channels
8.4.2 Epoxy Plastic Compound for Electronic Packaging Distributors
8.5 Epoxy Plastic Compound for Electronic Packaging Customers
9 Epoxy Plastic Compound for Electronic Packaging Market Dynamics
9.1 Epoxy Plastic Compound for Electronic Packaging Industry Trends
9.2 Epoxy Plastic Compound for Electronic Packaging Market Drivers
9.3 Epoxy Plastic Compound for Electronic Packaging Market Challenges
9.4 Epoxy Plastic Compound for Electronic Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Dow
Henkel
Sumitomo Chemical
Momentive Performance Materials
Shin-Etsu Chemical
Huntsman

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.

91制片厂