Fabless IC design refers to fabless integrated circuit design. It is a business model in which companies focus on integrated circuit design and development without their own wafer manufacturing plants. Under this model, IC design companies usually only engage in the design and sales of semiconductors, while entrusting chip manufacturing, packaging and testing to chip foundry companies. Companies that adopt the Fabless model can focus on the design and sales of semiconductors. This allows these companies to not only concentrate resources to continue technological innovation and upgrading, but also to independently select advanced process technologies and enter into long-term strategic cooperation with top-ranked chip foundries, thereby making full use of the world's advanced process manufacturing technologies and mature quality management. system. In addition, under the Fabless model, the company will have high market sensitivity, quickly respond to market hot spots and demand changes, quickly launch new products, and focus on improving market development and customer maintenance capabilities. In terms of cost, the Fabless model has a relatively smaller initial capital investment compared to the IDM model. It can give full play to its R&D strength and market development capabilities and quickly achieve large-scale benefits. This report focuses on fabless IC design, including the Analog ICs, Logic ICs, Microcontroller and Microprocessor ICs and Memory ICs.
The global Fabless IC Design market was valued at US$ 203640 million in 2023 and is anticipated to reach US$ 546940 million by 2030, witnessing a CAGR of 13.3% during the forecast period 2024-2030.
Global key players of Fabless IC Design include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, etc. The top five players hold a share about 71%. Asia-Pacific is the largest market, and has a share about 70%, followed by North America and Europe with share 20% and 8%, separately. In terms of product type, IC Design-Logic is the largest segment, accounting for a share of 57%. In terms of application, PCs is the largest field with a share about 29 percent.
This report aims to provide a comprehensive presentation of the global market for Fabless IC Design, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fabless IC Design.
The Fabless IC Design market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Fabless IC Design market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Fabless IC Design companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
NVIDIA
Qualcomm
Broadcom
Advanced Micro Devices, Inc. (AMD)
MediaTek
Marvell Technology Group
Novatek Microelectronics Corp.
Tsinghua Unigroup
Realtek Semiconductor Corporation
OmniVision Technology, Inc
Monolithic Power Systems, Inc. (MPS)
Cirrus Logic, Inc.
Socionext Inc.
LX Semicon
HiSilicon Technologies
Synaptics
Allegro MicroSystems
Himax Technologies
Semtech
Global Unichip Corporation (GUC)
Hygon Information Technology
GigaDevice
Silicon Motion
Ingenic Semiconductor
Raydium
Goodix Limited
Sitronix
Nordic Semiconductor
Silergy
Shanghai Fudan Microelectronics Group
Alchip Technologies
FocalTech
MegaChips Corporation
Elite Semiconductor Microelectronics Technology
SGMICRO
Segment by Type
Analog ICs
Logic ICs
Microcontroller and Microprocessor ICs
Memory ICs
Segment by Application
Mobile Devices
PCs
Automotive
Industrial & Medical
Servers
Network Infrastructure
Appliances/Consumer Goods
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Fabless IC Design company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Fabless IC Design Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Analog ICs
1.2.3 Logic ICs
1.2.4 Microcontroller and Microprocessor ICs
1.2.5 Memory ICs
1.3 Market by Application
1.3.1 Global Fabless IC Design Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Mobile Devices
1.3.3 PCs
1.3.4 Automotive
1.3.5 Industrial & Medical
1.3.6 Servers
1.3.7 Network Infrastructure
1.3.8 Appliances/Consumer Goods
1.3.9 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Fabless IC Design Market Perspective (2019-2030)
2.2 Global Fabless IC Design Growth Trends by Region
2.2.1 Global Fabless IC Design Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Fabless IC Design Historic Market Size by Region (2019-2024)
2.2.3 Fabless IC Design Forecasted Market Size by Region (2025-2030)
2.3 Fabless IC Design Market Dynamics
2.3.1 Fabless IC Design Industry Trends
2.3.2 Fabless IC Design Market Drivers
2.3.3 Fabless IC Design Market Challenges
2.3.4 Fabless IC Design Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Fabless IC Design Players by Revenue
3.1.1 Global Top Fabless IC Design Players by Revenue (2019-2024)
3.1.2 Global Fabless IC Design Revenue Market Share by Players (2019-2024)
3.2 Global Fabless IC Design Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Fabless IC Design Revenue
3.4 Global Fabless IC Design Market Concentration Ratio
3.4.1 Global Fabless IC Design Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Fabless IC Design Revenue in 2023
3.5 Global Key Players of Fabless IC Design Head office and Area Served
3.6 Global Key Players of Fabless IC Design, Product and Application
3.7 Global Key Players of Fabless IC Design, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Fabless IC Design Breakdown Data by Type
4.1 Global Fabless IC Design Historic Market Size by Type (2019-2024)
4.2 Global Fabless IC Design Forecasted Market Size by Type (2025-2030)
5 Fabless IC Design Breakdown Data by Application
5.1 Global Fabless IC Design Historic Market Size by Application (2019-2024)
5.2 Global Fabless IC Design Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Fabless IC Design Market Size (2019-2030)
6.2 North America Fabless IC Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Fabless IC Design Market Size by Country (2019-2024)
6.4 North America Fabless IC Design Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Fabless IC Design Market Size (2019-2030)
7.2 Europe Fabless IC Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Fabless IC Design Market Size by Country (2019-2024)
7.4 Europe Fabless IC Design Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Fabless IC Design Market Size (2019-2030)
8.2 Asia-Pacific Fabless IC Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Fabless IC Design Market Size by Region (2019-2024)
8.4 Asia-Pacific Fabless IC Design Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Fabless IC Design Market Size (2019-2030)
9.2 Latin America Fabless IC Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Fabless IC Design Market Size by Country (2019-2024)
9.4 Latin America Fabless IC Design Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Fabless IC Design Market Size (2019-2030)
10.2 Middle East & Africa Fabless IC Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Fabless IC Design Market Size by Country (2019-2024)
10.4 Middle East & Africa Fabless IC Design Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NVIDIA
11.1.1 NVIDIA Company Details
11.1.2 NVIDIA Business Overview
11.1.3 NVIDIA Fabless IC Design Introduction
11.1.4 NVIDIA Revenue in Fabless IC Design Business (2019-2024)
11.1.5 NVIDIA Recent Development
11.2 Qualcomm
11.2.1 Qualcomm Company Details
11.2.2 Qualcomm Business Overview
11.2.3 Qualcomm Fabless IC Design Introduction
11.2.4 Qualcomm Revenue in Fabless IC Design Business (2019-2024)
11.2.5 Qualcomm Recent Development
11.3 Broadcom
11.3.1 Broadcom Company Details
11.3.2 Broadcom Business Overview
11.3.3 Broadcom Fabless IC Design Introduction
11.3.4 Broadcom Revenue in Fabless IC Design Business (2019-2024)
11.3.5 Broadcom Recent Development
11.4 Advanced Micro Devices, Inc. (AMD)
11.4.1 Advanced Micro Devices, Inc. (AMD) Company Details
11.4.2 Advanced Micro Devices, Inc. (AMD) Business Overview
11.4.3 Advanced Micro Devices, Inc. (AMD) Fabless IC Design Introduction
11.4.4 Advanced Micro Devices, Inc. (AMD) Revenue in Fabless IC Design Business (2019-2024)
11.4.5 Advanced Micro Devices, Inc. (AMD) Recent Development
11.5 MediaTek
11.5.1 MediaTek Company Details
11.5.2 MediaTek Business Overview
11.5.3 MediaTek Fabless IC Design Introduction
11.5.4 MediaTek Revenue in Fabless IC Design Business (2019-2024)
11.5.5 MediaTek Recent Development
11.6 Marvell Technology Group
11.6.1 Marvell Technology Group Company Details
11.6.2 Marvell Technology Group Business Overview
11.6.3 Marvell Technology Group Fabless IC Design Introduction
11.6.4 Marvell Technology Group Revenue in Fabless IC Design Business (2019-2024)
11.6.5 Marvell Technology Group Recent Development
11.7 Novatek Microelectronics Corp.
11.7.1 Novatek Microelectronics Corp. Company Details
11.7.2 Novatek Microelectronics Corp. Business Overview
11.7.3 Novatek Microelectronics Corp. Fabless IC Design Introduction
11.7.4 Novatek Microelectronics Corp. Revenue in Fabless IC Design Business (2019-2024)
11.7.5 Novatek Microelectronics Corp. Recent Development
11.8 Tsinghua Unigroup
11.8.1 Tsinghua Unigroup Company Details
11.8.2 Tsinghua Unigroup Business Overview
11.8.3 Tsinghua Unigroup Fabless IC Design Introduction
11.8.4 Tsinghua Unigroup Revenue in Fabless IC Design Business (2019-2024)
11.8.5 Tsinghua Unigroup Recent Development
11.9 Realtek Semiconductor Corporation
11.9.1 Realtek Semiconductor Corporation Company Details
11.9.2 Realtek Semiconductor Corporation Business Overview
11.9.3 Realtek Semiconductor Corporation Fabless IC Design Introduction
11.9.4 Realtek Semiconductor Corporation Revenue in Fabless IC Design Business (2019-2024)
11.9.5 Realtek Semiconductor Corporation Recent Development
11.10 OmniVision Technology, Inc
11.10.1 OmniVision Technology, Inc Company Details
11.10.2 OmniVision Technology, Inc Business Overview
11.10.3 OmniVision Technology, Inc Fabless IC Design Introduction
11.10.4 OmniVision Technology, Inc Revenue in Fabless IC Design Business (2019-2024)
11.10.5 OmniVision Technology, Inc Recent Development
11.11 Monolithic Power Systems, Inc. (MPS)
11.11.1 Monolithic Power Systems, Inc. (MPS) Company Details
11.11.2 Monolithic Power Systems, Inc. (MPS) Business Overview
11.11.3 Monolithic Power Systems, Inc. (MPS) Fabless IC Design Introduction
11.11.4 Monolithic Power Systems, Inc. (MPS) Revenue in Fabless IC Design Business (2019-2024)
11.11.5 Monolithic Power Systems, Inc. (MPS) Recent Development
11.12 Cirrus Logic, Inc.
11.12.1 Cirrus Logic, Inc. Company Details
11.12.2 Cirrus Logic, Inc. Business Overview
11.12.3 Cirrus Logic, Inc. Fabless IC Design Introduction
11.12.4 Cirrus Logic, Inc. Revenue in Fabless IC Design Business (2019-2024)
11.12.5 Cirrus Logic, Inc. Recent Development
11.13 Socionext Inc.
11.13.1 Socionext Inc. Company Details
11.13.2 Socionext Inc. Business Overview
11.13.3 Socionext Inc. Fabless IC Design Introduction
11.13.4 Socionext Inc. Revenue in Fabless IC Design Business (2019-2024)
11.13.5 Socionext Inc. Recent Development
11.14 LX Semicon
11.14.1 LX Semicon Company Details
11.14.2 LX Semicon Business Overview
11.14.3 LX Semicon Fabless IC Design Introduction
11.14.4 LX Semicon Revenue in Fabless IC Design Business (2019-2024)
11.14.5 LX Semicon Recent Development
11.15 HiSilicon Technologies
11.15.1 HiSilicon Technologies Company Details
11.15.2 HiSilicon Technologies Business Overview
11.15.3 HiSilicon Technologies Fabless IC Design Introduction
11.15.4 HiSilicon Technologies Revenue in Fabless IC Design Business (2019-2024)
11.15.5 HiSilicon Technologies Recent Development
11.16 Synaptics
11.16.1 Synaptics Company Details
11.16.2 Synaptics Business Overview
11.16.3 Synaptics Fabless IC Design Introduction
11.16.4 Synaptics Revenue in Fabless IC Design Business (2019-2024)
11.16.5 Synaptics Recent Development
11.17 Allegro MicroSystems
11.17.1 Allegro MicroSystems Company Details
11.17.2 Allegro MicroSystems Business Overview
11.17.3 Allegro MicroSystems Fabless IC Design Introduction
11.17.4 Allegro MicroSystems Revenue in Fabless IC Design Business (2019-2024)
11.17.5 Allegro MicroSystems Recent Development
11.18 Himax Technologies
11.18.1 Himax Technologies Company Details
11.18.2 Himax Technologies Business Overview
11.18.3 Himax Technologies Fabless IC Design Introduction
11.18.4 Himax Technologies Revenue in Fabless IC Design Business (2019-2024)
11.18.5 Himax Technologies Recent Development
11.19 Semtech
11.19.1 Semtech Company Details
11.19.2 Semtech Business Overview
11.19.3 Semtech Fabless IC Design Introduction
11.19.4 Semtech Revenue in Fabless IC Design Business (2019-2024)
11.19.5 Semtech Recent Development
11.20 Global Unichip Corporation (GUC)
11.20.1 Global Unichip Corporation (GUC) Company Details
11.20.2 Global Unichip Corporation (GUC) Business Overview
11.20.3 Global Unichip Corporation (GUC) Fabless IC Design Introduction
11.20.4 Global Unichip Corporation (GUC) Revenue in Fabless IC Design Business (2019-2024)
11.20.5 Global Unichip Corporation (GUC) Recent Development
11.21 Hygon Information Technology
11.21.1 Hygon Information Technology Company Details
11.21.2 Hygon Information Technology Business Overview
11.21.3 Hygon Information Technology Fabless IC Design Introduction
11.21.4 Hygon Information Technology Revenue in Fabless IC Design Business (2019-2024)
11.21.5 Hygon Information Technology Recent Development
11.22 GigaDevice
11.22.1 GigaDevice Company Details
11.22.2 GigaDevice Business Overview
11.22.3 GigaDevice Fabless IC Design Introduction
11.22.4 GigaDevice Revenue in Fabless IC Design Business (2019-2024)
11.22.5 GigaDevice Recent Development
11.23 Silicon Motion
11.23.1 Silicon Motion Company Details
11.23.2 Silicon Motion Business Overview
11.23.3 Silicon Motion Fabless IC Design Introduction
11.23.4 Silicon Motion Revenue in Fabless IC Design Business (2019-2024)
11.23.5 Silicon Motion Recent Development
11.24 Ingenic Semiconductor
11.24.1 Ingenic Semiconductor Company Details
11.24.2 Ingenic Semiconductor Business Overview
11.24.3 Ingenic Semiconductor Fabless IC Design Introduction
11.24.4 Ingenic Semiconductor Revenue in Fabless IC Design Business (2019-2024)
11.24.5 Ingenic Semiconductor Recent Development
11.25 Raydium
11.25.1 Raydium Company Details
11.25.2 Raydium Business Overview
11.25.3 Raydium Fabless IC Design Introduction
11.25.4 Raydium Revenue in Fabless IC Design Business (2019-2024)
11.25.5 Raydium Recent Development
11.26 Goodix Limited
11.26.1 Goodix Limited Company Details
11.26.2 Goodix Limited Business Overview
11.26.3 Goodix Limited Fabless IC Design Introduction
11.26.4 Goodix Limited Revenue in Fabless IC Design Business (2019-2024)
11.26.5 Goodix Limited Recent Development
11.27 Sitronix
11.27.1 Sitronix Company Details
11.27.2 Sitronix Business Overview
11.27.3 Sitronix Fabless IC Design Introduction
11.27.4 Sitronix Revenue in Fabless IC Design Business (2019-2024)
11.27.5 Sitronix Recent Development
11.28 Nordic Semiconductor
11.28.1 Nordic Semiconductor Company Details
11.28.2 Nordic Semiconductor Business Overview
11.28.3 Nordic Semiconductor Fabless IC Design Introduction
11.28.4 Nordic Semiconductor Revenue in Fabless IC Design Business (2019-2024)
11.28.5 Nordic Semiconductor Recent Development
11.29 Silergy
11.29.1 Silergy Company Details
11.29.2 Silergy Business Overview
11.29.3 Silergy Fabless IC Design Introduction
11.29.4 Silergy Revenue in Fabless IC Design Business (2019-2024)
11.29.5 Silergy Recent Development
11.30 Shanghai Fudan Microelectronics Group
11.30.1 Shanghai Fudan Microelectronics Group Company Details
11.30.2 Shanghai Fudan Microelectronics Group Business Overview
11.30.3 Shanghai Fudan Microelectronics Group Fabless IC Design Introduction
11.30.4 Shanghai Fudan Microelectronics Group Revenue in Fabless IC Design Business (2019-2024)
11.30.5 Shanghai Fudan Microelectronics Group Recent Development
11.31 Alchip Technologies
11.31.1 Alchip Technologies Company Details
11.31.2 Alchip Technologies Business Overview
11.31.3 Alchip Technologies Fabless IC Design Introduction
11.31.4 Alchip Technologies Revenue in Fabless IC Design Business (2019-2024)
11.31.5 Alchip Technologies Recent Development
11.32 FocalTech
11.32.1 FocalTech Company Details
11.32.2 FocalTech Business Overview
11.32.3 FocalTech Fabless IC Design Introduction
11.32.4 FocalTech Revenue in Fabless IC Design Business (2019-2024)
11.32.5 FocalTech Recent Development
11.33 MegaChips Corporation
11.33.1 MegaChips Corporation Company Details
11.33.2 MegaChips Corporation Business Overview
11.33.3 MegaChips Corporation Fabless IC Design Introduction
11.33.4 MegaChips Corporation Revenue in Fabless IC Design Business (2019-2024)
11.33.5 MegaChips Corporation Recent Development
11.34 Elite Semiconductor Microelectronics Technology
11.34.1 Elite Semiconductor Microelectronics Technology Company Details
11.34.2 Elite Semiconductor Microelectronics Technology Business Overview
11.34.3 Elite Semiconductor Microelectronics Technology Fabless IC Design Introduction
11.34.4 Elite Semiconductor Microelectronics Technology Revenue in Fabless IC Design Business (2019-2024)
11.34.5 Elite Semiconductor Microelectronics Technology Recent Development
11.35 SGMICRO
11.35.1 SGMICRO Company Details
11.35.2 SGMICRO Business Overview
11.35.3 SGMICRO Fabless IC Design Introduction
11.35.4 SGMICRO Revenue in Fabless IC Design Business (2019-2024)
11.35.5 SGMICRO Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
NVIDIA
Qualcomm
Broadcom
Advanced Micro Devices, Inc. (AMD)
MediaTek
Marvell Technology Group
Novatek Microelectronics Corp.
Tsinghua Unigroup
Realtek Semiconductor Corporation
OmniVision Technology, Inc
Monolithic Power Systems, Inc. (MPS)
Cirrus Logic, Inc.
Socionext Inc.
LX Semicon
HiSilicon Technologies
Synaptics
Allegro MicroSystems
Himax Technologies
Semtech
Global Unichip Corporation (GUC)
Hygon Information Technology
GigaDevice
Silicon Motion
Ingenic Semiconductor
Raydium
Goodix Limited
Sitronix
Nordic Semiconductor
Silergy
Shanghai Fudan Microelectronics Group
Alchip Technologies
FocalTech
MegaChips Corporation
Elite Semiconductor Microelectronics Technology
SGMICRO
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*If Applicable.
