Fan-Out Packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very precisely positioning the known-good chips on a thin 鈥渞econstituted鈥� or carrier wafer/panel, which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip and fan-out area), and then forming solder balls on top.
Market Analysis and Insights: Global Fan-Out Packaging Market
The global Fan-Out Packaging market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for Fan-Out Packaging is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The China market for Fan-Out Packaging is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The Europe market for Fan-Out Packaging is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The global key companies of Fan-Out Packaging include ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC and Onto Innovation, etc. In 2023, the global top five players had a share approximately % in terms of revenue.
Fan-Out Packaging is widely used in various fields, such as Consumer Electronics, Automobile Industry, Aerospace and Defense and Telecom Industry, etc. Consumer Electronics provides greatest supports to the Fan-Out Packaging industry development. In 2023, global % revenue of Fan-Out Packaging went into Consumer Electronics filed and the proportion will reach to % in 2030.
Report Covers:
This report presents an overview of global market for Fan-Out Packaging market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Fan-Out Packaging, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Fan-Out Packaging, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Fan-Out Packaging revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Fan-Out Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Fan-Out Packaging revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
Segment by Type
Core Fan-Out Packaging
High-Density Fan-Out Packaging
Segment by Application
Consumer Electronics
Automobile Industry
Aerospace and Defense
Telecom Industry
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Fan-Out Packaging in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Fan-Out Packaging companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Fan-Out Packaging revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Fan-Out Packaging Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Core Fan-Out Packaging
1.2.3 High-Density Fan-Out Packaging
1.3 Market by Application
1.3.1 Global Fan-Out Packaging Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automobile Industry
1.3.4 Aerospace and Defense
1.3.5 Telecom Industry
1.3.6 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Fan-Out Packaging Market Perspective (2019-2030)
2.2 Global Fan-Out Packaging Growth Trends by Region
2.2.1 Fan-Out Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Fan-Out Packaging Historic Market Size by Region (2019-2024)
2.2.3 Fan-Out Packaging Forecasted Market Size by Region (2025-2030)
2.3 Fan-Out Packaging Market Dynamics
2.3.1 Fan-Out Packaging Industry Trends
2.3.2 Fan-Out Packaging Market Drivers
2.3.3 Fan-Out Packaging Market Challenges
2.3.4 Fan-Out Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Fan-Out Packaging by Players
3.1.1 Global Fan-Out Packaging Revenue by Players (2019-2024)
3.1.2 Global Fan-Out Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Fan-Out Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Fan-Out Packaging, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Fan-Out Packaging Market Concentration Ratio
3.4.1 Global Fan-Out Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Fan-Out Packaging Revenue in 2023
3.5 Global Key Players of Fan-Out Packaging Head office and Area Served
3.6 Global Key Players of Fan-Out Packaging, Product and Application
3.7 Global Key Players of Fan-Out Packaging, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Fan-Out Packaging Breakdown Data by Type
4.1 Global Fan-Out Packaging Historic Market Size by Type (2019-2024)
4.2 Global Fan-Out Packaging Forecasted Market Size by Type (2025-2030)
5 Fan-Out Packaging Breakdown Data by Application
5.1 Global Fan-Out Packaging Historic Market Size by Application (2019-2024)
5.2 Global Fan-Out Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Fan-Out Packaging Market Size (2019-2030)
6.2 North America Fan-Out Packaging Market Size by Type
6.2.1 North America Fan-Out Packaging Market Size by Type (2019-2024)
6.2.2 North America Fan-Out Packaging Market Size by Type (2025-2030)
6.2.3 North America Fan-Out Packaging Market Share by Type (2019-2030)
6.3 North America Fan-Out Packaging Market Size by Application
6.3.1 North America Fan-Out Packaging Market Size by Application (2019-2024)
6.3.2 North America Fan-Out Packaging Market Size by Application (2025-2030)
6.3.3 North America Fan-Out Packaging Market Share by Application (2019-2030)
6.4 North America Fan-Out Packaging Market Size by Country
6.4.1 North America Fan-Out Packaging Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Fan-Out Packaging Market Size by Country (2019-2024)
6.4.3 North America Fan-Out Packaging Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe Fan-Out Packaging Market Size (2019-2030)
7.2 Europe Fan-Out Packaging Market Size by Type
7.2.1 Europe Fan-Out Packaging Market Size by Type (2019-2024)
7.2.2 Europe Fan-Out Packaging Market Size by Type (2025-2030)
7.2.3 Europe Fan-Out Packaging Market Share by Type (2019-2030)
7.3 Europe Fan-Out Packaging Market Size by Application
7.3.1 Europe Fan-Out Packaging Market Size by Application (2019-2024)
7.3.2 Europe Fan-Out Packaging Market Size by Application (2025-2030)
7.3.3 Europe Fan-Out Packaging Market Share by Application (2019-2030)
7.4 Europe Fan-Out Packaging Market Size by Country
7.4.1 Europe Fan-Out Packaging Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Fan-Out Packaging Market Size by Country (2019-2024)
7.4.3 Europe Fan-Out Packaging Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Fan-Out Packaging Market Size (2019-2030)
8.2 China Fan-Out Packaging Market Size by Type
8.2.1 China Fan-Out Packaging Market Size by Type (2019-2024)
8.2.2 China Fan-Out Packaging Market Size by Type (2025-2030)
8.2.3 China Fan-Out Packaging Market Share by Type (2019-2030)
8.3 China Fan-Out Packaging Market Size by Application
8.3.1 China Fan-Out Packaging Market Size by Application (2019-2024)
8.3.2 China Fan-Out Packaging Market Size by Application (2025-2030)
8.3.3 China Fan-Out Packaging Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Fan-Out Packaging Market Size (2019-2030)
9.2 Asia Fan-Out Packaging Market Size by Type
9.2.1 Asia Fan-Out Packaging Market Size by Type (2019-2024)
9.2.2 Asia Fan-Out Packaging Market Size by Type (2025-2030)
9.2.3 Asia Fan-Out Packaging Market Share by Type (2019-2030)
9.3 Asia Fan-Out Packaging Market Size by Application
9.3.1 Asia Fan-Out Packaging Market Size by Application (2019-2024)
9.3.2 Asia Fan-Out Packaging Market Size by Application (2025-2030)
9.3.3 Asia Fan-Out Packaging Market Share by Application (2019-2030)
9.4 Asia Fan-Out Packaging Market Size by Region
9.4.1 Asia Fan-Out Packaging Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Fan-Out Packaging Market Size by Region (2019-2024)
9.4.3 Asia Fan-Out Packaging Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Fan-Out Packaging Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Type
10.2.1 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Fan-Out Packaging Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Application
10.3.1 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Fan-Out Packaging Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Country
10.4.1 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Fan-Out Packaging Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 ASE Group
11.1.1 ASE Group Company Details
11.1.2 ASE Group Business Overview
11.1.3 ASE Group Fan-Out Packaging Introduction
11.1.4 ASE Group Revenue in Fan-Out Packaging Business (2019-2024)
11.1.5 ASE Group Recent Developments
11.2 YoleDeveloppement
11.2.1 YoleDeveloppement Company Details
11.2.2 YoleDeveloppement Business Overview
11.2.3 YoleDeveloppement Fan-Out Packaging Introduction
11.2.4 YoleDeveloppement Revenue in Fan-Out Packaging Business (2019-2024)
11.2.5 YoleDeveloppement Recent Developments
11.3 Atotech
11.3.1 Atotech Company Details
11.3.2 Atotech Business Overview
11.3.3 Atotech Fan-Out Packaging Introduction
11.3.4 Atotech Revenue in Fan-Out Packaging Business (2019-2024)
11.3.5 Atotech Recent Developments
11.4 NXP
11.4.1 NXP Company Details
11.4.2 NXP Business Overview
11.4.3 NXP Fan-Out Packaging Introduction
11.4.4 NXP Revenue in Fan-Out Packaging Business (2019-2024)
11.4.5 NXP Recent Developments
11.5 Camtek
11.5.1 Camtek Company Details
11.5.2 Camtek Business Overview
11.5.3 Camtek Fan-Out Packaging Introduction
11.5.4 Camtek Revenue in Fan-Out Packaging Business (2019-2024)
11.5.5 Camtek Recent Developments
11.6 STATS ChipPAC
11.6.1 STATS ChipPAC Company Details
11.6.2 STATS ChipPAC Business Overview
11.6.3 STATS ChipPAC Fan-Out Packaging Introduction
11.6.4 STATS ChipPAC Revenue in Fan-Out Packaging Business (2019-2024)
11.6.5 STATS ChipPAC Recent Developments
11.7 Deca Technologies
11.7.1 Deca Technologies Company Details
11.7.2 Deca Technologies Business Overview
11.7.3 Deca Technologies Fan-Out Packaging Introduction
11.7.4 Deca Technologies Revenue in Fan-Out Packaging Business (2019-2024)
11.7.5 Deca Technologies Recent Developments
11.8 INTEVAC
11.8.1 INTEVAC Company Details
11.8.2 INTEVAC Business Overview
11.8.3 INTEVAC Fan-Out Packaging Introduction
11.8.4 INTEVAC Revenue in Fan-Out Packaging Business (2019-2024)
11.8.5 INTEVAC Recent Developments
11.9 Onto Innovation
11.9.1 Onto Innovation Company Details
11.9.2 Onto Innovation Business Overview
11.9.3 Onto Innovation Fan-Out Packaging Introduction
11.9.4 Onto Innovation Revenue in Fan-Out Packaging Business (2019-2024)
11.9.5 Onto Innovation Recent Developments
11.10 Amkor Technology Inc.
11.10.1 Amkor Technology Inc. Company Details
11.10.2 Amkor Technology Inc. Business Overview
11.10.3 Amkor Technology Inc. Fan-Out Packaging Introduction
11.10.4 Amkor Technology Inc. Revenue in Fan-Out Packaging Business (2019-2024)
11.10.5 Amkor Technology Inc. Recent Developments
11.11 Samsung Electro-Mechanics
11.11.1 Samsung Electro-Mechanics Company Details
11.11.2 Samsung Electro-Mechanics Business Overview
11.11.3 Samsung Electro-Mechanics Fan-Out Packaging Introduction
11.11.4 Samsung Electro-Mechanics Revenue in Fan-Out Packaging Business (2019-2024)
11.11.5 Samsung Electro-Mechanics Recent Developments
11.12 Powertech Technology Inc.
11.12.1 Powertech Technology Inc. Company Details
11.12.2 Powertech Technology Inc. Business Overview
11.12.3 Powertech Technology Inc. Fan-Out Packaging Introduction
11.12.4 Powertech Technology Inc. Revenue in Fan-Out Packaging Business (2019-2024)
11.12.5 Powertech Technology Inc. Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
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*If Applicable.
