Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.
The global Flip Chip Ball Grid Array (FCBGA) market was valued at US$ 4369 million in 2022 and is anticipated to reach US$ 6448.7 million by 2029, witnessing a CAGR of 5.6% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of FC BGA (ABF (Ajinomoto Build-up Film) Substrate) include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, etc. The top five players hold a share over 68%. Asia-Pacific is the largest market, has a share about 77%, followed by North America and Europe, with share 13% and 7%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, occupied for a share of 75%, and in terms of application, PCs has a share about 57 percent.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Flip Chip Ball Grid Array (FCBGA), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Ball Grid Array (FCBGA).
The Flip Chip Ball Grid Array (FCBGA) market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Flip Chip Ball Grid Array (FCBGA) market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip Chip Ball Grid Array (FCBGA) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
础罢锛哠
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China
Segment by Type
Below 8 Layer
8-20 Layer
Others
Segment by Application
CPU
ASIC
GPU
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip Chip Ball Grid Array (FCBGA) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip Chip Ball Grid Array (FCBGA) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip Chip Ball Grid Array (FCBGA) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Flip Chip Ball Grid Array (FCBGA) Market Overview
1.1 Product Definition
1.2 Flip Chip Ball Grid Array (FCBGA) Segment by Type
1.2.1 Global Flip Chip Ball Grid Array (FCBGA) Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Below 8 Layer
1.2.3 8-20 Layer
1.2.4 Others
1.3 Flip Chip Ball Grid Array (FCBGA) Segment by Application
1.3.1 Global Flip Chip Ball Grid Array (FCBGA) Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 CPU
1.3.3 ASIC
1.3.4 GPU
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Flip Chip Ball Grid Array (FCBGA) Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Flip Chip Ball Grid Array (FCBGA) Production Estimates and Forecasts (2018-2029)
1.4.4 Global Flip Chip Ball Grid Array (FCBGA) Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Flip Chip Ball Grid Array (FCBGA) Production Market Share by Manufacturers (2018-2023)
2.2 Global Flip Chip Ball Grid Array (FCBGA) Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Flip Chip Ball Grid Array (FCBGA), Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Flip Chip Ball Grid Array (FCBGA) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Flip Chip Ball Grid Array (FCBGA) Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Flip Chip Ball Grid Array (FCBGA), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Flip Chip Ball Grid Array (FCBGA), Product Offered and Application
2.8 Global Key Manufacturers of Flip Chip Ball Grid Array (FCBGA), Date of Enter into This Industry
2.9 Flip Chip Ball Grid Array (FCBGA) Market Competitive Situation and Trends
2.9.1 Flip Chip Ball Grid Array (FCBGA) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Flip Chip Ball Grid Array (FCBGA) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Flip Chip Ball Grid Array (FCBGA) Production by Region
3.1 Global Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Region (2018-2029)
3.2.1 Global Flip Chip Ball Grid Array (FCBGA) Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Flip Chip Ball Grid Array (FCBGA) by Region (2024-2029)
3.3 Global Flip Chip Ball Grid Array (FCBGA) Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Flip Chip Ball Grid Array (FCBGA) Production by Region (2018-2029)
3.4.1 Global Flip Chip Ball Grid Array (FCBGA) Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Flip Chip Ball Grid Array (FCBGA) by Region (2024-2029)
3.5 Global Flip Chip Ball Grid Array (FCBGA) Market Price Analysis by Region (2018-2023)
3.6 Global Flip Chip Ball Grid Array (FCBGA) Production and Value, Year-over-Year Growth
3.6.1 North America Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Flip Chip Ball Grid Array (FCBGA) Production Value Estimates and Forecasts (2018-2029)
4 Flip Chip Ball Grid Array (FCBGA) Consumption by Region
4.1 Global Flip Chip Ball Grid Array (FCBGA) Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Flip Chip Ball Grid Array (FCBGA) Consumption by Region (2018-2029)
4.2.1 Global Flip Chip Ball Grid Array (FCBGA) Consumption by Region (2018-2023)
4.2.2 Global Flip Chip Ball Grid Array (FCBGA) Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Flip Chip Ball Grid Array (FCBGA) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Flip Chip Ball Grid Array (FCBGA) Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Flip Chip Ball Grid Array (FCBGA) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Flip Chip Ball Grid Array (FCBGA) Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Flip Chip Ball Grid Array (FCBGA) Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Flip Chip Ball Grid Array (FCBGA) Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Flip Chip Ball Grid Array (FCBGA) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Flip Chip Ball Grid Array (FCBGA) Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Flip Chip Ball Grid Array (FCBGA) Production by Type (2018-2029)
5.1.1 Global Flip Chip Ball Grid Array (FCBGA) Production by Type (2018-2023)
5.1.2 Global Flip Chip Ball Grid Array (FCBGA) Production by Type (2024-2029)
5.1.3 Global Flip Chip Ball Grid Array (FCBGA) Production Market Share by Type (2018-2029)
5.2 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Type (2018-2029)
5.2.1 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Type (2018-2023)
5.2.2 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Type (2024-2029)
5.2.3 Global Flip Chip Ball Grid Array (FCBGA) Production Value Market Share by Type (2018-2029)
5.3 Global Flip Chip Ball Grid Array (FCBGA) Price by Type (2018-2029)
6 Segment by Application
6.1 Global Flip Chip Ball Grid Array (FCBGA) Production by Application (2018-2029)
6.1.1 Global Flip Chip Ball Grid Array (FCBGA) Production by Application (2018-2023)
6.1.2 Global Flip Chip Ball Grid Array (FCBGA) Production by Application (2024-2029)
6.1.3 Global Flip Chip Ball Grid Array (FCBGA) Production Market Share by Application (2018-2029)
6.2 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Application (2018-2029)
6.2.1 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Application (2018-2023)
6.2.2 Global Flip Chip Ball Grid Array (FCBGA) Production Value by Application (2024-2029)
6.2.3 Global Flip Chip Ball Grid Array (FCBGA) Production Value Market Share by Application (2018-2029)
6.3 Global Flip Chip Ball Grid Array (FCBGA) Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.1.2 Unimicron Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.1.3 Unimicron Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.2.2 Ibiden Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.2.3 Ibiden Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Samsung Electro-Mechanics
7.3.1 Samsung Electro-Mechanics Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.3.2 Samsung Electro-Mechanics Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.3.3 Samsung Electro-Mechanics Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Samsung Electro-Mechanics Main Business and Markets Served
7.3.5 Samsung Electro-Mechanics Recent Developments/Updates
7.4 Amkor Technology
7.4.1 Amkor Technology Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.4.2 Amkor Technology Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.4.3 Amkor Technology Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Amkor Technology Main Business and Markets Served
7.4.5 Amkor Technology Recent Developments/Updates
7.5 Fujitsu
7.5.1 Fujitsu Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.5.2 Fujitsu Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.5.3 Fujitsu Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Fujitsu Main Business and Markets Served
7.5.5 Fujitsu Recent Developments/Updates
7.6 TOPPAN INC
7.6.1 TOPPAN INC Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.6.2 TOPPAN INC Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.6.3 TOPPAN INC Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.6.4 TOPPAN INC Main Business and Markets Served
7.6.5 TOPPAN INC Recent Developments/Updates
7.7 Shinko Electric
7.7.1 Shinko Electric Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.7.2 Shinko Electric Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.7.3 Shinko Electric Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Shinko Electric Main Business and Markets Served
7.7.5 Shinko Electric Recent Developments/Updates
7.8 Nan Ya PCB Corporation
7.8.1 Nan Ya PCB Corporation Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.8.2 Nan Ya PCB Corporation Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.8.3 Nan Ya PCB Corporation Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Nan Ya PCB Corporation Main Business and Markets Served
7.7.5 Nan Ya PCB Corporation Recent Developments/Updates
7.9 础罢锛哠
7.9.1 础罢锛哠 Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.9.2 础罢锛哠 Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.9.3 础罢锛哠 Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.9.4 础罢锛哠 Main Business and Markets Served
7.9.5 础罢锛哠 Recent Developments/Updates
7.10 Daeduck Electronics
7.10.1 Daeduck Electronics Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.10.2 Daeduck Electronics Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.10.3 Daeduck Electronics Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Daeduck Electronics Main Business and Markets Served
7.10.5 Daeduck Electronics Recent Developments/Updates
7.11 Kinsus Interconnect Technology
7.11.1 Kinsus Interconnect Technology Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.11.2 Kinsus Interconnect Technology Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.11.3 Kinsus Interconnect Technology Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Kinsus Interconnect Technology Main Business and Markets Served
7.11.5 Kinsus Interconnect Technology Recent Developments/Updates
7.12 Zdtco
7.12.1 Zdtco Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.12.2 Zdtco Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.12.3 Zdtco Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Zdtco Main Business and Markets Served
7.12.5 Zdtco Recent Developments/Updates
7.13 KYOCERA
7.13.1 KYOCERA Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.13.2 KYOCERA Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.13.3 KYOCERA Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.13.4 KYOCERA Main Business and Markets Served
7.13.5 KYOCERA Recent Developments/Updates
7.14 NCAP China
7.14.1 NCAP China Flip Chip Ball Grid Array (FCBGA) Corporation Information
7.14.2 NCAP China Flip Chip Ball Grid Array (FCBGA) Product Portfolio
7.14.3 NCAP China Flip Chip Ball Grid Array (FCBGA) Production, Value, Price and Gross Margin (2018-2023)
7.14.4 NCAP China Main Business and Markets Served
7.14.5 NCAP China Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Flip Chip Ball Grid Array (FCBGA) Industry Chain Analysis
8.2 Flip Chip Ball Grid Array (FCBGA) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Flip Chip Ball Grid Array (FCBGA) Production Mode & Process
8.4 Flip Chip Ball Grid Array (FCBGA) Sales and Marketing
8.4.1 Flip Chip Ball Grid Array (FCBGA) Sales Channels
8.4.2 Flip Chip Ball Grid Array (FCBGA) Distributors
8.5 Flip Chip Ball Grid Array (FCBGA) Customers
9 Flip Chip Ball Grid Array (FCBGA) Market Dynamics
9.1 Flip Chip Ball Grid Array (FCBGA) Industry Trends
9.2 Flip Chip Ball Grid Array (FCBGA) Market Drivers
9.3 Flip Chip Ball Grid Array (FCBGA) Market Challenges
9.4 Flip Chip Ball Grid Array (FCBGA) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
础罢锛哠
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China
听
听
*If Applicable.
