The global Flip-Chip Bumping market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Flip-Chip Bumping is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Flip-Chip Bumping is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Flip-Chip Bumping include Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, ASE, Raytek Semiconductor,Inc. and Winstek Semiconductor, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Flip-Chip Bumping, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip-Chip Bumping.
The Flip-Chip Bumping market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Flip-Chip Bumping market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip-Chip Bumping manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Intel
Samsung
LB Semicon Inc
DuPont
FINECS
Amkor Technology
ASE
Raytek Semiconductor,Inc.
Winstek Semiconductor
Nepes
JiangYin ChangDian Advanced Packaging
sj company co., LTD.
SJ Semiconductor Co
Chipbond
Chip More
ChipMOS
Shenzhen Tongxingda Technology
MacDermid Alpha Electronics
Jiangsu CAS Microelectronics Integration
Tianshui Huatian Technology
JCET Group
Unisem Group
Powertech Technology Inc.
SFA Semicon
International Micro Industries
Jiangsu nepes Semiconductor
Jiangsu Yidu Technology
Segment by Type
Copper Pillar Bump (CPB)
CuNiAu Bumping
Sn Bumping
Gold Bump
Lead Free Bump
Others
Segment by Application
300mm Wafer
200mm Wafer
Production by Region
North America
Europe
China
Japan
China Taiwan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip-Chip Bumping manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip-Chip Bumping by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip-Chip Bumping in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Flip-Chip Bumping Market Overview
1.1 Product Definition
1.2 Flip-Chip Bumping Segment by Type
1.2.1 Global Flip-Chip Bumping Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Copper Pillar Bump (CPB)
1.2.3 CuNiAu Bumping
1.2.4 Sn Bumping
1.2.5 Gold Bump
1.2.6 Lead Free Bump
1.2.7 Others
1.3 Flip-Chip Bumping Segment by Application
1.3.1 Global Flip-Chip Bumping Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 300mm Wafer
1.3.3 200mm Wafer
1.4 Global Market Growth Prospects
1.4.1 Global Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Flip-Chip Bumping Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Flip-Chip Bumping Production Estimates and Forecasts (2018-2029)
1.4.4 Global Flip-Chip Bumping Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Flip-Chip Bumping Production Market Share by Manufacturers (2018-2023)
2.2 Global Flip-Chip Bumping Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Flip-Chip Bumping, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Flip-Chip Bumping Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Flip-Chip Bumping Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Flip-Chip Bumping, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Flip-Chip Bumping, Product Offered and Application
2.8 Global Key Manufacturers of Flip-Chip Bumping, Date of Enter into This Industry
2.9 Flip-Chip Bumping Market Competitive Situation and Trends
2.9.1 Flip-Chip Bumping Market Concentration Rate
2.9.2 Global 5 and 10 Largest Flip-Chip Bumping Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Flip-Chip Bumping Production by Region
3.1 Global Flip-Chip Bumping Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Flip-Chip Bumping Production Value by Region (2018-2029)
3.2.1 Global Flip-Chip Bumping Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Flip-Chip Bumping by Region (2024-2029)
3.3 Global Flip-Chip Bumping Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Flip-Chip Bumping Production by Region (2018-2029)
3.4.1 Global Flip-Chip Bumping Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Flip-Chip Bumping by Region (2024-2029)
3.5 Global Flip-Chip Bumping Market Price Analysis by Region (2018-2023)
3.6 Global Flip-Chip Bumping Production and Value, Year-over-Year Growth
3.6.1 North America Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
3.6.5 China Taiwan Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
3.6.6 South Korea Flip-Chip Bumping Production Value Estimates and Forecasts (2018-2029)
4 Flip-Chip Bumping Consumption by Region
4.1 Global Flip-Chip Bumping Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Flip-Chip Bumping Consumption by Region (2018-2029)
4.2.1 Global Flip-Chip Bumping Consumption by Region (2018-2023)
4.2.2 Global Flip-Chip Bumping Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Flip-Chip Bumping Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Flip-Chip Bumping Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Flip-Chip Bumping Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Flip-Chip Bumping Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Flip-Chip Bumping Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Flip-Chip Bumping Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Flip-Chip Bumping Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Flip-Chip Bumping Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Flip-Chip Bumping Production by Type (2018-2029)
5.1.1 Global Flip-Chip Bumping Production by Type (2018-2023)
5.1.2 Global Flip-Chip Bumping Production by Type (2024-2029)
5.1.3 Global Flip-Chip Bumping Production Market Share by Type (2018-2029)
5.2 Global Flip-Chip Bumping Production Value by Type (2018-2029)
5.2.1 Global Flip-Chip Bumping Production Value by Type (2018-2023)
5.2.2 Global Flip-Chip Bumping Production Value by Type (2024-2029)
5.2.3 Global Flip-Chip Bumping Production Value Market Share by Type (2018-2029)
5.3 Global Flip-Chip Bumping Price by Type (2018-2029)
6 Segment by Application
6.1 Global Flip-Chip Bumping Production by Application (2018-2029)
6.1.1 Global Flip-Chip Bumping Production by Application (2018-2023)
6.1.2 Global Flip-Chip Bumping Production by Application (2024-2029)
6.1.3 Global Flip-Chip Bumping Production Market Share by Application (2018-2029)
6.2 Global Flip-Chip Bumping Production Value by Application (2018-2029)
6.2.1 Global Flip-Chip Bumping Production Value by Application (2018-2023)
6.2.2 Global Flip-Chip Bumping Production Value by Application (2024-2029)
6.2.3 Global Flip-Chip Bumping Production Value Market Share by Application (2018-2029)
6.3 Global Flip-Chip Bumping Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Intel
7.1.1 Intel Flip-Chip Bumping Corporation Information
7.1.2 Intel Flip-Chip Bumping Product Portfolio
7.1.3 Intel Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Intel Main Business and Markets Served
7.1.5 Intel Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Flip-Chip Bumping Corporation Information
7.2.2 Samsung Flip-Chip Bumping Product Portfolio
7.2.3 Samsung Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 LB Semicon Inc
7.3.1 LB Semicon Inc Flip-Chip Bumping Corporation Information
7.3.2 LB Semicon Inc Flip-Chip Bumping Product Portfolio
7.3.3 LB Semicon Inc Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.3.4 LB Semicon Inc Main Business and Markets Served
7.3.5 LB Semicon Inc Recent Developments/Updates
7.4 DuPont
7.4.1 DuPont Flip-Chip Bumping Corporation Information
7.4.2 DuPont Flip-Chip Bumping Product Portfolio
7.4.3 DuPont Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.4.4 DuPont Main Business and Markets Served
7.4.5 DuPont Recent Developments/Updates
7.5 FINECS
7.5.1 FINECS Flip-Chip Bumping Corporation Information
7.5.2 FINECS Flip-Chip Bumping Product Portfolio
7.5.3 FINECS Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.5.4 FINECS Main Business and Markets Served
7.5.5 FINECS Recent Developments/Updates
7.6 Amkor Technology
7.6.1 Amkor Technology Flip-Chip Bumping Corporation Information
7.6.2 Amkor Technology Flip-Chip Bumping Product Portfolio
7.6.3 Amkor Technology Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Amkor Technology Main Business and Markets Served
7.6.5 Amkor Technology Recent Developments/Updates
7.7 ASE
7.7.1 ASE Flip-Chip Bumping Corporation Information
7.7.2 ASE Flip-Chip Bumping Product Portfolio
7.7.3 ASE Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.7.4 ASE Main Business and Markets Served
7.7.5 ASE Recent Developments/Updates
7.8 Raytek Semiconductor,Inc.
7.8.1 Raytek Semiconductor,Inc. Flip-Chip Bumping Corporation Information
7.8.2 Raytek Semiconductor,Inc. Flip-Chip Bumping Product Portfolio
7.8.3 Raytek Semiconductor,Inc. Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Raytek Semiconductor,Inc. Main Business and Markets Served
7.7.5 Raytek Semiconductor,Inc. Recent Developments/Updates
7.9 Winstek Semiconductor
7.9.1 Winstek Semiconductor Flip-Chip Bumping Corporation Information
7.9.2 Winstek Semiconductor Flip-Chip Bumping Product Portfolio
7.9.3 Winstek Semiconductor Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Winstek Semiconductor Main Business and Markets Served
7.9.5 Winstek Semiconductor Recent Developments/Updates
7.10 Nepes
7.10.1 Nepes Flip-Chip Bumping Corporation Information
7.10.2 Nepes Flip-Chip Bumping Product Portfolio
7.10.3 Nepes Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Nepes Main Business and Markets Served
7.10.5 Nepes Recent Developments/Updates
7.11 JiangYin ChangDian Advanced Packaging
7.11.1 JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Corporation Information
7.11.2 JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Product Portfolio
7.11.3 JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.11.4 JiangYin ChangDian Advanced Packaging Main Business and Markets Served
7.11.5 JiangYin ChangDian Advanced Packaging Recent Developments/Updates
7.12 sj company co., LTD.
7.12.1 sj company co., LTD. Flip-Chip Bumping Corporation Information
7.12.2 sj company co., LTD. Flip-Chip Bumping Product Portfolio
7.12.3 sj company co., LTD. Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.12.4 sj company co., LTD. Main Business and Markets Served
7.12.5 sj company co., LTD. Recent Developments/Updates
7.13 SJ Semiconductor Co
7.13.1 SJ Semiconductor Co Flip-Chip Bumping Corporation Information
7.13.2 SJ Semiconductor Co Flip-Chip Bumping Product Portfolio
7.13.3 SJ Semiconductor Co Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.13.4 SJ Semiconductor Co Main Business and Markets Served
7.13.5 SJ Semiconductor Co Recent Developments/Updates
7.14 Chipbond
7.14.1 Chipbond Flip-Chip Bumping Corporation Information
7.14.2 Chipbond Flip-Chip Bumping Product Portfolio
7.14.3 Chipbond Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Chipbond Main Business and Markets Served
7.14.5 Chipbond Recent Developments/Updates
7.15 Chip More
7.15.1 Chip More Flip-Chip Bumping Corporation Information
7.15.2 Chip More Flip-Chip Bumping Product Portfolio
7.15.3 Chip More Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Chip More Main Business and Markets Served
7.15.5 Chip More Recent Developments/Updates
7.16 ChipMOS
7.16.1 ChipMOS Flip-Chip Bumping Corporation Information
7.16.2 ChipMOS Flip-Chip Bumping Product Portfolio
7.16.3 ChipMOS Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.16.4 ChipMOS Main Business and Markets Served
7.16.5 ChipMOS Recent Developments/Updates
7.17 Shenzhen Tongxingda Technology
7.17.1 Shenzhen Tongxingda Technology Flip-Chip Bumping Corporation Information
7.17.2 Shenzhen Tongxingda Technology Flip-Chip Bumping Product Portfolio
7.17.3 Shenzhen Tongxingda Technology Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.17.4 Shenzhen Tongxingda Technology Main Business and Markets Served
7.17.5 Shenzhen Tongxingda Technology Recent Developments/Updates
7.18 MacDermid Alpha Electronics
7.18.1 MacDermid Alpha Electronics Flip-Chip Bumping Corporation Information
7.18.2 MacDermid Alpha Electronics Flip-Chip Bumping Product Portfolio
7.18.3 MacDermid Alpha Electronics Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.18.4 MacDermid Alpha Electronics Main Business and Markets Served
7.18.5 MacDermid Alpha Electronics Recent Developments/Updates
7.19 Jiangsu CAS Microelectronics Integration
7.19.1 Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Corporation Information
7.19.2 Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Product Portfolio
7.19.3 Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.19.4 Jiangsu CAS Microelectronics Integration Main Business and Markets Served
7.19.5 Jiangsu CAS Microelectronics Integration Recent Developments/Updates
7.20 Tianshui Huatian Technology
7.20.1 Tianshui Huatian Technology Flip-Chip Bumping Corporation Information
7.20.2 Tianshui Huatian Technology Flip-Chip Bumping Product Portfolio
7.20.3 Tianshui Huatian Technology Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.20.4 Tianshui Huatian Technology Main Business and Markets Served
7.20.5 Tianshui Huatian Technology Recent Developments/Updates
7.21 JCET Group
7.21.1 JCET Group Flip-Chip Bumping Corporation Information
7.21.2 JCET Group Flip-Chip Bumping Product Portfolio
7.21.3 JCET Group Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.21.4 JCET Group Main Business and Markets Served
7.21.5 JCET Group Recent Developments/Updates
7.22 Unisem Group
7.22.1 Unisem Group Flip-Chip Bumping Corporation Information
7.22.2 Unisem Group Flip-Chip Bumping Product Portfolio
7.22.3 Unisem Group Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.22.4 Unisem Group Main Business and Markets Served
7.22.5 Unisem Group Recent Developments/Updates
7.23 Powertech Technology Inc.
7.23.1 Powertech Technology Inc. Flip-Chip Bumping Corporation Information
7.23.2 Powertech Technology Inc. Flip-Chip Bumping Product Portfolio
7.23.3 Powertech Technology Inc. Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.23.4 Powertech Technology Inc. Main Business and Markets Served
7.23.5 Powertech Technology Inc. Recent Developments/Updates
7.24 SFA Semicon
7.24.1 SFA Semicon Flip-Chip Bumping Corporation Information
7.24.2 SFA Semicon Flip-Chip Bumping Product Portfolio
7.24.3 SFA Semicon Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.24.4 SFA Semicon Main Business and Markets Served
7.24.5 SFA Semicon Recent Developments/Updates
7.25 International Micro Industries
7.25.1 International Micro Industries Flip-Chip Bumping Corporation Information
7.25.2 International Micro Industries Flip-Chip Bumping Product Portfolio
7.25.3 International Micro Industries Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.25.4 International Micro Industries Main Business and Markets Served
7.25.5 International Micro Industries Recent Developments/Updates
7.26 Jiangsu nepes Semiconductor
7.26.1 Jiangsu nepes Semiconductor Flip-Chip Bumping Corporation Information
7.26.2 Jiangsu nepes Semiconductor Flip-Chip Bumping Product Portfolio
7.26.3 Jiangsu nepes Semiconductor Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.26.4 Jiangsu nepes Semiconductor Main Business and Markets Served
7.26.5 Jiangsu nepes Semiconductor Recent Developments/Updates
7.27 Jiangsu Yidu Technology
7.27.1 Jiangsu Yidu Technology Flip-Chip Bumping Corporation Information
7.27.2 Jiangsu Yidu Technology Flip-Chip Bumping Product Portfolio
7.27.3 Jiangsu Yidu Technology Flip-Chip Bumping Production, Value, Price and Gross Margin (2018-2023)
7.27.4 Jiangsu Yidu Technology Main Business and Markets Served
7.27.5 Jiangsu Yidu Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Flip-Chip Bumping Industry Chain Analysis
8.2 Flip-Chip Bumping Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Flip-Chip Bumping Production Mode & Process
8.4 Flip-Chip Bumping Sales and Marketing
8.4.1 Flip-Chip Bumping Sales Channels
8.4.2 Flip-Chip Bumping Distributors
8.5 Flip-Chip Bumping Customers
9 Flip-Chip Bumping Market Dynamics
9.1 Flip-Chip Bumping Industry Trends
9.2 Flip-Chip Bumping Market Drivers
9.3 Flip-Chip Bumping Market Challenges
9.4 Flip-Chip Bumping Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Intel
Samsung
LB Semicon Inc
DuPont
FINECS
Amkor Technology
ASE
Raytek Semiconductor,Inc.
Winstek Semiconductor
Nepes
JiangYin ChangDian Advanced Packaging
sj company co., LTD.
SJ Semiconductor Co
Chipbond
Chip More
ChipMOS
Shenzhen Tongxingda Technology
MacDermid Alpha Electronics
Jiangsu CAS Microelectronics Integration
Tianshui Huatian Technology
JCET Group
Unisem Group
Powertech Technology Inc.
SFA Semicon
International Micro Industries
Jiangsu nepes Semiconductor
Jiangsu Yidu Technology
听
听
*If Applicable.
