The global Flip-Chip Package Substrate market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Flip-Chip Package Substrate is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Flip-Chip Package Substrate is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Flip-Chip Package Substrate include Unimicron, Ibiden, Nan Ya PCB, Shiko Electric Industries, AT&S, Kinsus Interconnect Technology, Semco, Kyocera and TOPPAN, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Flip-Chip Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip-Chip Package Substrate.
The Flip-Chip Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Flip-Chip Package Substrate market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip-Chip Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Unimicron
Ibiden
Nan Ya PCB
Shiko Electric Industries
AT&S
Kinsus Interconnect Technology
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
Segment by Type
FCBGA
FCCSP
Segment by Application
High-end servers
GPU
CPU and MPU
ASIC
FPGA
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip-Chip Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip-Chip Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip-Chip Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Flip-Chip Package Substrate Market Overview
1.1 Product Definition
1.2 Flip-Chip Package Substrate Segment by Type
1.2.1 Global Flip-Chip Package Substrate Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 FCBGA
1.2.3 FCCSP
1.3 Flip-Chip Package Substrate Segment by Application
1.3.1 Global Flip-Chip Package Substrate Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 High-end servers
1.3.3 GPU
1.3.4 CPU and MPU
1.3.5 ASIC
1.3.6 FPGA
1.4 Global Market Growth Prospects
1.4.1 Global Flip-Chip Package Substrate Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Flip-Chip Package Substrate Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Flip-Chip Package Substrate Production Estimates and Forecasts (2018-2029)
1.4.4 Global Flip-Chip Package Substrate Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Flip-Chip Package Substrate Production Market Share by Manufacturers (2018-2023)
2.2 Global Flip-Chip Package Substrate Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Flip-Chip Package Substrate, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Flip-Chip Package Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Flip-Chip Package Substrate Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Flip-Chip Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Flip-Chip Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Flip-Chip Package Substrate, Date of Enter into This Industry
2.9 Flip-Chip Package Substrate Market Competitive Situation and Trends
2.9.1 Flip-Chip Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Flip-Chip Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Flip-Chip Package Substrate Production by Region
3.1 Global Flip-Chip Package Substrate Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Flip-Chip Package Substrate Production Value by Region (2018-2029)
3.2.1 Global Flip-Chip Package Substrate Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Flip-Chip Package Substrate by Region (2024-2029)
3.3 Global Flip-Chip Package Substrate Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Flip-Chip Package Substrate Production by Region (2018-2029)
3.4.1 Global Flip-Chip Package Substrate Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Flip-Chip Package Substrate by Region (2024-2029)
3.5 Global Flip-Chip Package Substrate Market Price Analysis by Region (2018-2023)
3.6 Global Flip-Chip Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Flip-Chip Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Flip-Chip Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Flip-Chip Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Flip-Chip Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Flip-Chip Package Substrate Production Value Estimates and Forecasts (2018-2029)
4 Flip-Chip Package Substrate Consumption by Region
4.1 Global Flip-Chip Package Substrate Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Flip-Chip Package Substrate Consumption by Region (2018-2029)
4.2.1 Global Flip-Chip Package Substrate Consumption by Region (2018-2023)
4.2.2 Global Flip-Chip Package Substrate Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Flip-Chip Package Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Flip-Chip Package Substrate Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Flip-Chip Package Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Flip-Chip Package Substrate Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Flip-Chip Package Substrate Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Flip-Chip Package Substrate Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Flip-Chip Package Substrate Production by Type (2018-2029)
5.1.1 Global Flip-Chip Package Substrate Production by Type (2018-2023)
5.1.2 Global Flip-Chip Package Substrate Production by Type (2024-2029)
5.1.3 Global Flip-Chip Package Substrate Production Market Share by Type (2018-2029)
5.2 Global Flip-Chip Package Substrate Production Value by Type (2018-2029)
5.2.1 Global Flip-Chip Package Substrate Production Value by Type (2018-2023)
5.2.2 Global Flip-Chip Package Substrate Production Value by Type (2024-2029)
5.2.3 Global Flip-Chip Package Substrate Production Value Market Share by Type (2018-2029)
5.3 Global Flip-Chip Package Substrate Price by Type (2018-2029)
6 Segment by Application
6.1 Global Flip-Chip Package Substrate Production by Application (2018-2029)
6.1.1 Global Flip-Chip Package Substrate Production by Application (2018-2023)
6.1.2 Global Flip-Chip Package Substrate Production by Application (2024-2029)
6.1.3 Global Flip-Chip Package Substrate Production Market Share by Application (2018-2029)
6.2 Global Flip-Chip Package Substrate Production Value by Application (2018-2029)
6.2.1 Global Flip-Chip Package Substrate Production Value by Application (2018-2023)
6.2.2 Global Flip-Chip Package Substrate Production Value by Application (2024-2029)
6.2.3 Global Flip-Chip Package Substrate Production Value Market Share by Application (2018-2029)
6.3 Global Flip-Chip Package Substrate Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron Flip-Chip Package Substrate Corporation Information
7.1.2 Unimicron Flip-Chip Package Substrate Product Portfolio
7.1.3 Unimicron Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden Flip-Chip Package Substrate Corporation Information
7.2.2 Ibiden Flip-Chip Package Substrate Product Portfolio
7.2.3 Ibiden Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Nan Ya PCB
7.3.1 Nan Ya PCB Flip-Chip Package Substrate Corporation Information
7.3.2 Nan Ya PCB Flip-Chip Package Substrate Product Portfolio
7.3.3 Nan Ya PCB Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Nan Ya PCB Main Business and Markets Served
7.3.5 Nan Ya PCB Recent Developments/Updates
7.4 Shiko Electric Industries
7.4.1 Shiko Electric Industries Flip-Chip Package Substrate Corporation Information
7.4.2 Shiko Electric Industries Flip-Chip Package Substrate Product Portfolio
7.4.3 Shiko Electric Industries Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Shiko Electric Industries Main Business and Markets Served
7.4.5 Shiko Electric Industries Recent Developments/Updates
7.5 AT&S
7.5.1 AT&S Flip-Chip Package Substrate Corporation Information
7.5.2 AT&S Flip-Chip Package Substrate Product Portfolio
7.5.3 AT&S Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.5.4 AT&S Main Business and Markets Served
7.5.5 AT&S Recent Developments/Updates
7.6 Kinsus Interconnect Technology
7.6.1 Kinsus Interconnect Technology Flip-Chip Package Substrate Corporation Information
7.6.2 Kinsus Interconnect Technology Flip-Chip Package Substrate Product Portfolio
7.6.3 Kinsus Interconnect Technology Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Kinsus Interconnect Technology Main Business and Markets Served
7.6.5 Kinsus Interconnect Technology Recent Developments/Updates
7.7 Semco
7.7.1 Semco Flip-Chip Package Substrate Corporation Information
7.7.2 Semco Flip-Chip Package Substrate Product Portfolio
7.7.3 Semco Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Semco Main Business and Markets Served
7.7.5 Semco Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera Flip-Chip Package Substrate Corporation Information
7.8.2 Kyocera Flip-Chip Package Substrate Product Portfolio
7.8.3 Kyocera Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Kyocera Main Business and Markets Served
7.7.5 Kyocera Recent Developments/Updates
7.9 TOPPAN
7.9.1 TOPPAN Flip-Chip Package Substrate Corporation Information
7.9.2 TOPPAN Flip-Chip Package Substrate Product Portfolio
7.9.3 TOPPAN Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.9.4 TOPPAN Main Business and Markets Served
7.9.5 TOPPAN Recent Developments/Updates
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology Flip-Chip Package Substrate Corporation Information
7.10.2 Zhen Ding Technology Flip-Chip Package Substrate Product Portfolio
7.10.3 Zhen Ding Technology Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Zhen Ding Technology Main Business and Markets Served
7.10.5 Zhen Ding Technology Recent Developments/Updates
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics Flip-Chip Package Substrate Corporation Information
7.11.2 Daeduck Electronics Flip-Chip Package Substrate Product Portfolio
7.11.3 Daeduck Electronics Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Daeduck Electronics Main Business and Markets Served
7.11.5 Daeduck Electronics Recent Developments/Updates
7.12 ASE Material
7.12.1 ASE Material Flip-Chip Package Substrate Corporation Information
7.12.2 ASE Material Flip-Chip Package Substrate Product Portfolio
7.12.3 ASE Material Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.12.4 ASE Material Main Business and Markets Served
7.12.5 ASE Material Recent Developments/Updates
7.13 ACCESS
7.13.1 ACCESS Flip-Chip Package Substrate Corporation Information
7.13.2 ACCESS Flip-Chip Package Substrate Product Portfolio
7.13.3 ACCESS Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.13.4 ACCESS Main Business and Markets Served
7.13.5 ACCESS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Flip-Chip Package Substrate Industry Chain Analysis
8.2 Flip-Chip Package Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Flip-Chip Package Substrate Production Mode & Process
8.4 Flip-Chip Package Substrate Sales and Marketing
8.4.1 Flip-Chip Package Substrate Sales Channels
8.4.2 Flip-Chip Package Substrate Distributors
8.5 Flip-Chip Package Substrate Customers
9 Flip-Chip Package Substrate Market Dynamics
9.1 Flip-Chip Package Substrate Industry Trends
9.2 Flip-Chip Package Substrate Market Drivers
9.3 Flip-Chip Package Substrate Market Challenges
9.4 Flip-Chip Package Substrate Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Unimicron
Ibiden
Nan Ya PCB
Shiko Electric Industries
AT&S
Kinsus Interconnect Technology
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
听
听
*If Applicable.
