A flip chip substrate is a small PCB that sits inside a package, much like any other PCB. The difference is that the substrate size is much smaller than most PCBs you've ever seen. The substrate design includes the layout of all signals from the package outside balls to the bump pads.
The global Flip Chip Substrate market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Flip Chip Substrate is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Flip Chip Substrate is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Flip Chip Substrate include Integra Technologies, Korea Circuit, Samsung Electronics, ASE Group, SHINKO, KLA, Unimicron, Ibiden and Nan Ya PCB, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Flip Chip Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Substrate.
The Flip Chip Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Flip Chip Substrate market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip Chip Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Integra Technologies
Korea Circuit
Samsung Electronics
ASE Group
SHINKO
KLA
Unimicron
Ibiden
Nan Ya PCB
Kinsus Interconnect Technology
AT&S
Kyocera
Toppan
Daeduck Electronics
LG InnoTek
Simmtech
AKM Meadville
Zhen Ding Technology
Shennan Circuit
Segment by Type
Ceramic Substrate
Silicon Substrate
Others
Segment by Application
Integrated Circuit
CPU
Graphics Processing Unit
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip Chip Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip Chip Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip Chip Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Flip Chip Substrate Market Overview
1.1 Product Definition
1.2 Flip Chip Substrate Segment by Type
1.2.1 Global Flip Chip Substrate Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Ceramic Substrate
1.2.3 Silicon Substrate
1.2.4 Others
1.3 Flip Chip Substrate Segment by Application
1.3.1 Global Flip Chip Substrate Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Integrated Circuit
1.3.3 CPU
1.3.4 Graphics Processing Unit
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Flip Chip Substrate Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Flip Chip Substrate Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Flip Chip Substrate Production Estimates and Forecasts (2018-2029)
1.4.4 Global Flip Chip Substrate Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Flip Chip Substrate Production Market Share by Manufacturers (2018-2023)
2.2 Global Flip Chip Substrate Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Flip Chip Substrate, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Flip Chip Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Flip Chip Substrate Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Flip Chip Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Flip Chip Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Flip Chip Substrate, Date of Enter into This Industry
2.9 Flip Chip Substrate Market Competitive Situation and Trends
2.9.1 Flip Chip Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Flip Chip Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Flip Chip Substrate Production by Region
3.1 Global Flip Chip Substrate Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Flip Chip Substrate Production Value by Region (2018-2029)
3.2.1 Global Flip Chip Substrate Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Flip Chip Substrate by Region (2024-2029)
3.3 Global Flip Chip Substrate Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Flip Chip Substrate Production by Region (2018-2029)
3.4.1 Global Flip Chip Substrate Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Flip Chip Substrate by Region (2024-2029)
3.5 Global Flip Chip Substrate Market Price Analysis by Region (2018-2023)
3.6 Global Flip Chip Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Flip Chip Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Flip Chip Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Flip Chip Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Flip Chip Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Flip Chip Substrate Production Value Estimates and Forecasts (2018-2029)
4 Flip Chip Substrate Consumption by Region
4.1 Global Flip Chip Substrate Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Flip Chip Substrate Consumption by Region (2018-2029)
4.2.1 Global Flip Chip Substrate Consumption by Region (2018-2023)
4.2.2 Global Flip Chip Substrate Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Flip Chip Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Flip Chip Substrate Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Flip Chip Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Flip Chip Substrate Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Flip Chip Substrate Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Flip Chip Substrate Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Flip Chip Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Flip Chip Substrate Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Flip Chip Substrate Production by Type (2018-2029)
5.1.1 Global Flip Chip Substrate Production by Type (2018-2023)
5.1.2 Global Flip Chip Substrate Production by Type (2024-2029)
5.1.3 Global Flip Chip Substrate Production Market Share by Type (2018-2029)
5.2 Global Flip Chip Substrate Production Value by Type (2018-2029)
5.2.1 Global Flip Chip Substrate Production Value by Type (2018-2023)
5.2.2 Global Flip Chip Substrate Production Value by Type (2024-2029)
5.2.3 Global Flip Chip Substrate Production Value Market Share by Type (2018-2029)
5.3 Global Flip Chip Substrate Price by Type (2018-2029)
6 Segment by Application
6.1 Global Flip Chip Substrate Production by Application (2018-2029)
6.1.1 Global Flip Chip Substrate Production by Application (2018-2023)
6.1.2 Global Flip Chip Substrate Production by Application (2024-2029)
6.1.3 Global Flip Chip Substrate Production Market Share by Application (2018-2029)
6.2 Global Flip Chip Substrate Production Value by Application (2018-2029)
6.2.1 Global Flip Chip Substrate Production Value by Application (2018-2023)
6.2.2 Global Flip Chip Substrate Production Value by Application (2024-2029)
6.2.3 Global Flip Chip Substrate Production Value Market Share by Application (2018-2029)
6.3 Global Flip Chip Substrate Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Integra Technologies
7.1.1 Integra Technologies Flip Chip Substrate Corporation Information
7.1.2 Integra Technologies Flip Chip Substrate Product Portfolio
7.1.3 Integra Technologies Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Integra Technologies Main Business and Markets Served
7.1.5 Integra Technologies Recent Developments/Updates
7.2 Korea Circuit
7.2.1 Korea Circuit Flip Chip Substrate Corporation Information
7.2.2 Korea Circuit Flip Chip Substrate Product Portfolio
7.2.3 Korea Circuit Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Korea Circuit Main Business and Markets Served
7.2.5 Korea Circuit Recent Developments/Updates
7.3 Samsung Electronics
7.3.1 Samsung Electronics Flip Chip Substrate Corporation Information
7.3.2 Samsung Electronics Flip Chip Substrate Product Portfolio
7.3.3 Samsung Electronics Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Samsung Electronics Main Business and Markets Served
7.3.5 Samsung Electronics Recent Developments/Updates
7.4 ASE Group
7.4.1 ASE Group Flip Chip Substrate Corporation Information
7.4.2 ASE Group Flip Chip Substrate Product Portfolio
7.4.3 ASE Group Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.4.4 ASE Group Main Business and Markets Served
7.4.5 ASE Group Recent Developments/Updates
7.5 SHINKO
7.5.1 SHINKO Flip Chip Substrate Corporation Information
7.5.2 SHINKO Flip Chip Substrate Product Portfolio
7.5.3 SHINKO Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.5.4 SHINKO Main Business and Markets Served
7.5.5 SHINKO Recent Developments/Updates
7.6 KLA
7.6.1 KLA Flip Chip Substrate Corporation Information
7.6.2 KLA Flip Chip Substrate Product Portfolio
7.6.3 KLA Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.6.4 KLA Main Business and Markets Served
7.6.5 KLA Recent Developments/Updates
7.7 Unimicron
7.7.1 Unimicron Flip Chip Substrate Corporation Information
7.7.2 Unimicron Flip Chip Substrate Product Portfolio
7.7.3 Unimicron Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Unimicron Main Business and Markets Served
7.7.5 Unimicron Recent Developments/Updates
7.8 Ibiden
7.8.1 Ibiden Flip Chip Substrate Corporation Information
7.8.2 Ibiden Flip Chip Substrate Product Portfolio
7.8.3 Ibiden Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Ibiden Main Business and Markets Served
7.7.5 Ibiden Recent Developments/Updates
7.9 Nan Ya PCB
7.9.1 Nan Ya PCB Flip Chip Substrate Corporation Information
7.9.2 Nan Ya PCB Flip Chip Substrate Product Portfolio
7.9.3 Nan Ya PCB Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Nan Ya PCB Main Business and Markets Served
7.9.5 Nan Ya PCB Recent Developments/Updates
7.10 Kinsus Interconnect Technology
7.10.1 Kinsus Interconnect Technology Flip Chip Substrate Corporation Information
7.10.2 Kinsus Interconnect Technology Flip Chip Substrate Product Portfolio
7.10.3 Kinsus Interconnect Technology Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Kinsus Interconnect Technology Main Business and Markets Served
7.10.5 Kinsus Interconnect Technology Recent Developments/Updates
7.11 AT&S
7.11.1 AT&S Flip Chip Substrate Corporation Information
7.11.2 AT&S Flip Chip Substrate Product Portfolio
7.11.3 AT&S Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.11.4 AT&S Main Business and Markets Served
7.11.5 AT&S Recent Developments/Updates
7.12 Kyocera
7.12.1 Kyocera Flip Chip Substrate Corporation Information
7.12.2 Kyocera Flip Chip Substrate Product Portfolio
7.12.3 Kyocera Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Kyocera Main Business and Markets Served
7.12.5 Kyocera Recent Developments/Updates
7.13 Toppan
7.13.1 Toppan Flip Chip Substrate Corporation Information
7.13.2 Toppan Flip Chip Substrate Product Portfolio
7.13.3 Toppan Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Toppan Main Business and Markets Served
7.13.5 Toppan Recent Developments/Updates
7.14 Daeduck Electronics
7.14.1 Daeduck Electronics Flip Chip Substrate Corporation Information
7.14.2 Daeduck Electronics Flip Chip Substrate Product Portfolio
7.14.3 Daeduck Electronics Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Daeduck Electronics Main Business and Markets Served
7.14.5 Daeduck Electronics Recent Developments/Updates
7.15 LG InnoTek
7.15.1 LG InnoTek Flip Chip Substrate Corporation Information
7.15.2 LG InnoTek Flip Chip Substrate Product Portfolio
7.15.3 LG InnoTek Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.15.4 LG InnoTek Main Business and Markets Served
7.15.5 LG InnoTek Recent Developments/Updates
7.16 Simmtech
7.16.1 Simmtech Flip Chip Substrate Corporation Information
7.16.2 Simmtech Flip Chip Substrate Product Portfolio
7.16.3 Simmtech Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Simmtech Main Business and Markets Served
7.16.5 Simmtech Recent Developments/Updates
7.17 AKM Meadville
7.17.1 AKM Meadville Flip Chip Substrate Corporation Information
7.17.2 AKM Meadville Flip Chip Substrate Product Portfolio
7.17.3 AKM Meadville Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.17.4 AKM Meadville Main Business and Markets Served
7.17.5 AKM Meadville Recent Developments/Updates
7.18 Zhen Ding Technology
7.18.1 Zhen Ding Technology Flip Chip Substrate Corporation Information
7.18.2 Zhen Ding Technology Flip Chip Substrate Product Portfolio
7.18.3 Zhen Ding Technology Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.18.4 Zhen Ding Technology Main Business and Markets Served
7.18.5 Zhen Ding Technology Recent Developments/Updates
7.19 Shennan Circuit
7.19.1 Shennan Circuit Flip Chip Substrate Corporation Information
7.19.2 Shennan Circuit Flip Chip Substrate Product Portfolio
7.19.3 Shennan Circuit Flip Chip Substrate Production, Value, Price and Gross Margin (2018-2023)
7.19.4 Shennan Circuit Main Business and Markets Served
7.19.5 Shennan Circuit Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Flip Chip Substrate Industry Chain Analysis
8.2 Flip Chip Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Flip Chip Substrate Production Mode & Process
8.4 Flip Chip Substrate Sales and Marketing
8.4.1 Flip Chip Substrate Sales Channels
8.4.2 Flip Chip Substrate Distributors
8.5 Flip Chip Substrate Customers
9 Flip Chip Substrate Market Dynamics
9.1 Flip Chip Substrate Industry Trends
9.2 Flip Chip Substrate Market Drivers
9.3 Flip Chip Substrate Market Challenges
9.4 Flip Chip Substrate Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Integra Technologies
Korea Circuit
Samsung Electronics
ASE Group
SHINKO
KLA
Unimicron
Ibiden
Nan Ya PCB
Kinsus Interconnect Technology
AT&S
Kyocera
Toppan
Daeduck Electronics
LG InnoTek
Simmtech
AKM Meadville
Zhen Ding Technology
Shennan Circuit
听
听
*If Applicable.
