The global market for Fully Automatic Semiconductor Molding Machine was valued at US$ 442 million in the year 2024 and is projected to reach a revised size of US$ 710 million by 2031, growing at a CAGR of 7.1% during the forecast period.
The semiconductor production process includes wafer manufacturing, wafer testing, chip packaging testing and other links. Packaging refers to the process of cutting, wire bonding, molding, trimming and other processes of the processed wafers to enable the integrated circuit to achieve electrical and signal connections with external devices, while providing physical and chemical protection for the integrated circuit. Plastic encapsulation is to protect the chip by injecting liquid resin around the semiconductor chip from the gate and solidifying it.
The roles of Molding products in semiconductor packaging are as follows:
1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging.
2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged.
3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it.
4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.
Semiconductor packaging equipment plays a vital role in the semiconductor manufacturing process, especially in the molding process, ensuring that the chip is protected, the stability of the electrical connection to the external circuit board and enhanced mechanical stability.
In various regions around the world, Semiconductor Molding Systems production areas are mainly distributed in Japan and China, with Japan occupying the majority of the market share. There are still certain differences between China Molding Systems and international leading companies (such as TOWA) in terms of product performance and packaging technology. However, as Chinese companies have continued to achieve breakthroughs in product development technology in recent years, some companies have also occupied a certain market share in the advanced packaging market, such as Tongling Trinity Technology.
The degree of automation of Molding Systems determines the cost of the entire packaging process, such as labor costs and packaging raw material costs. Prices vary greatly between different products, mainly depending on the Press. The greater the number of Presses, the more expensive the price. At present, the share of fully automatic systems is relatively large, reaching 64% in 2023, and is expected to reach 67% by 2030, and will gradually replace manual Molding Systems.
Global Semiconductor Molding Systems companies are mainly located in Japan, China, and Europe. Core companies include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc., among which the Top 3 market share is nearly 77%. The competition in the fully automatic market is fierce, and the main market share is concentrated in the hands of leading companies.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Fully Automatic Semiconductor Molding Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fully Automatic Semiconductor Molding Machine.
The Fully Automatic Semiconductor Molding Machine market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Fully Automatic Semiconductor Molding Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Fully Automatic Semiconductor Molding Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Towa
Besi
ASMPT
I-PEX Inc
Tongling Trinity Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Anhui Zhonghe
by Type
T-Molding
C-Molding
by Application
Advanced Packaging
Traditional Packaging
Production by Region
Japan
Europe
China
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Fully Automatic Semiconductor Molding Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Fully Automatic Semiconductor Molding Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Fully Automatic Semiconductor Molding Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Fully Automatic Semiconductor Molding Machine Market Overview
1.1 Product Definition
1.2 Fully Automatic Semiconductor Molding Machine by Type
1.2.1 Global Fully Automatic Semiconductor Molding Machine Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 T-Molding
1.2.3 C-Molding
1.3 Fully Automatic Semiconductor Molding Machine by Application
1.3.1 Global Fully Automatic Semiconductor Molding Machine Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Advanced Packaging
1.3.3 Traditional Packaging
1.4 Global Market Growth Prospects
1.4.1 Global Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Fully Automatic Semiconductor Molding Machine Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Fully Automatic Semiconductor Molding Machine Production Estimates and Forecasts (2020-2031)
1.4.4 Global Fully Automatic Semiconductor Molding Machine Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Fully Automatic Semiconductor Molding Machine Production Market Share by Manufacturers (2020-2025)
2.2 Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Fully Automatic Semiconductor Molding Machine, Industry Ranking, 2023 VS 2024
2.4 Global Fully Automatic Semiconductor Molding Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Fully Automatic Semiconductor Molding Machine Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Product Offered and Application
2.8 Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Date of Enter into This Industry
2.9 Fully Automatic Semiconductor Molding Machine Market Competitive Situation and Trends
2.9.1 Fully Automatic Semiconductor Molding Machine Market Concentration Rate
2.9.2 Global 5 and 10 Largest Fully Automatic Semiconductor Molding Machine Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Fully Automatic Semiconductor Molding Machine Production by Region
3.1 Global Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Region (2020-2031)
3.2.1 Global Fully Automatic Semiconductor Molding Machine Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Fully Automatic Semiconductor Molding Machine by Region (2026-2031)
3.3 Global Fully Automatic Semiconductor Molding Machine Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Fully Automatic Semiconductor Molding Machine Production Volume by Region (2020-2031)
3.4.1 Global Fully Automatic Semiconductor Molding Machine Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Fully Automatic Semiconductor Molding Machine by Region (2026-2031)
3.5 Global Fully Automatic Semiconductor Molding Machine Market Price Analysis by Region (2020-2025)
3.6 Global Fully Automatic Semiconductor Molding Machine Production and Value, Year-over-Year Growth
3.6.1 Japan Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)
4 Fully Automatic Semiconductor Molding Machine Consumption by Region
4.1 Global Fully Automatic Semiconductor Molding Machine Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2031)
4.2.1 Global Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2025)
4.2.2 Global Fully Automatic Semiconductor Molding Machine Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Fully Automatic Semiconductor Molding Machine Production by Type (2020-2031)
5.1.1 Global Fully Automatic Semiconductor Molding Machine Production by Type (2020-2025)
5.1.2 Global Fully Automatic Semiconductor Molding Machine Production by Type (2026-2031)
5.1.3 Global Fully Automatic Semiconductor Molding Machine Production Market Share by Type (2020-2031)
5.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Type (2020-2031)
5.2.1 Global Fully Automatic Semiconductor Molding Machine Production Value by Type (2020-2025)
5.2.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Type (2026-2031)
5.2.3 Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Type (2020-2031)
5.3 Global Fully Automatic Semiconductor Molding Machine Price by Type (2020-2031)
6 Segment by Application
6.1 Global Fully Automatic Semiconductor Molding Machine Production by Application (2020-2031)
6.1.1 Global Fully Automatic Semiconductor Molding Machine Production by Application (2020-2025)
6.1.2 Global Fully Automatic Semiconductor Molding Machine Production by Application (2026-2031)
6.1.3 Global Fully Automatic Semiconductor Molding Machine Production Market Share by Application (2020-2031)
6.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Application (2020-2031)
6.2.1 Global Fully Automatic Semiconductor Molding Machine Production Value by Application (2020-2025)
6.2.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Application (2026-2031)
6.2.3 Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Application (2020-2031)
6.3 Global Fully Automatic Semiconductor Molding Machine Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Towa
7.1.1 Towa Fully Automatic Semiconductor Molding Machine Company Information
7.1.2 Towa Fully Automatic Semiconductor Molding Machine Product Portfolio
7.1.3 Towa Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Towa Main Business and Markets Served
7.1.5 Towa Recent Developments/Updates
7.2 Besi
7.2.1 Besi Fully Automatic Semiconductor Molding Machine Company Information
7.2.2 Besi Fully Automatic Semiconductor Molding Machine Product Portfolio
7.2.3 Besi Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Besi Main Business and Markets Served
7.2.5 Besi Recent Developments/Updates
7.3 ASMPT
7.3.1 ASMPT Fully Automatic Semiconductor Molding Machine Company Information
7.3.2 ASMPT Fully Automatic Semiconductor Molding Machine Product Portfolio
7.3.3 ASMPT Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.3.4 ASMPT Main Business and Markets Served
7.3.5 ASMPT Recent Developments/Updates
7.4 I-PEX Inc
7.4.1 I-PEX Inc Fully Automatic Semiconductor Molding Machine Company Information
7.4.2 I-PEX Inc Fully Automatic Semiconductor Molding Machine Product Portfolio
7.4.3 I-PEX Inc Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.4.4 I-PEX Inc Main Business and Markets Served
7.4.5 I-PEX Inc Recent Developments/Updates
7.5 Tongling Trinity Technology
7.5.1 Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Company Information
7.5.2 Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Product Portfolio
7.5.3 Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Tongling Trinity Technology Main Business and Markets Served
7.5.5 Tongling Trinity Technology Recent Developments/Updates
7.6 Shanghai Xinsheng
7.6.1 Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Company Information
7.6.2 Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Product Portfolio
7.6.3 Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Shanghai Xinsheng Main Business and Markets Served
7.6.5 Shanghai Xinsheng Recent Developments/Updates
7.7 Mtex Matsumura
7.7.1 Mtex Matsumura Fully Automatic Semiconductor Molding Machine Company Information
7.7.2 Mtex Matsumura Fully Automatic Semiconductor Molding Machine Product Portfolio
7.7.3 Mtex Matsumura Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Mtex Matsumura Main Business and Markets Served
7.7.5 Mtex Matsumura Recent Developments/Updates
7.8 Asahi Engineering
7.8.1 Asahi Engineering Fully Automatic Semiconductor Molding Machine Company Information
7.8.2 Asahi Engineering Fully Automatic Semiconductor Molding Machine Product Portfolio
7.8.3 Asahi Engineering Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Asahi Engineering Main Business and Markets Served
7.8.5 Asahi Engineering Recent Developments/Updates
7.9 Nextool Technology Co., Ltd.
7.9.1 Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Company Information
7.9.2 Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Product Portfolio
7.9.3 Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Nextool Technology Co., Ltd. Main Business and Markets Served
7.9.5 Nextool Technology Co., Ltd. Recent Developments/Updates
7.10 APIC YAMADA
7.10.1 APIC YAMADA Fully Automatic Semiconductor Molding Machine Company Information
7.10.2 APIC YAMADA Fully Automatic Semiconductor Molding Machine Product Portfolio
7.10.3 APIC YAMADA Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.10.4 APIC YAMADA Main Business and Markets Served
7.10.5 APIC YAMADA Recent Developments/Updates
7.11 Suzhou Bopai Semiconductor (Boschman)
7.11.1 Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Company Information
7.11.2 Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Product Portfolio
7.11.3 Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Suzhou Bopai Semiconductor (Boschman) Main Business and Markets Served
7.11.5 Suzhou Bopai Semiconductor (Boschman) Recent Developments/Updates
7.12 Anhui Zhonghe
7.12.1 Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Company Information
7.12.2 Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Product Portfolio
7.12.3 Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Anhui Zhonghe Main Business and Markets Served
7.12.5 Anhui Zhonghe Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Fully Automatic Semiconductor Molding Machine Industry Chain Analysis
8.2 Fully Automatic Semiconductor Molding Machine Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Fully Automatic Semiconductor Molding Machine Production Mode & Process Analysis
8.4 Fully Automatic Semiconductor Molding Machine Sales and Marketing
8.4.1 Fully Automatic Semiconductor Molding Machine Sales Channels
8.4.2 Fully Automatic Semiconductor Molding Machine Distributors
8.5 Fully Automatic Semiconductor Molding Machine Customer Analysis
9 Fully Automatic Semiconductor Molding Machine Market Dynamics
9.1 Fully Automatic Semiconductor Molding Machine Industry Trends
9.2 Fully Automatic Semiconductor Molding Machine Market Drivers
9.3 Fully Automatic Semiconductor Molding Machine Market Challenges
9.4 Fully Automatic Semiconductor Molding Machine Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Towa
Besi
ASMPT
I-PEX Inc
Tongling Trinity Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Anhui Zhonghe
听
听
*If Applicable.