GaN, a wide bandgap semiconductor material featuring high-frequency and low on-resistance, has become the centerpiece in the ongoing revolution of the power semiconductor industry.
In semiconductor industry, there are two models: IDM model and Fabless model.
IDM model enables in-house control of the entire process from design, manufacturing to testing. With an integrated operational framework, the IDM model offers unmatched coordination and synergy while ensuring the quality of power semiconductor products. It provides stable production capacities, enables swift innovation through synergistic design and process iterations and supports cost-effective scaling.
While advanced process technologies significantly enhance digital chip performance, the functionality of analog chips — especially power semiconductor chips — largely hinges on the intrinsic properties of the semiconductor materials employed. Different materials have distinct bandgap, carrier mobility, electrical and thermal conductivity and other properties, resulting in varied performance and applications. As a result, the IDM model, which enables in-house control of the entire process from design, manufacturing to testing, has been the mainstream operational framework in the broader power semiconductor industry. The global top five power semiconductor companies all adopted the IDM model. In the rapidly evolving GaN power semiconductor industry, this model continues to prove to be the most effective.
This report studies the GaN chips design, including the GaN discrete chips and GaN ICs design, including IDM and fabless. the typical IDMs include Innoscience, Infineon (GaN Systems), Wolfspeed, STMicroelectronics, Renesas Electronics (Transphorm), Texas Instruments, Epistar Corp., China Resources Microelectronics Limited, CorEnergy, Dynax Semiconductor, Sanan Optoelectronics, Rohm, etc.
The global GaN Chips Design market was valued at US$ 1926 million in 2023 and is anticipated to reach US$ 5375 million by 2030, witnessing a CAGR of 14.8% during the forecast period 2024-2030.
North American market for GaN Chips Design is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for GaN Chips Design is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for GaN Chips Design in GaN Power Devices is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of GaN Chips Design include Infineon (GaN Systems), STMicroelectronics, Texas Instruments, onsemi, Microchip Technology, Rohm, NXP Semiconductors, Toshiba, Innoscience, Wolfspeed, Inc, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for GaN Chips Design, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding GaN Chips Design.
The GaN Chips Design market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global GaN Chips Design market comprehensively. Regional market sizes, concerning products by Model, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the GaN Chips Design companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Model, by Application, and by regions.
Market Segmentation
By Company
Infineon (GaN Systems)
STMicroelectronics
Texas Instruments
onsemi
Microchip Technology
Rohm
NXP Semiconductors
Toshiba
Innoscience
Wolfspeed, Inc
Renesas Electronics (Transphorm)
Sumitomo Electric Device Innovations (SEDI) (SCIOCS)
Alpha and Omega Semiconductor Limited (AOS)
Nexperia
Epistar Corp.
Qorvo
Navitas Semiconductor
Power Integrations, Inc.
Efficient Power Conversion Corporation (EPC)
MACOM
VisIC Technologies
Cambridge GaN Devices (CGD)
Wise Integration
RFHIC Corporation
Ampleon
GaNext
Chengdu DanXi Technology
Southchip Semiconductor Technology
Panasonic
Toyoda Gosei
China Resources Microelectronics Limited
CorEnergy
Dynax Semiconductor
Sanan Optoelectronics
Hangzhou Silan Microelectronics
Guangdong ZIENER Technology
Nuvoton Technology Corporation
CETC 13
CETC 55
Qingdao Cohenius Microelectronics
Youjia Technology (Suzhou) Co., Ltd
Nanjing Xinkansen Technology
GaNPower
CloudSemi
Shenzhen Taigao Technology
Segment by Model
GaN IDM
GaN Fabless
Segment by Application
GaN Power Devices
GaN RF Devices
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Model, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of GaN Chips Design company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Model, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Model
1.2.1 Global GaN Chips Design Market Size Growth Rate by Model: 2019 VS 2023 VS 2030
1.2.2 GaN IDM
1.2.3 GaN Fabless
1.3 Market by Application
1.3.1 Global GaN Chips Design Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 GaN Power Devices
1.3.3 GaN RF Devices
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global GaN Chips Design Market Perspective (2019-2030)
2.2 Global GaN Chips Design Growth Trends by Region
2.2.1 Global GaN Chips Design Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 GaN Chips Design Historic Market Size by Region (2019-2024)
2.2.3 GaN Chips Design Forecasted Market Size by Region (2025-2030)
2.3 GaN Chips Design Market Dynamics
2.3.1 GaN Chips Design Industry Trends
2.3.2 GaN Chips Design Market Drivers
2.3.3 GaN Chips Design Market Challenges
2.3.4 GaN Chips Design Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top GaN Chips Design Players by Revenue
3.1.1 Global Top GaN Chips Design Players by Revenue (2019-2024)
3.1.2 Global GaN Chips Design Revenue Market Share by Players (2019-2024)
3.2 Global GaN Chips Design Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by GaN Chips Design Revenue
3.4 Global GaN Chips Design Market Concentration Ratio
3.4.1 Global GaN Chips Design Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by GaN Chips Design Revenue in 2023
3.5 Global Key Players of GaN Chips Design Head office and Area Served
3.6 Global Key Players of GaN Chips Design, Product and Application
3.7 Global Key Players of GaN Chips Design, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 GaN Chips Design Breakdown Data by Model
4.1 Global GaN Chips Design Historic Market Size by Model (2019-2024)
4.2 Global GaN Chips Design Forecasted Market Size by Model (2025-2030)
5 GaN Chips Design Breakdown Data by Application
5.1 Global GaN Chips Design Historic Market Size by Application (2019-2024)
5.2 Global GaN Chips Design Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America GaN Chips Design Market Size (2019-2030)
6.2 North America GaN Chips Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America GaN Chips Design Market Size by Country (2019-2024)
6.4 North America GaN Chips Design Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe GaN Chips Design Market Size (2019-2030)
7.2 Europe GaN Chips Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe GaN Chips Design Market Size by Country (2019-2024)
7.4 Europe GaN Chips Design Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific GaN Chips Design Market Size (2019-2030)
8.2 Asia-Pacific GaN Chips Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific GaN Chips Design Market Size by Region (2019-2024)
8.4 Asia-Pacific GaN Chips Design Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America GaN Chips Design Market Size (2019-2030)
9.2 Latin America GaN Chips Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America GaN Chips Design Market Size by Country (2019-2024)
9.4 Latin America GaN Chips Design Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa GaN Chips Design Market Size (2019-2030)
10.2 Middle East & Africa GaN Chips Design Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa GaN Chips Design Market Size by Country (2019-2024)
10.4 Middle East & Africa GaN Chips Design Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Infineon (GaN Systems)
11.1.1 Infineon (GaN Systems) Company Details
11.1.2 Infineon (GaN Systems) Business Overview
11.1.3 Infineon (GaN Systems) GaN Chips Design Introduction
11.1.4 Infineon (GaN Systems) Revenue in GaN Chips Design Business (2019-2024)
11.1.5 Infineon (GaN Systems) Recent Development
11.2 STMicroelectronics
11.2.1 STMicroelectronics Company Details
11.2.2 STMicroelectronics Business Overview
11.2.3 STMicroelectronics GaN Chips Design Introduction
11.2.4 STMicroelectronics Revenue in GaN Chips Design Business (2019-2024)
11.2.5 STMicroelectronics Recent Development
11.3 Texas Instruments
11.3.1 Texas Instruments Company Details
11.3.2 Texas Instruments Business Overview
11.3.3 Texas Instruments GaN Chips Design Introduction
11.3.4 Texas Instruments Revenue in GaN Chips Design Business (2019-2024)
11.3.5 Texas Instruments Recent Development
11.4 onsemi
11.4.1 onsemi Company Details
11.4.2 onsemi Business Overview
11.4.3 onsemi GaN Chips Design Introduction
11.4.4 onsemi Revenue in GaN Chips Design Business (2019-2024)
11.4.5 onsemi Recent Development
11.5 Microchip Technology
11.5.1 Microchip Technology Company Details
11.5.2 Microchip Technology Business Overview
11.5.3 Microchip Technology GaN Chips Design Introduction
11.5.4 Microchip Technology Revenue in GaN Chips Design Business (2019-2024)
11.5.5 Microchip Technology Recent Development
11.6 Rohm
11.6.1 Rohm Company Details
11.6.2 Rohm Business Overview
11.6.3 Rohm GaN Chips Design Introduction
11.6.4 Rohm Revenue in GaN Chips Design Business (2019-2024)
11.6.5 Rohm Recent Development
11.7 NXP Semiconductors
11.7.1 NXP Semiconductors Company Details
11.7.2 NXP Semiconductors Business Overview
11.7.3 NXP Semiconductors GaN Chips Design Introduction
11.7.4 NXP Semiconductors Revenue in GaN Chips Design Business (2019-2024)
11.7.5 NXP Semiconductors Recent Development
11.8 Toshiba
11.8.1 Toshiba Company Details
11.8.2 Toshiba Business Overview
11.8.3 Toshiba GaN Chips Design Introduction
11.8.4 Toshiba Revenue in GaN Chips Design Business (2019-2024)
11.8.5 Toshiba Recent Development
11.9 Innoscience
11.9.1 Innoscience Company Details
11.9.2 Innoscience Business Overview
11.9.3 Innoscience GaN Chips Design Introduction
11.9.4 Innoscience Revenue in GaN Chips Design Business (2019-2024)
11.9.5 Innoscience Recent Development
11.10 Wolfspeed, Inc
11.10.1 Wolfspeed, Inc Company Details
11.10.2 Wolfspeed, Inc Business Overview
11.10.3 Wolfspeed, Inc GaN Chips Design Introduction
11.10.4 Wolfspeed, Inc Revenue in GaN Chips Design Business (2019-2024)
11.10.5 Wolfspeed, Inc Recent Development
11.11 Renesas Electronics (Transphorm)
11.11.1 Renesas Electronics (Transphorm) Company Details
11.11.2 Renesas Electronics (Transphorm) Business Overview
11.11.3 Renesas Electronics (Transphorm) GaN Chips Design Introduction
11.11.4 Renesas Electronics (Transphorm) Revenue in GaN Chips Design Business (2019-2024)
11.11.5 Renesas Electronics (Transphorm) Recent Development
11.12 Sumitomo Electric Device Innovations (SEDI) (SCIOCS)
11.12.1 Sumitomo Electric Device Innovations (SEDI) (SCIOCS) Company Details
11.12.2 Sumitomo Electric Device Innovations (SEDI) (SCIOCS) Business Overview
11.12.3 Sumitomo Electric Device Innovations (SEDI) (SCIOCS) GaN Chips Design Introduction
11.12.4 Sumitomo Electric Device Innovations (SEDI) (SCIOCS) Revenue in GaN Chips Design Business (2019-2024)
11.12.5 Sumitomo Electric Device Innovations (SEDI) (SCIOCS) Recent Development
11.13 Alpha and Omega Semiconductor Limited (AOS)
11.13.1 Alpha and Omega Semiconductor Limited (AOS) Company Details
11.13.2 Alpha and Omega Semiconductor Limited (AOS) Business Overview
11.13.3 Alpha and Omega Semiconductor Limited (AOS) GaN Chips Design Introduction
11.13.4 Alpha and Omega Semiconductor Limited (AOS) Revenue in GaN Chips Design Business (2019-2024)
11.13.5 Alpha and Omega Semiconductor Limited (AOS) Recent Development
11.14 Nexperia
11.14.1 Nexperia Company Details
11.14.2 Nexperia Business Overview
11.14.3 Nexperia GaN Chips Design Introduction
11.14.4 Nexperia Revenue in GaN Chips Design Business (2019-2024)
11.14.5 Nexperia Recent Development
11.15 Epistar Corp.
11.15.1 Epistar Corp. Company Details
11.15.2 Epistar Corp. Business Overview
11.15.3 Epistar Corp. GaN Chips Design Introduction
11.15.4 Epistar Corp. Revenue in GaN Chips Design Business (2019-2024)
11.15.5 Epistar Corp. Recent Development
11.16 Qorvo
11.16.1 Qorvo Company Details
11.16.2 Qorvo Business Overview
11.16.3 Qorvo GaN Chips Design Introduction
11.16.4 Qorvo Revenue in GaN Chips Design Business (2019-2024)
11.16.5 Qorvo Recent Development
11.17 Navitas Semiconductor
11.17.1 Navitas Semiconductor Company Details
11.17.2 Navitas Semiconductor Business Overview
11.17.3 Navitas Semiconductor GaN Chips Design Introduction
11.17.4 Navitas Semiconductor Revenue in GaN Chips Design Business (2019-2024)
11.17.5 Navitas Semiconductor Recent Development
11.18 Power Integrations, Inc.
11.18.1 Power Integrations, Inc. Company Details
11.18.2 Power Integrations, Inc. Business Overview
11.18.3 Power Integrations, Inc. GaN Chips Design Introduction
11.18.4 Power Integrations, Inc. Revenue in GaN Chips Design Business (2019-2024)
11.18.5 Power Integrations, Inc. Recent Development
11.19 Efficient Power Conversion Corporation (EPC)
11.19.1 Efficient Power Conversion Corporation (EPC) Company Details
11.19.2 Efficient Power Conversion Corporation (EPC) Business Overview
11.19.3 Efficient Power Conversion Corporation (EPC) GaN Chips Design Introduction
11.19.4 Efficient Power Conversion Corporation (EPC) Revenue in GaN Chips Design Business (2019-2024)
11.19.5 Efficient Power Conversion Corporation (EPC) Recent Development
11.20 MACOM
11.20.1 MACOM Company Details
11.20.2 MACOM Business Overview
11.20.3 MACOM GaN Chips Design Introduction
11.20.4 MACOM Revenue in GaN Chips Design Business (2019-2024)
11.20.5 MACOM Recent Development
11.21 VisIC Technologies
11.21.1 VisIC Technologies Company Details
11.21.2 VisIC Technologies Business Overview
11.21.3 VisIC Technologies GaN Chips Design Introduction
11.21.4 VisIC Technologies Revenue in GaN Chips Design Business (2019-2024)
11.21.5 VisIC Technologies Recent Development
11.22 Cambridge GaN Devices (CGD)
11.22.1 Cambridge GaN Devices (CGD) Company Details
11.22.2 Cambridge GaN Devices (CGD) Business Overview
11.22.3 Cambridge GaN Devices (CGD) GaN Chips Design Introduction
11.22.4 Cambridge GaN Devices (CGD) Revenue in GaN Chips Design Business (2019-2024)
11.22.5 Cambridge GaN Devices (CGD) Recent Development
11.23 Wise Integration
11.23.1 Wise Integration Company Details
11.23.2 Wise Integration Business Overview
11.23.3 Wise Integration GaN Chips Design Introduction
11.23.4 Wise Integration Revenue in GaN Chips Design Business (2019-2024)
11.23.5 Wise Integration Recent Development
11.24 RFHIC Corporation
11.24.1 RFHIC Corporation Company Details
11.24.2 RFHIC Corporation Business Overview
11.24.3 RFHIC Corporation GaN Chips Design Introduction
11.24.4 RFHIC Corporation Revenue in GaN Chips Design Business (2019-2024)
11.24.5 RFHIC Corporation Recent Development
11.25 Ampleon
11.25.1 Ampleon Company Details
11.25.2 Ampleon Business Overview
11.25.3 Ampleon GaN Chips Design Introduction
11.25.4 Ampleon Revenue in GaN Chips Design Business (2019-2024)
11.25.5 Ampleon Recent Development
11.26 GaNext
11.26.1 GaNext Company Details
11.26.2 GaNext Business Overview
11.26.3 GaNext GaN Chips Design Introduction
11.26.4 GaNext Revenue in GaN Chips Design Business (2019-2024)
11.26.5 GaNext Recent Development
11.27 Chengdu DanXi Technology
11.27.1 Chengdu DanXi Technology Company Details
11.27.2 Chengdu DanXi Technology Business Overview
11.27.3 Chengdu DanXi Technology GaN Chips Design Introduction
11.27.4 Chengdu DanXi Technology Revenue in GaN Chips Design Business (2019-2024)
11.27.5 Chengdu DanXi Technology Recent Development
11.28 Southchip Semiconductor Technology
11.28.1 Southchip Semiconductor Technology Company Details
11.28.2 Southchip Semiconductor Technology Business Overview
11.28.3 Southchip Semiconductor Technology GaN Chips Design Introduction
11.28.4 Southchip Semiconductor Technology Revenue in GaN Chips Design Business (2019-2024)
11.28.5 Southchip Semiconductor Technology Recent Development
11.29 Panasonic
11.29.1 Panasonic Company Details
11.29.2 Panasonic Business Overview
11.29.3 Panasonic GaN Chips Design Introduction
11.29.4 Panasonic Revenue in GaN Chips Design Business (2019-2024)
11.29.5 Panasonic Recent Development
11.30 Toyoda Gosei
11.30.1 Toyoda Gosei Company Details
11.30.2 Toyoda Gosei Business Overview
11.30.3 Toyoda Gosei GaN Chips Design Introduction
11.30.4 Toyoda Gosei Revenue in GaN Chips Design Business (2019-2024)
11.30.5 Toyoda Gosei Recent Development
11.31 China Resources Microelectronics Limited
11.31.1 China Resources Microelectronics Limited Company Details
11.31.2 China Resources Microelectronics Limited Business Overview
11.31.3 China Resources Microelectronics Limited GaN Chips Design Introduction
11.31.4 China Resources Microelectronics Limited Revenue in GaN Chips Design Business (2019-2024)
11.31.5 China Resources Microelectronics Limited Recent Development
11.32 CorEnergy
11.32.1 CorEnergy Company Details
11.32.2 CorEnergy Business Overview
11.32.3 CorEnergy GaN Chips Design Introduction
11.32.4 CorEnergy Revenue in GaN Chips Design Business (2019-2024)
11.32.5 CorEnergy Recent Development
11.33 Dynax Semiconductor
11.33.1 Dynax Semiconductor Company Details
11.33.2 Dynax Semiconductor Business Overview
11.33.3 Dynax Semiconductor GaN Chips Design Introduction
11.33.4 Dynax Semiconductor Revenue in GaN Chips Design Business (2019-2024)
11.33.5 Dynax Semiconductor Recent Development
11.34 Sanan Optoelectronics
11.34.1 Sanan Optoelectronics Company Details
11.34.2 Sanan Optoelectronics Business Overview
11.34.3 Sanan Optoelectronics GaN Chips Design Introduction
11.34.4 Sanan Optoelectronics Revenue in GaN Chips Design Business (2019-2024)
11.34.5 Sanan Optoelectronics Recent Development
11.35 Hangzhou Silan Microelectronics
11.35.1 Hangzhou Silan Microelectronics Company Details
11.35.2 Hangzhou Silan Microelectronics Business Overview
11.35.3 Hangzhou Silan Microelectronics GaN Chips Design Introduction
11.35.4 Hangzhou Silan Microelectronics Revenue in GaN Chips Design Business (2019-2024)
11.35.5 Hangzhou Silan Microelectronics Recent Development
11.36 Guangdong ZIENER Technology
11.36.1 Guangdong ZIENER Technology Company Details
11.36.2 Guangdong ZIENER Technology Business Overview
11.36.3 Guangdong ZIENER Technology GaN Chips Design Introduction
11.36.4 Guangdong ZIENER Technology Revenue in GaN Chips Design Business (2019-2024)
11.36.5 Guangdong ZIENER Technology Recent Development
11.37 Nuvoton Technology Corporation
11.37.1 Nuvoton Technology Corporation Company Details
11.37.2 Nuvoton Technology Corporation Business Overview
11.37.3 Nuvoton Technology Corporation GaN Chips Design Introduction
11.37.4 Nuvoton Technology Corporation Revenue in GaN Chips Design Business (2019-2024)
11.37.5 Nuvoton Technology Corporation Recent Development
11.38 CETC 13
11.38.1 CETC 13 Company Details
11.38.2 CETC 13 Business Overview
11.38.3 CETC 13 GaN Chips Design Introduction
11.38.4 CETC 13 Revenue in GaN Chips Design Business (2019-2024)
11.38.5 CETC 13 Recent Development
11.39 CETC 55
11.39.1 CETC 55 Company Details
11.39.2 CETC 55 Business Overview
11.39.3 CETC 55 GaN Chips Design Introduction
11.39.4 CETC 55 Revenue in GaN Chips Design Business (2019-2024)
11.39.5 CETC 55 Recent Development
11.40 Qingdao Cohenius Microelectronics
11.40.1 Qingdao Cohenius Microelectronics Company Details
11.40.2 Qingdao Cohenius Microelectronics Business Overview
11.40.3 Qingdao Cohenius Microelectronics GaN Chips Design Introduction
11.40.4 Qingdao Cohenius Microelectronics Revenue in GaN Chips Design Business (2019-2024)
11.40.5 Qingdao Cohenius Microelectronics Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
Infineon (GaN Systems)
STMicroelectronics
Texas Instruments
onsemi
Microchip Technology
Rohm
NXP Semiconductors
Toshiba
Innoscience
Wolfspeed, Inc
Renesas Electronics (Transphorm)
Sumitomo Electric Device Innovations (SEDI) (SCIOCS)
Alpha and Omega Semiconductor Limited (AOS)
Nexperia
Epistar Corp.
Qorvo
Navitas Semiconductor
Power Integrations, Inc.
Efficient Power Conversion Corporation (EPC)
MACOM
VisIC Technologies
Cambridge GaN Devices (CGD)
Wise Integration
RFHIC Corporation
Ampleon
GaNext
Chengdu DanXi Technology
Southchip Semiconductor Technology
Panasonic
Toyoda Gosei
China Resources Microelectronics Limited
CorEnergy
Dynax Semiconductor
Sanan Optoelectronics
Hangzhou Silan Microelectronics
Guangdong ZIENER Technology
Nuvoton Technology Corporation
CETC 13
CETC 55
Qingdao Cohenius Microelectronics
Youjia Technology (Suzhou) Co., Ltd
Nanjing Xinkansen Technology
GaNPower
CloudSemi
Shenzhen Taigao Technology
Ìý
Ìý
*If Applicable.
