Glass substrates are increasingly being utilized in chip scale packages (CSP) due to their unique properties that offer significant advantages over traditional materials like silicon and organic substrates. Glass substrates have a low coefficient of thermal expansion (CTE), closely matching that of silicon. This reduces stress and potential failure due to thermal cycling, enhancing the reliability of the package.
The global Glass Substrate for Chip Scale Package market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Glass Substrate for Chip Scale Package is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Glass Substrate for Chip Scale Package is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Glass Substrate for Chip Scale Package include Dai Nippon Printing Co., Ltd., Corning, SCHOTT Glass, RENA Technologies, TECNISCO, LTD., Samtec, WG Tech, Leaman, Hubei W-olf Photoelectric Technology Co., Ltd., AGC, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Glass Substrate for Chip Scale Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Glass Substrate for Chip Scale Package.
The Glass Substrate for Chip Scale Package market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Glass Substrate for Chip Scale Package market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Glass Substrate for Chip Scale Package manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Dai Nippon Printing Co., Ltd.
Corning
SCHOTT Glass
RENA Technologies
TECNISCO, LTD.
Samtec
WG Tech
Leaman
Hubei W-olf Photoelectric Technology Co., Ltd.
AGC
by Type
Small Size
Medium Size
Large Size
by Application
2.5D/3D Wafer Level Packaging
MEMS Sensor
RF Devices
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Glass Substrate for Chip Scale Package manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Glass Substrate for Chip Scale Package by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Glass Substrate for Chip Scale Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Glass Substrate for Chip Scale Package Market Overview
1.1 Product Definition
1.2 Glass Substrate for Chip Scale Package by Type
1.2.1 Global Glass Substrate for Chip Scale Package Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Small Size
1.2.3 Medium Size
1.2.4 Large Size
1.3 Glass Substrate for Chip Scale Package by Application
1.3.1 Global Glass Substrate for Chip Scale Package Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 2.5D/3D Wafer Level Packaging
1.3.3 MEMS Sensor
1.3.4 RF Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Glass Substrate for Chip Scale Package Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Glass Substrate for Chip Scale Package Production Estimates and Forecasts (2019-2030)
1.4.4 Global Glass Substrate for Chip Scale Package Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Glass Substrate for Chip Scale Package Production Market Share by Manufacturers (2019-2024)
2.2 Global Glass Substrate for Chip Scale Package Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Glass Substrate for Chip Scale Package, Industry Ranking, 2022 VS 2023
2.4 Global Glass Substrate for Chip Scale Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Glass Substrate for Chip Scale Package Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Glass Substrate for Chip Scale Package, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Glass Substrate for Chip Scale Package, Product Type & Application
2.8 Global Key Manufacturers of Glass Substrate for Chip Scale Package, Date of Enter into This Industry
2.9 Global Glass Substrate for Chip Scale Package Market Competitive Situation and Trends
2.9.1 Global Glass Substrate for Chip Scale Package Market Concentration Rate
2.9.2 Global 5 and 10 Largest Glass Substrate for Chip Scale Package Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Glass Substrate for Chip Scale Package Production by Region
3.1 Global Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Glass Substrate for Chip Scale Package Production Value by Region (2019-2030)
3.2.1 Global Glass Substrate for Chip Scale Package Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Glass Substrate for Chip Scale Package by Region (2025-2030)
3.3 Global Glass Substrate for Chip Scale Package Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Glass Substrate for Chip Scale Package Production by Region (2019-2030)
3.4.1 Global Glass Substrate for Chip Scale Package Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Glass Substrate for Chip Scale Package by Region (2025-2030)
3.5 Global Glass Substrate for Chip Scale Package Market Price Analysis by Region (2019-2024)
3.6 Global Glass Substrate for Chip Scale Package Production and Value, Year-over-Year Growth
3.6.1 North America Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Glass Substrate for Chip Scale Package Production Value Estimates and Forecasts (2019-2030)
4 Glass Substrate for Chip Scale Package Consumption by Region
4.1 Global Glass Substrate for Chip Scale Package Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Glass Substrate for Chip Scale Package Consumption by Region (2019-2030)
4.2.1 Global Glass Substrate for Chip Scale Package Consumption by Region (2019-2030)
4.2.2 Global Glass Substrate for Chip Scale Package Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Glass Substrate for Chip Scale Package Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Glass Substrate for Chip Scale Package Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Glass Substrate for Chip Scale Package Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Glass Substrate for Chip Scale Package Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Glass Substrate for Chip Scale Package Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Glass Substrate for Chip Scale Package Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Glass Substrate for Chip Scale Package Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Glass Substrate for Chip Scale Package Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Glass Substrate for Chip Scale Package Production by Type (2019-2030)
5.1.1 Global Glass Substrate for Chip Scale Package Production by Type (2019-2024)
5.1.2 Global Glass Substrate for Chip Scale Package Production by Type (2025-2030)
5.1.3 Global Glass Substrate for Chip Scale Package Production Market Share by Type (2019-2030)
5.2 Global Glass Substrate for Chip Scale Package Production Value by Type (2019-2030)
5.2.1 Global Glass Substrate for Chip Scale Package Production Value by Type (2019-2024)
5.2.2 Global Glass Substrate for Chip Scale Package Production Value by Type (2025-2030)
5.2.3 Global Glass Substrate for Chip Scale Package Production Value Market Share by Type (2019-2030)
5.3 Global Glass Substrate for Chip Scale Package Price by Type (2019-2030)
6 Segment by Application
6.1 Global Glass Substrate for Chip Scale Package Production by Application (2019-2030)
6.1.1 Global Glass Substrate for Chip Scale Package Production by Application (2019-2024)
6.1.2 Global Glass Substrate for Chip Scale Package Production by Application (2025-2030)
6.1.3 Global Glass Substrate for Chip Scale Package Production Market Share by Application (2019-2030)
6.2 Global Glass Substrate for Chip Scale Package Production Value by Application (2019-2030)
6.2.1 Global Glass Substrate for Chip Scale Package Production Value by Application (2019-2024)
6.2.2 Global Glass Substrate for Chip Scale Package Production Value by Application (2025-2030)
6.2.3 Global Glass Substrate for Chip Scale Package Production Value Market Share by Application (2019-2030)
6.3 Global Glass Substrate for Chip Scale Package Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Dai Nippon Printing Co., Ltd.
7.1.1 Dai Nippon Printing Co., Ltd. Glass Substrate for Chip Scale Package Company Information
7.1.2 Dai Nippon Printing Co., Ltd. Glass Substrate for Chip Scale Package Product Portfolio
7.1.3 Dai Nippon Printing Co., Ltd. Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Dai Nippon Printing Co., Ltd. Main Business and Markets Served
7.1.5 Dai Nippon Printing Co., Ltd. Recent Developments/Updates
7.2 Corning
7.2.1 Corning Glass Substrate for Chip Scale Package Company Information
7.2.2 Corning Glass Substrate for Chip Scale Package Product Portfolio
7.2.3 Corning Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Corning Main Business and Markets Served
7.2.5 Corning Recent Developments/Updates
7.3 SCHOTT Glass
7.3.1 SCHOTT Glass Glass Substrate for Chip Scale Package Company Information
7.3.2 SCHOTT Glass Glass Substrate for Chip Scale Package Product Portfolio
7.3.3 SCHOTT Glass Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.3.4 SCHOTT Glass Main Business and Markets Served
7.3.5 SCHOTT Glass Recent Developments/Updates
7.4 RENA Technologies
7.4.1 RENA Technologies Glass Substrate for Chip Scale Package Company Information
7.4.2 RENA Technologies Glass Substrate for Chip Scale Package Product Portfolio
7.4.3 RENA Technologies Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.4.4 RENA Technologies Main Business and Markets Served
7.4.5 RENA Technologies Recent Developments/Updates
7.5 TECNISCO, LTD.
7.5.1 TECNISCO, LTD. Glass Substrate for Chip Scale Package Company Information
7.5.2 TECNISCO, LTD. Glass Substrate for Chip Scale Package Product Portfolio
7.5.3 TECNISCO, LTD. Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.5.4 TECNISCO, LTD. Main Business and Markets Served
7.5.5 TECNISCO, LTD. Recent Developments/Updates
7.6 Samtec
7.6.1 Samtec Glass Substrate for Chip Scale Package Company Information
7.6.2 Samtec Glass Substrate for Chip Scale Package Product Portfolio
7.6.3 Samtec Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Samtec Main Business and Markets Served
7.6.5 Samtec Recent Developments/Updates
7.7 WG Tech
7.7.1 WG Tech Glass Substrate for Chip Scale Package Company Information
7.7.2 WG Tech Glass Substrate for Chip Scale Package Product Portfolio
7.7.3 WG Tech Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.7.4 WG Tech Main Business and Markets Served
7.7.5 WG Tech Recent Developments/Updates
7.8 Leaman
7.8.1 Leaman Glass Substrate for Chip Scale Package Company Information
7.8.2 Leaman Glass Substrate for Chip Scale Package Product Portfolio
7.8.3 Leaman Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Leaman Main Business and Markets Served
7.8.5 Leaman Recent Developments/Updates
7.9 Hubei W-olf Photoelectric Technology Co., Ltd.
7.9.1 Hubei W-olf Photoelectric Technology Co., Ltd. Glass Substrate for Chip Scale Package Company Information
7.9.2 Hubei W-olf Photoelectric Technology Co., Ltd. Glass Substrate for Chip Scale Package Product Portfolio
7.9.3 Hubei W-olf Photoelectric Technology Co., Ltd. Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Hubei W-olf Photoelectric Technology Co., Ltd. Main Business and Markets Served
7.9.5 Hubei W-olf Photoelectric Technology Co., Ltd. Recent Developments/Updates
7.10 AGC
7.10.1 AGC Glass Substrate for Chip Scale Package Company Information
7.10.2 AGC Glass Substrate for Chip Scale Package Product Portfolio
7.10.3 AGC Glass Substrate for Chip Scale Package Production, Value, Price and Gross Margin (2019-2024)
7.10.4 AGC Main Business and Markets Served
7.10.5 AGC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Glass Substrate for Chip Scale Package Industry Chain Analysis
8.2 Glass Substrate for Chip Scale Package Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Glass Substrate for Chip Scale Package Production Mode & Process
8.4 Glass Substrate for Chip Scale Package Sales and Marketing
8.4.1 Glass Substrate for Chip Scale Package Sales Channels
8.4.2 Glass Substrate for Chip Scale Package Distributors
8.5 Glass Substrate for Chip Scale Package Customers
9 Glass Substrate for Chip Scale Package Market Dynamics
9.1 Glass Substrate for Chip Scale Package Industry Trends
9.2 Glass Substrate for Chip Scale Package Market Drivers
9.3 Glass Substrate for Chip Scale Package Market Challenges
9.4 Glass Substrate for Chip Scale Package Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Dai Nippon Printing Co., Ltd.
Corning
SCHOTT Glass
RENA Technologies
TECNISCO, LTD.
Samtec
WG Tech
Leaman
Hubei W-olf Photoelectric Technology Co., Ltd.
AGC
听
听
*If Applicable.
